GB1333190A - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB1333190A
GB1333190A GB2306071*A GB2306071A GB1333190A GB 1333190 A GB1333190 A GB 1333190A GB 2306071 A GB2306071 A GB 2306071A GB 1333190 A GB1333190 A GB 1333190A
Authority
GB
United Kingdom
Prior art keywords
semi
metal
flexible
cooling parts
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2306071*A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Norden Holding AB
Original Assignee
ASEA AB
Allmanna Svenska Elektriska AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASEA AB, Allmanna Svenska Elektriska AB filed Critical ASEA AB
Publication of GB1333190A publication Critical patent/GB1333190A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
GB2306071*A 1970-03-05 1971-04-19 Semiconductor devices Expired GB1333190A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE02909/70A SE350874B (enExample) 1970-03-05 1970-03-05

Publications (1)

Publication Number Publication Date
GB1333190A true GB1333190A (en) 1973-10-10

Family

ID=20260980

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2306071*A Expired GB1333190A (en) 1970-03-05 1971-04-19 Semiconductor devices

Country Status (5)

Country Link
US (1) US3649738A (enExample)
DE (1) DE2109116C3 (enExample)
GB (1) GB1333190A (enExample)
SE (1) SE350874B (enExample)
SU (1) SU503563A3 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103053022A (zh) * 2010-06-11 2013-04-17 国际商业机器公司 挠性热交换器

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2160001C2 (de) * 1971-12-03 1974-01-10 Siemens Ag, 1000 Berlin U. 8000 Muenchen Halbleiteranordnung, insbesondere Thyristorbaugruppe
US3800191A (en) * 1972-10-26 1974-03-26 Borg Warner Expandible pressure mounted semiconductor assembly
US3989095A (en) * 1972-12-28 1976-11-02 Ckd Praha, Oborovy Podnik Semi conductor cooling system
CS159563B1 (enExample) * 1972-12-28 1975-01-31
US3972063A (en) * 1973-10-19 1976-07-27 Mitsubishi Denki Kabushiki Kaisha Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope
US4009423A (en) * 1975-07-02 1977-02-22 Honeywell Information Systems, Inc. Liquid cooled heat exchanger for electronic power supplies
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
CS179822B1 (en) * 1975-09-08 1977-11-30 Petr Novak Cooling and pressuring equipment esp. for power semiconductive elements
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US4167031A (en) * 1978-06-21 1979-09-04 Bell Telephone Laboratories, Incorporated Heat dissipating assembly for semiconductor devices
US4395728A (en) * 1979-08-24 1983-07-26 Li Chou H Temperature controlled apparatus
US4296455A (en) * 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules
US4532426A (en) * 1983-06-17 1985-07-30 Hughes Aircraft Company Wafer height correction system for focused beam system
CA1227886A (en) * 1984-01-26 1987-10-06 Haruhiko Yamamoto Liquid-cooling module system for electronic circuit components
JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式
US4561040A (en) * 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips
DE3575206D1 (de) * 1984-09-21 1990-02-08 Siemens Ag Einrichtung fuer die funktionspruefung integrierter schaltkreise.
US4750086A (en) * 1985-12-11 1988-06-07 Unisys Corporation Apparatus for cooling integrated circuit chips with forced coolant jet
US4721996A (en) * 1986-10-14 1988-01-26 Unisys Corporation Spring loaded module for cooling integrated circuit packages directly with a liquid
US5040053A (en) * 1988-05-31 1991-08-13 Ncr Corporation Cryogenically cooled integrated circuit apparatus
US4865331A (en) * 1988-09-15 1989-09-12 Ncr Corporation Differential temperature seal
US5050036A (en) * 1989-10-24 1991-09-17 Amdahl Corporation Liquid cooled integrated circuit assembly
EP0560478B1 (en) * 1992-02-10 1998-10-14 Nec Corporation Cooling structure for electronic circuit package
US5369550A (en) * 1992-09-02 1994-11-29 Vlsi Technology, Inc. Method and apparatus for cooling a molded-plastic integrated-circuit package
US6035523A (en) * 1995-06-16 2000-03-14 Apple Computer, Inc. Method and apparatus for supporting a component on a substrate
SE524204C2 (sv) * 2001-07-19 2004-07-06 Denso Corp Värmeansamlare med ett membran vilket tar emot ett fluidtryck
DE10164522B4 (de) * 2001-12-17 2005-05-25 Siemens Ag Spannvorrichtung und Halbleiterbauelement mit einer Spannvorrichtung
DE10207873A1 (de) * 2002-02-23 2003-09-04 Modine Mfg Co Kühlvorrichtung für elektronische/elektrische Komponenten
US20050039884A1 (en) * 2003-08-20 2005-02-24 Ivan Pawlenko Conformal heat sink
EP1848948B1 (de) * 2005-02-18 2010-04-14 ebm-papst St. Georgen GmbH & Co. KG Wärmetauscher
US8176972B2 (en) * 2006-08-31 2012-05-15 International Business Machines Corporation Compliant vapor chamber chip packaging
RU2449417C2 (ru) * 2009-06-01 2012-04-27 Государственное Образовательное Учреждение Высшего Профессионального Образования "Дагестанский Государственный Технический Университет" (Дгту) Способ охлаждения полупроводниковых тепловыделяющих электронных компонентов через биметаллические термоэлектрические электроды
JP5481680B2 (ja) * 2010-04-28 2014-04-23 三菱電機株式会社 半導体装置および半導体装置の製造方法
US9721870B2 (en) * 2014-12-05 2017-08-01 International Business Machines Corporation Cooling structure for electronic boards

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB787383A (en) * 1952-05-14 1957-12-04 Onera (Off Nat Aerospatiale) Process for producing superficial protective layers
DE1714910U (de) * 1953-10-19 1956-01-12 Licentia Gmbh Elektrisch unsymmetrisch leitendes system.
NL193055A (enExample) * 1954-01-14 1900-01-01
BE555902A (enExample) * 1956-03-22
US2958021A (en) * 1958-04-23 1960-10-25 Texas Instruments Inc Cooling arrangement for transistor
NL288523A (enExample) * 1961-08-04 1900-01-01
DE1976270U (de) * 1965-02-20 1968-01-04 Siemens Ag Halbleiteranordnung.
DE1539325A1 (de) * 1966-08-04 1969-12-11 Siemens Ag Druckstueck zur oertlichen Fixierung eines thermoelektrischen Bauelements
US3400543A (en) * 1966-10-31 1968-09-10 Peter G. Ross Semi-conductor cooling means
US3581163A (en) * 1968-04-09 1971-05-25 Gen Electric High-current semiconductor rectifier assemblies
DE1914790A1 (de) * 1969-03-22 1970-10-01 Siemens Ag Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen
DE2348207A1 (de) * 1973-09-25 1975-04-17 Siemens Ag Thyristorsaeule

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103053022A (zh) * 2010-06-11 2013-04-17 国际商业机器公司 挠性热交换器
CN103053022B (zh) * 2010-06-11 2016-02-17 国际商业机器公司 挠性热交换器及其制造方法

Also Published As

Publication number Publication date
SE350874B (enExample) 1972-11-06
DE2109116C3 (de) 1982-06-03
DE2109116B2 (de) 1974-08-29
DE2109116A1 (de) 1971-09-16
US3649738A (en) 1972-03-14
SU503563A3 (ru) 1976-02-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee