GB1331794A - Method and apparatus for fabricating semiconductor devices - Google Patents

Method and apparatus for fabricating semiconductor devices

Info

Publication number
GB1331794A
GB1331794A GB5164770A GB5164770A GB1331794A GB 1331794 A GB1331794 A GB 1331794A GB 5164770 A GB5164770 A GB 5164770A GB 5164770 A GB5164770 A GB 5164770A GB 1331794 A GB1331794 A GB 1331794A
Authority
GB
United Kingdom
Prior art keywords
chip
platform
substrate
handle
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5164770A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1331794A publication Critical patent/GB1331794A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB5164770A 1969-11-12 1970-10-30 Method and apparatus for fabricating semiconductor devices Expired GB1331794A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87569569A 1969-11-12 1969-11-12

Publications (1)

Publication Number Publication Date
GB1331794A true GB1331794A (en) 1973-09-26

Family

ID=25366213

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5164770A Expired GB1331794A (en) 1969-11-12 1970-10-30 Method and apparatus for fabricating semiconductor devices

Country Status (6)

Country Link
US (1) US3628717A (enExample)
JP (1) JPS4827499B1 (enExample)
CA (1) CA918820A (enExample)
DE (1) DE2055360A1 (enExample)
FR (1) FR2071705A5 (enExample)
GB (1) GB1331794A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508151B (zh) * 2011-01-21 2015-11-11 東芝股份有限公司 Semiconductor manufacturing apparatus and semiconductor substrate bonding method

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3859715A (en) * 1970-12-21 1975-01-14 Signetics Corp System and method for attaching semiconductor dice to leads
US3731867A (en) * 1971-07-19 1973-05-08 Motorola Inc Vacuum die sensor apparatus and method for a semiconductor die bonding machine
US3854196A (en) * 1972-04-20 1974-12-17 Gen Electric Stacked electrode capacitor and method of making same
FR2205800B1 (enExample) * 1972-11-09 1976-08-20 Honeywell Bull Soc Ind
JPS571896B2 (enExample) * 1973-04-06 1982-01-13
US3960310A (en) * 1974-05-20 1976-06-01 Lucian Nussbaum Apparatus for brazing hardened tips to surfaces
US4010885A (en) * 1974-09-30 1977-03-08 The Jade Corporation Apparatus for accurately bonding leads to a semi-conductor die or the like
FR2365209A1 (fr) * 1976-09-20 1978-04-14 Cii Honeywell Bull Procede pour le montage de micro-plaquettes de circuits integres sur un substrat et installation pour sa mise en oeuvre
US4126376A (en) * 1977-02-24 1978-11-21 Jenoptik Jena G.M.B.H Manipulation device for precision adjustments including a double microscope having adjustable optical axes
US4160893A (en) * 1977-12-29 1979-07-10 International Business Machines Corporation Individual chip joining machine
US4302267A (en) * 1980-02-20 1981-11-24 General Dynamics, Pomona Division Optical fiber mating apparatus and method
CH636740A5 (fr) * 1980-05-19 1983-06-15 Far Fab Assortiments Reunies Dispositif pour l'alignement d'une piece et d'un substrat.
US4583676A (en) * 1982-05-03 1986-04-22 Motorola, Inc. Method of wire bonding a semiconductor die and apparatus therefor
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation
JPS59129633A (ja) * 1983-01-08 1984-07-26 Canon Inc ステージ装置
FR2542236B1 (fr) * 1983-03-11 1986-06-06 Demeure Loic Machine de precision pour le report de petites pieces sur un support
US4696101A (en) * 1985-06-07 1987-09-29 Vanzetti Systems, Inc. Method and apparatus for placing and electrically connecting components on a printed circuit board
USD326463S (en) 1989-04-12 1992-05-26 Eldon Industries, Inc. Surface mount rework station
CH680176A5 (enExample) * 1989-11-14 1992-06-30 Esec Sa
US5031820A (en) * 1990-02-01 1991-07-16 Eldon Industries, Inc. PCB rework station
JP3331570B2 (ja) * 1993-09-08 2002-10-07 ソニー株式会社 熱圧着装置と熱圧着方法および液晶表示装置の生産方法
US20070225605A1 (en) * 2001-01-25 2007-09-27 Swanbom Rebecca L Method and Device for Marking Skin During an Ultrasound Examination
US7223238B2 (en) * 2001-01-25 2007-05-29 Swanbom Rebecca L Method and device for marking skin during an ultrasound examination
US8322299B2 (en) * 2006-05-17 2012-12-04 Taiwan Semiconductor Manufacturing Co., Ltd. Cluster processing apparatus for metallization processing in semiconductor manufacturing
EP2388807A1 (en) * 2010-05-20 2011-11-23 Nxp B.V. Semiconductor die with venting channel
KR20120138114A (ko) * 2011-06-14 2012-12-24 삼성전자주식회사 기판 처리 장치 및 방법
CN104528633A (zh) * 2014-12-02 2015-04-22 哈尔滨工业大学 一种基于微机械电子系统技术的多功能键合实验装置
CN107552910B (zh) * 2017-09-30 2019-08-09 铜陵兴怡金属材料有限公司 一种电容器引脚引线焊接机
CN114373704B (zh) * 2022-01-17 2022-07-05 揭阳市科和电子实业有限公司 半导体三极管引线支架氧化保护装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3165818A (en) * 1960-10-18 1965-01-19 Kulicke & Soffa Mfg Co Method for mounting and bonding semiconductor wafers
NL301740A (enExample) * 1963-01-02 1900-01-01
US3275795A (en) * 1963-09-25 1966-09-27 Westinghouse Electric Corp Welding apparatus
NL142018B (nl) * 1964-11-26 1974-04-16 Philips Nv Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze.
US3382564A (en) * 1965-09-27 1968-05-14 Gen Dynamics Corp Soldering apparatus and method for microelectronic circuits
US3448911A (en) * 1967-06-15 1969-06-10 Western Electric Co Compensating base for simultaneously bonding multiple leads
US3477630A (en) * 1968-04-26 1969-11-11 Western Electric Co Apparatus for assembling articles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508151B (zh) * 2011-01-21 2015-11-11 東芝股份有限公司 Semiconductor manufacturing apparatus and semiconductor substrate bonding method

Also Published As

Publication number Publication date
DE2055360A1 (de) 1971-05-19
CA918820A (en) 1973-01-09
JPS4827499B1 (enExample) 1973-08-23
US3628717A (en) 1971-12-21
FR2071705A5 (enExample) 1971-09-17

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee