WO1997044819A1 - Process and device for fastening bonding wires to bond lands of a hybrid circuit - Google Patents

Process and device for fastening bonding wires to bond lands of a hybrid circuit Download PDF

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Publication number
WO1997044819A1
WO1997044819A1 PCT/DE1996/002318 DE9602318W WO9744819A1 WO 1997044819 A1 WO1997044819 A1 WO 1997044819A1 DE 9602318 W DE9602318 W DE 9602318W WO 9744819 A1 WO9744819 A1 WO 9744819A1
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WO
WIPO (PCT)
Prior art keywords
bondlands
hybrid circuit
bond
heating elements
lands
Prior art date
Application number
PCT/DE1996/002318
Other languages
German (de)
French (fr)
Inventor
Elmar Huber
Original Assignee
Robert Bosch Gmbh
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Publication date
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Publication of WO1997044819A1 publication Critical patent/WO1997044819A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Definitions

  • the invention relates to a method for fastening bond wires to bondland ⁇ of hybrid circuits by means of thermocompression bonding.
  • bond wires thin connecting wires
  • bondlands contact areas
  • bondlands contact areas
  • Thermocompression bonding is particularly suitable for this.
  • the connection between the bond wires and the bondlands is created in the case of thermocompression bonding by the action of pressure and heat with simultaneous plastic deformation.
  • the parts to be joined are pressed together until they weld together.
  • the contact time and contact force depend on the materials used and the wire diameter.
  • the necessary bond temperature is heated by a Workpiece holder and / or a heated tool reached.
  • Another, second method provides that a metal housing or a metal carrier plate, which is designed as a heatable bonder receptacle, is heated. This process requires product-specific heatable receptacles on the bonding machines. Another problem is the thermal connection of the bondlands to the housing or the carrier plate.
  • a metal base plate used as a carrier plate for the hybrid circuit is heated by an eddy current. It is also problematic here to establish good thermal contact between the bondlands and the metal base plate.
  • the invention is therefore based on the object of improving a method for fastening bond wires to bondlands of hybrid circuits of the generic type in such a way that fast attachment of the bond wires to the bondlands is possible in the simplest possible manner while using as little energy as possible.
  • the object is achieved according to the invention in a method for attaching eond wires to bondlands of hybrid circuits of the type described in the introduction in that the bondlands are specifically heated shortly before and / or during the welding process by means of heating elements arranged in the hybrid circuit under the bondlands.
  • the targeted heating of the bondlands by heating elements which are arranged in the hybrid circuit beneath the bondlands has the particularly great advantage that, on the one hand, no long-lasting furnace processes are required compared to known methods, and that there is no thermal contact between the hybrid circuit and a (metal) housing , in which this hybrid circuit is arranged, is necessary.
  • the method can therefore also be used in a plastic housing or, for example, if the hybrid circuit arranged on a metal base plate is difficult to access.
  • the direct heating of the bondlands means that it is not necessary to heat up a complete control device, so that considerably less energy is required than known methods. For these reasons, the attachment of bond wires to bond lands of hybrid circuits is possible in a particularly cost-effective manner.
  • the heating elements are tracks that are arranged in a wiring level below the Bondlands and are supplied with an electrical current. In this way, the Bondlands can be heated up quickly and in a targeted manner.
  • the heating temperature and thus the temperature of the bondlands is preferably varied by the current intensity.
  • the object according to the invention is furthermore also achieved by a device for fastening bond wires to bondlands of a hybrid circuit, in which heating elements which are arranged in the hybrid circuit below the bondlands can be actuated from outside the hybrid circuit.
  • the heating elements are conductor tracks which can be heated by the application of an electrical current supplied from outside.
  • the conductor tracks are advantageously arranged directly below the bondlands only separated by an insulating layer.
  • the electric current with which the heating elements can be acted upon is adjustable. This allows practically any desired temperature of the Bondlands to be set.
  • a device according to the invention for attaching bond wires to bond lands of a hybrid circuit is shown schematically and partially in section.
  • a multilayer hybrid circuit 10 comprises a plurality of wiring levels 11, 13, 15, which are isolated from one another by insulating layers 12, 14, 16. On the top of the hybrid circuit 10, in addition to conductor tracks and electronic components, there are also contact areas, so-called bondlands 11, on which very thin, mostly gold wires, so-called bond wires 20 for contacting the hybrid circuit 10 are fastened.
  • the bonding wires 20 are attached to the bondlands 11, for example, by thermocompression bonding.
  • the connection between the bond wires 20 and the bondlands 11 is affected by the action of Generates pressure and heat with simultaneous plastic deformation.
  • the parts to be joined are pressed together until they weld together.
  • the contact time and contact force depend on the materials to be bonded and the diameter of the bond wires 20.
  • the bond temperature is achieved by a heated workpiece holder and / or a heated tool (not shown).
  • conductor tracks 13 are provided in the hybrid circuit 10 below the bondlands 11, which are exposed to an electrical current I from a control unit 30 is fed, heat.
  • the surface area of the conductor tracks 13 can correspond to that of the bondlands 11. However, they can also have a larger area than the Bondlands 11 or a smaller area than this.
  • the conductor tracks 13 are separated from the bondlands 11 by an insulating layer 12. This insulating layer 12 is designed in such a way that on the one hand it has optimal electrical insulation, but on the other hand it has good thermal conductivity.
  • the current I flowing through the conductor track 13 can be regulated by the control device 30.
  • the temperature required for the bondlands 11 for the thermocompression welding process can be set very precisely, for example to 100 ° C.

Abstract

In order to improve a process and device for fastening bondingwires (20) to bond lands (11) of a hybrid circuit (10) by means of thermocompression bonding, so that rapid fastening of the bonding wires onto the bond lands is possible with a minimum expenditure of energy in the simplest possible way, it is proposed that the bond lands be heated shortly before and/or during welding in a directed manner, by means of heater elements (13) located in the hybrid circuit under the bond lands.

Description

Verfahren und Vorrichtung zur Befestiαunσ von Bonddrähten auf Bondlands einer HybridschaltunσMethod and device for attaching bond wires to bondlands of a hybrid circuit
Stand der TechnikState of the art
Die Erfindung betrifft ein Verfahren zur Befestigung von Bonddrähten auf Bondland≤ von Kybridschaltungen durch Thermokompressionsbonden.The invention relates to a method for fastening bond wires to bondland≤ of hybrid circuits by means of thermocompression bonding.
Seit längerem ist es bekannt, zur Verbindung von Kontakt- flächen, sogenannten Bondlands, von Hybridschaltungen mit Leiterbahnen einer Schichtschaltung dünne Verbindungs¬ drähte, sogenannte Bonddrähte, auf den Bondlands durch Bonden zu befestigen. Hierfür eignet sich insbesondere das Thermokompressionsbonden. Die Verbindung zwischen den Bonddrähten und den Bondlands wird beim Thermokompres¬ sionsbonden durch die Einwirkung von Druck und Wärme bei gleichzeitiger plastischer Verformung erzeugt. Die Fügeteile werden zusammengedrückt, bis sie miteinander verschweißen. Dabei richten sich Anpreßzeit und Anpre߬ kraft nach den verwendeten Werkstoffen und dem Draht- durchmesser.It has long been known to attach thin connecting wires, so-called bond wires, to the bondlands by bonding in order to connect contact areas, so-called bondlands, of hybrid circuits with conductor tracks of a layer circuit. Thermocompression bonding is particularly suitable for this. The connection between the bond wires and the bondlands is created in the case of thermocompression bonding by the action of pressure and heat with simultaneous plastic deformation. The parts to be joined are pressed together until they weld together. The contact time and contact force depend on the materials used and the wire diameter.
Die notwendige Bondtemperatur wird durch eine beheizte Werkstückaufnahme und/oder ein beheiztes Werkzeug erreicht .The necessary bond temperature is heated by a Workpiece holder and / or a heated tool reached.
Um die Bondlands auf Temperaturen von ca. 100° C auf¬ zuheizen, wurden bisher unterschiedliche Verfahren eingesetzt .In the past, different methods have been used to heat the bondlands to temperatures of approximately 100 ° C.
Bei einem ersten bekannten Verfahren wird das gesamte Steuergerät in einem Umluftofen aufgeheizt. Nachteilig bei diesem Verfahren ist jedoch, daß es lange Durch¬ laufzeiten und einen verhältnismäßig hohen Energieaufwand und damit auch hohe Energiekosten erfordert .In a first known method, the entire control device is heated in a forced air oven. A disadvantage of this method, however, is that it requires long throughput times and a relatively high energy expenditure and thus also high energy costs.
Ein anderes, zweites Verfahren sieht vor, daß ein Metallgehäuse oder eine Metallträgerplatte, die als heizbare Bonderaufnahme ausgebildet ist, beheizt wird. Dieses Verfahren erfordert erzeugniεspezifische heizbare Aufnahmen an den Bondmaschinen. Problematisch ist darüber hinaus die thermische Anbindung der Bondlands an das Gehäuse oder die Trägerplatte.Another, second method provides that a metal housing or a metal carrier plate, which is designed as a heatable bonder receptacle, is heated. This process requires product-specific heatable receptacles on the bonding machines. Another problem is the thermal connection of the bondlands to the housing or the carrier plate.
Bei einem wiederum anderen, dritten Verfahren wird eine als Trägerplatte für die Hybridschaltung verwendete Metallgrundplatte durch einen Wirbelstrom aufgeheizt. Problematisch hierbei ist ebenfalls die Herstellung eines guten Wärmekontakts zwischen den Bondlands und der Metallgrundplatte .In yet another, third method, a metal base plate used as a carrier plate for the hybrid circuit is heated by an eddy current. It is also problematic here to establish good thermal contact between the bondlands and the metal base plate.
Der Erfindung liegt daher die Aufgabe zugrunde, ein Verfahren zur Befestigung von Bonddrähten auf Bondlands von Hybridschaltungen der gattungsgemäßen Art derart zu verbessern, daß bei möglichst geringem Energieaufwand auf möglichst einfache Weise eine schnelle Befestigung der Bonddrähte auf den Bondlands möglich ist. Vorteile der ErfindungThe invention is therefore based on the object of improving a method for fastening bond wires to bondlands of hybrid circuits of the generic type in such a way that fast attachment of the bond wires to the bondlands is possible in the simplest possible manner while using as little energy as possible. Advantages of the invention
Die Aufgabe wird bei einem Verfahren zur Befestigung von Eonddrähten auf Bondlands von Hybridschaltungen der eingangs beschriebenen Art erfindungsgemäß dadurch gelöst, daß die Bondlands kurz vor und/oder während des Schweißvorganges gezielt mittels in der Hybridschaltung unter den Bondlands angeordneten Heizelementen aufgeheizt werden.The object is achieved according to the invention in a method for attaching eond wires to bondlands of hybrid circuits of the type described in the introduction in that the bondlands are specifically heated shortly before and / or during the welding process by means of heating elements arranged in the hybrid circuit under the bondlands.
Das gezielte Aufheizen der Bondlands durch Heizelemente, die in der Hybridschaltung unter den Bondlands angeordnet sind, hat den besonders großen Vorteil, daß zum einen gegenüber bekannten Verfahren keine lang andauernden Ofenprozesse erforderlich sind, und daß kein Wärmekontakt zwischen der Hybridεchaltung und einem (Metall)Gehäuse, in dem diese Hybridschaltung angeordnet ist, notwendig ist. Daher ist das Verfahren auch in einem Kunststoff- gehäuse oder beispielsweise bei schlechter Zugänglichkeit der auf einer Metallgrundplatte angeordneten Hybrid¬ εchaltung einsetzbar. Darüber hinaus ist durch das direkte Heizen der Bondlands keine Aufheizung eines kompletten Steuergerätes erforderlich, so daß gegenüber bekannten Verfahren ein wesentlich geringerer Energieauf¬ wand notwendig ist. Aus diesen Gründen ist die Befesti¬ gung von Bonddrähten auf Bondlands von Hybridschaltungen auf besonders kostengünstige Weise möglich.The targeted heating of the bondlands by heating elements which are arranged in the hybrid circuit beneath the bondlands has the particularly great advantage that, on the one hand, no long-lasting furnace processes are required compared to known methods, and that there is no thermal contact between the hybrid circuit and a (metal) housing , in which this hybrid circuit is arranged, is necessary. The method can therefore also be used in a plastic housing or, for example, if the hybrid circuit arranged on a metal base plate is difficult to access. In addition, the direct heating of the bondlands means that it is not necessary to heat up a complete control device, so that considerably less energy is required than known methods. For these reasons, the attachment of bond wires to bond lands of hybrid circuits is possible in a particularly cost-effective manner.
Hinsichtlich der Ausbildung der Heizelemente sind die unterschiedlichsten Ausführungen denkbar. Besonders vorteilhaft ist es jedoch, wenn die Heizelemente Leiter- bahnen sind, die in einer Verdrahtungsebene unterhalb der Bondlands angeordnet sind und mit einem elektrischen Strom beaufschlagt werden. Auf diese Weise läßt sich eine schnelle und gezielte Aufheizung der Bondlands besonders gut realisieren.A wide variety of designs are conceivable with regard to the design of the heating elements. However, it is particularly advantageous if the heating elements are tracks that are arranged in a wiring level below the Bondlands and are supplied with an electrical current. In this way, the Bondlands can be heated up quickly and in a targeted manner.
Dabei wird vorzugsweise die Heiztemperatur und damit die Temperatur der Bondlands durch die Stromstärke variiert.The heating temperature and thus the temperature of the bondlands is preferably varied by the current intensity.
Die erfindungsgemäße Aufgabe wird darüber hinaus auch noch durch eine Vorrichtung zur Befestigung von Bond¬ drähten auf Bondlands einer Hybridschaltung gelöst, bei welcher Heizelemente, die in der Hybridschaltung unter den Bondlands angeordnet sind, von außerhalb der Kybrid¬ schaltung betätigbar sind.The object according to the invention is furthermore also achieved by a device for fastening bond wires to bondlands of a hybrid circuit, in which heating elements which are arranged in the hybrid circuit below the bondlands can be actuated from outside the hybrid circuit.
Zur technisch besonders einfach zu realisierenden Betätigung der Heizelemente hat es sich als vorteilhaft erwiesen, daß die Heizelemente Leiterbahnen sind, die durch Beaufschlagung mit einem von außerhalb zugeführten elektrischen Strom erwärmbar sind.In order to actuate the heating elements in a technically particularly simple manner, it has proven to be advantageous that the heating elements are conductor tracks which can be heated by the application of an electrical current supplied from outside.
Insbesondere hinsichtlich eines guten Wärmekontaktε zwischen den Bondlands und den elektrischen Leiterbahnen sind die Leiterbahnen vorteilhafterweiεe direkt unterhalb der Bondlands lediglich getrennt durch eine Isolier¬ schicht angeordnet.In particular with regard to good thermal contact between the bondlands and the electrical conductor tracks, the conductor tracks are advantageously arranged directly below the bondlands only separated by an insulating layer.
Besonders zweckmäßig ist es, daß der elektrische Strom, mit dem die Heizelemente beaufschlagbar sind, regelbar iεt . Hierdurch kann praktisch jede gewünschte Temperatur der Bondlands eingestellt werden. ZeichnungIt is particularly expedient that the electric current with which the heating elements can be acted upon is adjustable. This allows practically any desired temperature of the Bondlands to be set. drawing
Weitere Merkmale und Vorteile der Erfindung sind Gegen¬ stand der nachfolgenden Beschreibung sowie der zeichneri¬ schen Darstellung von Ausführungsbeiεpielen.Further features and advantages of the invention are the subject of the following description and the drawing of exemplary embodiments.
In der Figur ist εchematiεch und teilweise geεchnitten eine erfindungεgemäße Vorrichtung zur Befestigung von Bonddrähten auf Bondlands einer Kybridschaltung darge¬ stellt.In the figure, a device according to the invention for attaching bond wires to bond lands of a hybrid circuit is shown schematically and partially in section.
Beschreibung der AusführungsbeispieleDescription of the embodiments
Das Verfahren zur Befestigung von Bonddrähten auf Bondlands von Hybridschaltungen durch Thermokompresεionε- bonden läßt sich am besten in Verbindung mit der in der Figur dargestellten Vorrichtung zur Befestigung von Bonddrähten auf Bondlands einer Kybridschaltung erläu¬ tern. Eine Multilayer-Hybridschaltung 10 umfaßt eine Mehrzahl von Verdrahtungsebenen 11, 13, 15, die durch isolierende Schichten 12, 14, 16 voneinander isoliert sind. An der Oberseite der Hybridschaltung 10 sind neben Leiterbahnen und elektronischen Bauelementen auch Kontaktflächen, sogenannte Bondlands 11 angeordnet, auf denen sehr dünne, zumeist aus Gold bestehende Drähte, sogenannte Bonddrähte 20 zur Kontaktierung der Hybrid¬ schaltung 10 befestigt werden.The method for attaching bond wires to bond lands of hybrid circuits by thermocompression bonding can best be explained in connection with the device shown in the figure for attaching bond wires to bond lands of a hybrid circuit. A multilayer hybrid circuit 10 comprises a plurality of wiring levels 11, 13, 15, which are isolated from one another by insulating layers 12, 14, 16. On the top of the hybrid circuit 10, in addition to conductor tracks and electronic components, there are also contact areas, so-called bondlands 11, on which very thin, mostly gold wires, so-called bond wires 20 for contacting the hybrid circuit 10 are fastened.
