GB1337791A - Mounting device for semi-conductor chips - Google Patents

Mounting device for semi-conductor chips

Info

Publication number
GB1337791A
GB1337791A GB15271A GB15271A GB1337791A GB 1337791 A GB1337791 A GB 1337791A GB 15271 A GB15271 A GB 15271A GB 15271 A GB15271 A GB 15271A GB 1337791 A GB1337791 A GB 1337791A
Authority
GB
United Kingdom
Prior art keywords
areas
pad
mounting
semi
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB15271A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of GB1337791A publication Critical patent/GB1337791A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB15271A 1970-01-02 1971-01-01 Mounting device for semi-conductor chips Expired GB1337791A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35970A 1970-01-02 1970-01-02

Publications (1)

Publication Number Publication Date
GB1337791A true GB1337791A (en) 1973-11-21

Family

ID=21691183

Family Applications (1)

Application Number Title Priority Date Filing Date
GB15271A Expired GB1337791A (en) 1970-01-02 1971-01-01 Mounting device for semi-conductor chips

Country Status (4)

Country Link
JP (1) JPS4919023B1 (https=)
CH (1) CH540567A (https=)
DE (1) DE2064856A1 (https=)
GB (1) GB1337791A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2127217A (en) * 1982-08-10 1984-04-04 Brown David F Semiconductor chip carriers and housings
GB2138210A (en) * 1982-02-05 1984-10-17 Hitachi Ltd A multiple frame

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005044001B3 (de) * 2005-09-14 2007-04-12 W.C. Heraeus Gmbh Laminiertes Substrat für die Montage von elektronischen Bauteilen

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138210A (en) * 1982-02-05 1984-10-17 Hitachi Ltd A multiple frame
GB2127217A (en) * 1982-08-10 1984-04-04 Brown David F Semiconductor chip carriers and housings
US4638348A (en) * 1982-08-10 1987-01-20 Brown David F Semiconductor chip carrier
AT398254B (de) * 1982-08-10 1994-11-25 Dowty Electronic Components Chipträger sowie anordnung von solchen chipträgern

Also Published As

Publication number Publication date
CH540567A (de) 1973-08-15
DE2064856A1 (de) 1971-07-08
JPS4919023B1 (https=) 1974-05-14

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees