DE19705934A1 - Method of inserting wire-shaped conductor parts into thermoplastic substrate, such as for chipcard - Google Patents

Abstract

The method involves inserting the conductor parts (1) into the substrate (2) by softening the thermoplastic layer by heating and pressing it in with a tool (3). The conductor part to be pressed in beneath the tool is heated to a temp. above the softening temp. of the thermoplastic layer. The tool is simultaneously moved in a predefined pattern. The temp. of the conductor part beneath the tool in the region of the substrate into which it is not to be pushed is reduced to a temp. below the softening temp.

Description

The invention relates to a method and an apparatus for introduction of wire-shaped conductor pieces in a thermoplastic substrate or in the thermoplastic layer of a substrate, in which the conductor piece on laid the thermoplastic layer and at least with it connected by heating the conductor piece and by pressing becomes.

Devices of the type mentioned above are used for introducing conductors pieces, especially for inserting wires into thermoplastic Body or in bodies provided with thermoplastic layers used. These bodies can have any shape. she only need one for the insertion tool at right angles to the press-in have freely accessible direction. This can be flat bodies, for example chip card substrates and the like, as well as cylinders, Be cones, bodies with bevels and the like.  

According to US Pat. No. 3,674,602, a device is known in which a heated t, U-shaped, open tool an insulated wire leads, the fork-like leg ends of the tool Warm and raise the thermoplastic layer, at the same time the warmed wire slightly pressed into the thermoplastic layer and finally, the thermoplastic layer raised is at least of pressed against the wire on both sides. Through relative movement between heated tool and holder with the thermoplastic Any desired line pattern is created on the substrate. The Device includes one that acts perpendicular to the substrate surface Knife for cutting the wire after the generation of the Line pattern. The insertion of the insulated wire into the substrate can be supported by ultrasonic excitation of the tool or only ultrasonic energy can be used.

A disadvantage of the device is that the wire is not smooth and flush in the substrate can be laid, but in "raised" furrows is held. Another disadvantage is that the wire press tool or the U-shaped opening is always directed towards the wire laying axis have to be. This means that the wire press tool head and the wire guide always rotated in the direction of the specified laying pattern must be, which has a high expenditure on equipment.

Another disadvantage is that at the beginning of the laying process the wire catch with another device or be contacted must and that a precise height control of the wire press tool is necessary, the tool should stand still or slow Do not press the relative movement too deep into the thermoplastic substrate.  

The introduction of wire-shaped electrical and / or optical conductors in a substrate is commonly referred to in the literature as wire writing or Called wire laying.

The general difficulty in laying the wires is the Fix the starting point of the wire and immediately afterwards the wire continue laying according to the given pattern, because at the starting point is the thermoplastic layer also in a soft state.

In FR 79 24 290, therefore, a device is specified that the wire on Solder the starting point to an existing post. The disadvantage is that There must be a post at the starting point.

DE 36 24 627 specifies a method according to which the wire is a Adhesion promoter layer that is only worn during or immediately before laying gene is converted into an adhesive state by means of pulsed radiation and then immediately returns to the non-stick state. A disadvantage here is that the wire needs an adhesion promoter layer and that the wire must be heated by pulsed radiation.

Generally, the wire is passed through after the laying is complete wedge-shaped knives (US 3,674,602; US 4,619,397 and US 5,365,657), by electrical voltage (DE 30 35 071) or by a wedge-shaped Projection on the laying tool (US 4,415,115) separately. A disadvantage of The above arrangements and methods is that the separator only for cutting the wire at the end of the installation process can be used and the start of the laying process not support.  

According to DE 43 25 334 A1 is a device for producing a coil winding from winding wire on a winding support with a Having wire guide device, relative to the winding carrier Movable winding head known in which the wire at its kinks under pressure and temperature effects in the substrate surface will melt. The melting takes place by means of so-called Thermocompression or ultrasound.

A disadvantage of this method is that the wire is only in parts in the substrate is introduced. Another disadvantage is that in particular Press in using ultrasound-resistant substrate holders are necessary, which control the introduction of energy during pressing enable only with considerable effort. Another disadvantage is that the thermal energy on the piece of wire to be laid cannot be controlled.

Finally, according to DE 44 10 732, a method for producing a Chip card and a chip card known in which the manufacture of the coil by laying the wire on the substrate as well as connecting the Coil wire ends with the pads of a chip on the substrate respectively. A disadvantage of the method is that the wire laying method and Establishing a connection with the chip takes place directly with one another. Another disadvantage is that the relocation point and the termination of the Are linked to the chip connection.

The invention has for its object a method and a Vorrich device for introducing electrical conductor pieces into a substrate ben, with the continuous pressing of the conductor piece into the substrate  is made possible with little effort and high accuracy and at both the start of the introduction and the completion of the introduction is possible with high productivity and little technical effort.

According to the invention, this problem is solved by a method in which the substrate has at least one thermoplastic layer has, into which a wire-shaped conductor piece by means of an indentation stuff, which has a press-in foot in the lower area, introduced is, the respective conductor piece under the press-in foot during Is impressed heated to a temperature above the Softening temperature of the thermoplastic layer is and where the Press-in foot at the same time relative to the substrate according to a predetermined Pattern is shifted and with the ladder piece under the presser foot in the areas of the substrate where it is not in the thermoplastic Layer should be indented to temperatures below the Erwei chung temperature of the thermoplastic layer is maintained and wherein the force exerted on the presser foot with increasing wire diameter er and with increasing displacement speed of the insertion tool foot ßes is increased.

It is advantageous to rotate the insertion tool and the insertion foot To be designed and reduced symmetrically with increasing ladder section temperature and to be provided with an axial bore. This results in the possibility of the wire-shaped conductor piece through the central axis of the Feeding tool and the conductor piece in any direction  to lay or press in under the presser foot without the Need to turn the presser foot in the direction of movement.

It is also advantageous to use the press tool made of hard metal or extremely strong, thermally conductive ceramic, e.g. B. high-purity aluminum xid ceramics. So that is a good heat conduction from that Given the tool to the wire-shaped conductor piece and the tool also has a long service life.

It is also advantageous to heat the indentation tool and the indentation tool to heat up the conductor section under the press-in foot. In particular when using indirect electrical heating of the The tool temperature can be changed with simple means and thus depending on the material of the thermoplastic layer, Dimension and material of the wire-shaped conductor piece, pressure and Relative speed of the press tool to the substrate Pushing the conductor piece into a predetermined pattern on the Control the temperature of the conductor section under the tool base be recognized.

To increase the cooling speed of the tool base and for immediate setting of a conductor section temperature below the exp point of the thermoplastic at the locations of the substrate which the conductor piece is not pressed into the thermoplastic layer should be, e.g. B. at the end point of the line pattern, it is advantageous Tool foot by compressed gas flows, e.g. B. air or nitrogen flows Extract heat and so the conductor piece under and next to the Cool the tool base.  

It is also advantageous to design the tool base so that the pressure area of the wire is as small as possible and that the inner radius of the Tool foot is designed depending on the wire diameter so that the conductor piece is pulled out of the tool horizontally abuts the inner radius.

This ensures that the conductor piece opens up very quickly is heated and on the other hand releases little energy to the substrate.

It is also advantageous to close the foot surface including the inner radius polish in order to exert only slight tensile forces on the conductor section.

Furthermore, it can be advantageous when using an electrically conductive Ceramic as a tool base to heat it directly electrically.

There is another design option for tool heating therein, the tool by short-wave electromagnetic radiation, for. B. to be heated by laser radiation. As a result, the heating or Cooling speed of the tool base compared to the indirect one Heating can be increased.

Furthermore, it is beneficial for achieving a high dynamic when heating up zen or cooling the respective conductor pieces to be laid through them Applying electrical voltage to heat up directly. It is for that advantageous to design the tool base as an electrode and over the Tool base to attach a counter electrode, the wire-shaped electrical conductor piece led from the counter electrode to the foot electrode and the area of the electrical conductor piece that is is located between the counter electrode and press-in foot, via the contact surface surface of the press-in foot and the counter electrode due to the with simple means controllable electrical voltage or controllable Electricity is heated.  

It is also possible, in addition to the press-in tool, in its axial direction tion acting clamping piece and also in its axial direction to arrange acting wedge-shaped cutting edge, so that the clamping piece between the press tool and the cutting edge tangential to it is arranged. Advantageously, the clamping piece and cutting edges piece each adjustable with respect to spring force on one another horizontal slide easily movable parallel to the substrate surface arranged, the carriage on the receiving device for the holding tion of the press tool is attached.

Furthermore, it was possible to pull the horizontal slide out with the there clamping piece and cutting piece in the direction of the press-in tool back into the starting position by means of a return device to classify. This arrangement ensures that the starting point and the End point is defined when laying a conductor pattern, without additional funds and without the beginning or / and the end of the wire-capable conductor piece soldered through stuck, glued or fixed in some other way.

Advantageous embodiments of the method and the device are shown in specified in the subclaims.

The process is used to process silver-plated copper wires, both have good mechanical as well as good RF and contact properties, particularly suitable.

The method and the device according to the invention are distinguished by a number of advantages:
The device according to the invention consists of a few, relatively easy and uncomplicated to produce individual parts.

The starting position and the end piece position of the line pattern is without further Aids can be defined.

The electrical conductor can be pressed in continuously can also be interrupted in any sections.

The energy required to insert the conductor piece is very low and can easily and through the electrical power can be controlled with high accuracy. It can preferably be silver plated Copper wire are used, the ideal conductor properties and the same has excellent RF properties at the time and also has a contact animals with the active and passive electronic components in enables simple way.

Compared to the methods known in the prior art, in which Thermocompression or ultrasound devices have been used advantageous that no ultrasound-resistant suspension is required that elaborate facilities for ultrasound generation and corresponding There are no tools. The simple, dynamic control of the energy input when pressing in the conductor piece and avoiding acoustic waves in the substrate.

The invention is explained in more detail using two exemplary embodiments tert. In the accompanying drawings:  

Fig. 1 shows a section through an indirectly heated rotationally symmetrical indentation for the insertion of wire in a thermoplastic substrate,

Fig. 2 position a section through the arrangement according to the invention in starting,

Fig. 3 is a section through the inventive arrangement for the end of the starting phase,

Fig. 4 is a section through the arrangement according to the invention during wire insertion,

Fig. 5 shows a section through the arrangement according to the invention at the end of the conductor wire pattern to be inserted and

Fig. 6 shows a section through a rotationally symmetrical indentation tool with an insulating inner sleeve for inserting directly heated wire.

The exemplary embodiments describe the introduction of a metallic bare conductor piece, preferably a silver-plated copper wire.

In Fig. 1, the wire 2 is guided through the thread opening 8 of the press tool 3 under the press tool foot 4 . The Eindrückwerk zeugfuß 4 is heated by electric heating coils 6 indirectly via the softening temperature of the thermoplastic layer 1, and presses the wire 2 in the thermoplastic substrate layer 1 a. The tool base 4 has an inner radius 7 adapted to the diameter of the wire 2 , the transition from inner radius 7 to the thread opening 8 simultaneously being the narrowest point of the axial insertion tool bore, the waist 23 . The Druckgaszufüh tion 5 is directed to the tool base 4 . The compressed gas is switched on via solenoid valves, not shown here, if required.

A plurality of pressurized gas supply lines 5 can be arranged around the tool base 4 , which feed lines can be switched on separately if necessary. To support the cooling of the already pressed-in wire piece 2 , it must be cooled separately with compressed gas. The insertion tool 3 is fixedly connected to the holding device 11 , which in turn is connected to the holding device 13 via the vertically movable slide 12 . The vertical slide is loaded with a variable pressure force F 25 . A wire wrench 14 is fastened to the holding device 11 above the insertion tool 3 , through which the wire 2 is guided in the direction of the waist 23 and the tool foot 4 .

On the underside of the receiving device 13 there is a horizontal slide 18 which is connected to a return device 19 , in the example a pneumatic cylinder, via a linkage. Under sides of the horizontal slide 18 directly a rectangular clamping piece next to the indentation 3 and 15 immediately adjacent a cutting portion 16 are separately arranged and spring-mounted. The width of the clamping piece 15 and the cutting piece 16 approximately coincide with the size of the diameter of the insertion tool 3 .

In the starting position shown in FIG. 2, the unheated clamping piece 15 clamps the end of the wire 2 against the surface of the substrate 1 . At the same time, the cutting edge of the cutting piece 16 is pressed into the locking point 17 in the thermoplastic layer 1 . The wire 2 is heated below the insertion tool foot 4 by the clamping piece 15 above the softening temperature of the thermoplastic layer 1 and pressed into the thermoplastic layer.

At the same time, as shown in FIG. 3, the receiving device 13 moves in the opposite direction to the extension direction of the horizontal slide 18 . With the receiving device 13, the pressing tool 3 is pulled over the thermoplastic substrate layer 1, the wire 2 is thereby continuously withdrawn from the indentation 3 and pressed by the tool foot 4 in the thermoplastic layer 1 continuously to the variable pressure force F 25th The horizontal slide 18 remains because of the Fixie tion of the cutting piece 16 at the locking point 17 . The clamping piece 15 continues to clamp the beginning of the wire 2 .

To overcome the friction of the return device 19 and the horizontal slide 18 drawn in , the pneumatic cylinder of the return device 19 can be pressurized so that the sliding out of the horizontal slide 20 is supported.

Fig. 4 shows the end of the start phase. After a certain length of wire, which in Example 10. . . Is 15 mm, securely inserted into the thermoplastic layer 1 and sufficiently anchored in it, the device 13 lifts; 21 as far from the substrate 1 that the clamping piece 15 and the cutting piece 16 are approximately 1. . . 13 mm above the substrate surface 1 , but the press-in tool foot 4 continues to press the wire 2 into the substrate 1 . The receiving device 13 ; 21 can now use the tool 4 to place or press any wire pattern on or into the substrate 2 . Here or shortly before the end of the wire insertion, the horizontal slide 20 which is pulled out is moved back into the retracted position 18 by the pneumatic return device 19 .

In FIG. 5, the arrangement according to the invention is shown during the final phase.

Shortly before the wire pattern lay in the substrate 1 , the output of the heater 6 was reduced and the cooling gas flow 5 directed onto the tool foot 4 was switched on. The wire 2 no longer reaches the temperature required to soften and sink the substrate layer 1 . The receiving device 13 is lowered. The cutting piece 16 notches the wire 2 , the clamping piece 15 presses the wire 2 against the substrate 1 . At the same time, the wire cutters 14 close. This ensures that the wire 2 is cleanly separated and at the same time for the pressing or laying of a further wire pattern, a wire end of a defined position and length is formed and is held in a constant position with the insertion tool 3 by the wire cutters 14 . After lifting the receiving device 13 and moving and lowering at the next starting point, the next wire pattern can be pressed into the substrate layer 1 .

Fig. 6 shows the insertion tool 3 and the counter electrode 10 for a case in which the wire 2 is heated by direct heating 24 of the wire 2 to a temperature above the softening temperature of the thermoplastic substrate layer 1 . The wire 2 is looped around a scheibenför shaped, easily rotatable, electrically conductive counterelectrode 10 and then passed through the thread opening 8 of a rotationally symmetrical insertion tool 3 under its tool base 4 . The outer tool base 4 is electrically conductive. Inside the insertion tool 3 is the inner sleeve 9 , which is designed as an electrically and thermally insulating layer. It is preferably made of wear-resistant ceramic. The stretched between the counter electrode 10 and the metallic tool base 4 section of the wire 2 forms the direct electric wire heater 24th This wire section is electrically heated to such an extent that it can be pressed into the substrate 1 . The electrical power can be measured and regulated using simple means.

An improvement of this method can still be achieved in that the insert tool 3 and the tool foot 4 ture already with indirect heating 6 to a temperature just below the softening of the substrate layer 1 is preheated and only the other, required for pressing in the substrate layer 1 increase in temperature by direct heating 24 of the wire 2 takes place.

Depending on the relative speed of the tool 3 with respect to the substrate 1 , z. B. with a wire diameter of 80 microns with versil bert copper wire 2, the pressing force. 1 . . 50 N. Furthermore, the pressure force 25 must be chosen the higher, the larger the foot surface 4 of the insertion tool 3 and the lower the insertion tool temperature.

Reference list

1

Thermoplastic substrate layer

2nd

Ladder section; wire

3rd

Insertion tool

4th

Insertion tool foot

5

Compressed gas supply

6

indirect electric heating

7

Inner radius of the press tool foot; waist

8th

Thread opening

9

Inner sleeve

10th

Counter electrode

11

bracket

12th

Vertical slide

13

Reception facility

14

Wire cutters

15

Clamp

16

Cutting piece

17th

Locking point

18th

Horizontal slide (retracted)

19th

Return device

20th

Horizontal slide extension

21

Pick-up device in working position

22

notched ladder section

23

waist

24th

direct electrical wire heating

25th

Pressing force F

Claims (21)

1. A method for introducing wire-shaped conductor pieces ( 2 ) into a substrate ( 1 ) which has at least one thermoplastic layer, the wire-shaped conductor piece ( 2 ) being laid on the thermoplastic layer ( 1 ) and in this at least in places by pressing in the conductor piece ( 1 ) in the softened by heating layer ( 2 ) by means of a pressing tool ( 3 ), characterized in that

• the conductor section ( 2 ) to be pressed in, which is located under the insertion tool ( 3 ), is heated to a temperature during the insertion process which is above the softening temperature of the thermoplastic layer,
• - The pressing tool ( 3 ) is simultaneously moved relative to the substrate ( 1 ) according to a predetermined pattern and
• - The temperature of the conductor piece ( 2 ) located under the pressing tool ( 3 ) in the areas of the substrate in which it should not be pressed into the thermoplastic layer is reduced to a value which is below the softening temperature of the thermoplastic layer .

2. The method according to claim 1, characterized in that an adjustable between 0 and 100 N pressure force ( 25 ) acts on the pressing tool foot ( 4 ), the pressing force ( 25 ) being proportional to the relative displacement speed and inversely proportional to the conductor piece temperature. 3. The method according to claim 1, characterized in that the insertion tool ( 3 ) and / or the piece of wire to be pressed ( 2 ) is heated by indirect electrical heating ( 6 ), and that the insertion tool base ( 4 ) and / or the piece of wire to be pressed ( 2 ) is rapidly cooled to temperatures below the softening temperature of the thermoplastic layer ( 1 ) by a compressed gas stream ( 5 ). 4. The method according to any one of claims 1 to 3, characterized in that the insertion tool foot ( 4 ) and / or the wire piece to be pressed ( 2 ) is heated directly by electromagnetic radiation. 5. The method according to any one of the preceding claims, characterized in that at the starting point of the laying of the wire ( 2 ) a cutting piece ( 16 ) at a locking point ( 17 ) in the substrate surface ( 1 ) presses, the substrate then horizontally in the required direction moved and thereby a horizontal slide ( 18 ) attached to a receiving device ( 13 ) is pulled out, that during this horizontal movement the horizontal slide ( 18 ) remains in its position fixed by the cutting piece ( 16 ) at the locking point ( 17 ) and the clamping piece ( 15 ) Presses the beginning of the wire ( 2 ) against the substrate surface ( 1 ). 6. The method according to any one of the preceding claims, characterized in that after pressing in or after laying a first wire length in the thermoplastic substrate ( 1 ), the receiving device ( 13 ) is raised so far that the press-in tool foot ( 4 ) the wire ( 2 ) can continue to press into the substrate ( 1 ), but that the clamping piece ( 15 ) and the cutting piece ( 16 ) are no longer in engagement with the substrate ( 1 ). 7. The method according to any one of the preceding claims, characterized in that before the completion of the wire laying by means of a return device ( 19 ) the extended horizontal slide ( 20 ) is returned to its retracted position ( 18 ). 8. The method according to any one of the preceding claims, characterized in that at least immediately before completion of the laying of the respective wire pattern, the laying direction is chosen so that the wire ( 2 ) under the cutting piece ( 16 ) and the clamping piece ( 15 ) and the Wire ( 2 ) is laid by lowering the laying temperature on the surface of the substrate ( 1 ). 9. The method according to any one of the preceding claims, characterized in that the wire ( 2 ) by lowering the recorded device ( 13 ) with the cutting piece ( 16 ) is notched and that by the insertion tool foot ( 4 ) and the clamping piece ( 15 ) the beginning of the piece of wire ( 2 ) to be laid afterwards and is held in position with the insertion tool foot ( 4 ) by means of wire pliers ( 14 ) until it is started again. 10. The method according to any one of the preceding claims, characterized in that the wire to be laid ( 2 ) between the impression tool base ( 4 ) and a counter electrode ( 10 ) is directly heated by passage of current. 11. The method according to any one of the preceding claims, characterized in that the indentation (4) is preheated by indirect electrical heating (6) to below the softening temperature of thermoplasti's substrate (1). 12. Device for introducing wire-shaped conductor pieces ( 2 ) into a substrate ( 1 ) having at least one thermoplastic layer, wherein the wire-shaped conductor piece ( 2 ) is laid on the thermoplastic layer ( 1 ) and at least in places by heating the conductor piece ( 2 ) and is connected by pressing in by means of a pressing tool ( 3 ), the pressing tool ( 3 ) containing a pressing foot ( 4 ) in its lower region, characterized in that

• a holding device for the substrate ( 1 ) is firmly connected to a base frame,
• - The insertion tool ( 3 ) is movably arranged on the base frame in two horizontal directions,
• - The insertion tool ( 3 ) contains a continuous thread opening ( 8 ) inside
• - The insertion tool ( 3 ) and / or the wire ( 2 ) with a Heizeinrich device ( 6 ; 24 ) is coupled.

13. Apparatus according to claim 12, characterized in that a device with which the pressing tool (3) is loaded with a vertically acting variable pressing force F (25) is attached to the indentation (3). 14. The apparatus according to claim 12 or 13, characterized in that in the vicinity of the press-in foot ( 4 ) at least one compressed gas supply ( 5 ) is arranged. 15. The device according to one of claims 12 to 14, characterized in that the continuous thread opening ( 8 ) in the form of an inner sleeve ( 9 ) is made of ceramic. 16. Device according to one of the preceding claims, characterized in that a holder ( 11 ) is arranged on a vertically height-adjustable receiving device ( 13 ) via a vertical slide ( 12 ), on which the insertion tool ( 3 ) is located and that on the receiving device ( 13 ) a clamping piece ( 15 ) and a cutting piece ( 16 ) are slidably mounted. 17. Device according to one of the preceding claims, characterized in that the clamping piece ( 15 ) and the cutting piece ( 16 ) are each resiliently attached acting in the vertical direction, their spring forces being adjustable. 18. Device according to one of the preceding claims, characterized in that between the press-in foot ( 4 ) and a counter electrode ( 10 ) arranged in the upper region of the device, an electrically insulating inner sleeve ( 9 ) is attached, the electrical conductor piece ( 2 ) from the counter electrode ( 10 ) is guided to the press-in foot ( 4 ). 19. Device according to one of the preceding claims, characterized in that the insertion tool ( 3 ) and / or its insertion tool base ( 4 ) are rotationally symmetrical. 20. Device according to one of the preceding claims, characterized in that on the holder ( 11 ) above the indentation tool ( 3 ) a wire cutters ( 14 ) is attached. 21. Device according to one of the preceding claims, characterized in that a Rückholein direction ( 19 ) is arranged on the receiving device ( 13 ) with which the horizontal slide ( 18 ) can be brought into its starting position.