Die Befestigung der Bonddrähte 20 auf den Bondlands 11 geschieht dabei beispielsweise durch Thermokompressionε- bonden. Hierbei wird die Verbindung zwischen den Bond¬ drähten 20 und den Bondlands 11 durch die Einwirkung von Druck und Wärme bei gleichzeitiger plastischer Verformung erzeugt. Die Fügeteile werden zusammengedrückt, bis sie miteinander verschweißen. Dabei richten sich Anpreßzeit und Anpreßkraft nach den zu bondenden Werkstoffen und dem Durchmesser der Bonddrähte 20. Die Bondtemperatur wird dabei durch eine beheizte Werkstückaufnahme und/oder ein beheiztes (nicht dargestelltes) Werkzeug erreicht.The bonding wires 20 are attached to the bondlands 11, for example, by thermocompression bonding. Here, the connection between the bond wires 20 and the bondlands 11 is affected by the action of Generates pressure and heat with simultaneous plastic deformation. The parts to be joined are pressed together until they weld together. The contact time and contact force depend on the materials to be bonded and the diameter of the bond wires 20. The bond temperature is achieved by a heated workpiece holder and / or a heated tool (not shown).
Statt wie bei bekannten Verfahren die gesamte Werkstück¬ aufnahme, eine sogenannte (nicht dargestellte) Bonder¬ aufnahme aufzuheizen, sind in der Kybridschaltung 10 unterhalb der Bondlands 11 Leiterbahnen 13 vorgesehen, die sich bei Beaufschlagung mit einem elektrischen Strom I, der von einem Steuergerät 30 zugeführt wird, erwärmen. Die Leiterbahnen 13 können dabei in ihrer flächenhaften Ausdehnung den Bondlands 11 entsprechen. Sie können jedoch auch eine größere Fläche als die Bondlands 11 oder auch eine kleinere Fläche als diese aufweisen. Die Leiterbahnen 13 sind von den Bondlands 11 durch eine Isolierεchicht 12 getrennt. Diese Isolierεchicht 12 ist so ausgebildet, daß sie einerseits eine optimale elek¬ trische Isolierung, andererseits jedoch eine gute thermische Leitfähigkeit aufweist.Instead of heating the entire workpiece holder, as in known methods, of a so-called (not shown) bonder holder, conductor tracks 13 are provided in the hybrid circuit 10 below the bondlands 11, which are exposed to an electrical current I from a control unit 30 is fed, heat. The surface area of the conductor tracks 13 can correspond to that of the bondlands 11. However, they can also have a larger area than the Bondlands 11 or a smaller area than this. The conductor tracks 13 are separated from the bondlands 11 by an insulating layer 12. This insulating layer 12 is designed in such a way that on the one hand it has optimal electrical insulation, but on the other hand it has good thermal conductivity.
Um eine vorgegebene Temperatur besonderε einfach ein¬ stellen zu können und um die Temperatur der Bondlands 11 dem Schweißvorgang auf einfache Weise anpassen zu können, ist der durch die Leiterbahn 13 fließende Strom I durch das Steuergerät 30 regelbar. Auf diese Weise kann beispielsweise die erforderliche Temperatur der Bondlands 11 für den Thermokompressions-Schweißvorgang sehr genau, beispielsweise auf 100° C, eingeregelt werden. In order to be able to set a predetermined temperature particularly easily and to be able to adapt the temperature of the bondlands 11 to the welding process in a simple manner, the current I flowing through the conductor track 13 can be regulated by the control device 30. In this way, for example, the temperature required for the bondlands 11 for the thermocompression welding process can be set very precisely, for example to 100 ° C.

Claims

PatentansprücheClaims
Verfahren zur Befestigung von Bonddrähten (20) auf Bondlands (11) von Kybridschaltungen (10) durch Thermokompressionsbonden, dadurch gekennzeichnet, daß die Bondlands (11) kurz vor und/oder während des Schweißens gezielt mittels in der Hybridschaltung (10) unter den Bondlands (11) angeordneter Heizele¬ mente aufgeheizt werden.Method for fastening bond wires (20) to bondlands (11) of hybrid circuits (10) by thermocompression bonding, characterized in that the bondlands (11) are targeted shortly before and / or during welding by means of the hybrid circuit (10) under the bondlands ( 11) arranged heating elements are heated.
Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Heizelemente Leiterbahnen 13 sind, die mit einem elektrischen Strom (I) beaufschlagt werden.Method according to claim 1, characterized in that the heating elements are conductor tracks 13 which are supplied with an electrical current (I).
Verfahren nach Anspruch 1 oder 2, dadurch gekenn¬ zeichnet, daß die Heiztemperatur durch die Strom¬ stärke (I) variiert wird. Vorrichtung zur Befestigung von Bonddrähten (20) auf Bondlands (11) einer Hybridschaltung (10) , dadurch gekennzeichnet, daß Heizelemente, die in der Hybrid¬ schaltung (10) unter den Bondlands (11) angeordnet sind, von außerhalb der Kybridschaltung (10) betä¬ tigbar sind.Method according to claim 1 or 2, characterized in that the heating temperature is varied by the current (I). Device for fastening bond wires (20) to bondlands (11) of a hybrid circuit (10), characterized in that heating elements which are arranged in the hybrid circuit (10) below the bondlands (11) come from outside the hybrid circuit (10) are operable.
Vorrichtung nach Anspruch 4, dadurch gekennzeichnet, daß die Heizelemente Leiterbahnen (12) sind, die durch Beaufschlagung mit einem von außerhalb zu¬ geführten elektrischen Strom (I) erwärmbar sind.Apparatus according to claim 4, characterized in that the heating elements are conductor tracks (12) which can be heated by exposure to an electrical current (I) supplied from outside.
Vorrichtung nach einem der Ansprüche 4 bis 5, dadurch gekennzeichnet, daß der elektrische Strom (I) durch eine Steuerschaltung (30) regelbar ist. Device according to one of claims 4 to 5, characterized in that the electrical current (I) can be regulated by a control circuit (30).
PCT/DE1996/002318 1996-05-18 1996-12-04 Process and device for fastening bonding wires to bond lands of a hybrid circuit WO1997044819A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19620113.6 1996-05-18
DE1996120113 DE19620113A1 (en) 1996-05-18 1996-05-18 Method and device for attaching bond wires to bondlands of a hybrid circuit

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WO1997044819A1 true WO1997044819A1 (en) 1997-11-27

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Publication number Priority date Publication date Assignee Title
US6423939B1 (en) * 2000-10-02 2002-07-23 Agilent Technologies, Inc. Micro soldering method and apparatus
KR101211576B1 (en) * 2004-11-04 2012-12-12 마이크로칩스 인코포레이티드 Compression and cold weld sealing methods and devices

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US3289046A (en) * 1964-05-19 1966-11-29 Gen Electric Component chip mounted on substrate with heater pads therebetween
JPS56146243A (en) * 1980-04-14 1981-11-13 Nec Home Electronics Ltd Bonding method
JPS5972750A (en) * 1982-10-19 1984-04-24 Matsushita Electric Ind Co Ltd Semiconductor package and manufacture of semiconductor device
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FR2638050A1 (en) * 1988-10-18 1990-04-20 Thomson Hybrides Device for transferring a component to a hybrid circuit
JPH07202356A (en) * 1993-12-28 1995-08-04 Toyota Motor Corp Circuit board

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US3289046A (en) * 1964-05-19 1966-11-29 Gen Electric Component chip mounted on substrate with heater pads therebetween
JPS56146243A (en) * 1980-04-14 1981-11-13 Nec Home Electronics Ltd Bonding method
JPS5972750A (en) * 1982-10-19 1984-04-24 Matsushita Electric Ind Co Ltd Semiconductor package and manufacture of semiconductor device
JPS61237441A (en) * 1985-04-13 1986-10-22 Sharp Corp Wire bonding method
FR2638050A1 (en) * 1988-10-18 1990-04-20 Thomson Hybrides Device for transferring a component to a hybrid circuit
JPH07202356A (en) * 1993-12-28 1995-08-04 Toyota Motor Corp Circuit board

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