GB1330081A - Semiconductor components - Google Patents

Semiconductor components

Info

Publication number
GB1330081A
GB1330081A GB1000172A GB1000172A GB1330081A GB 1330081 A GB1330081 A GB 1330081A GB 1000172 A GB1000172 A GB 1000172A GB 1000172 A GB1000172 A GB 1000172A GB 1330081 A GB1330081 A GB 1330081A
Authority
GB
United Kingdom
Prior art keywords
discs
semi
flanges
urged together
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1000172A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1330081A publication Critical patent/GB1330081A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)
GB1000172A 1971-04-15 1972-03-03 Semiconductor components Expired GB1330081A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712118356 DE2118356A1 (de) 1971-04-15 1971-04-15 Scheibenförmiges Halbleiterbauelement

Publications (1)

Publication Number Publication Date
GB1330081A true GB1330081A (en) 1973-09-12

Family

ID=5804825

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1000172A Expired GB1330081A (en) 1971-04-15 1972-03-03 Semiconductor components

Country Status (6)

Country Link
DE (1) DE2118356A1 (enrdf_load_stackoverflow)
FR (1) FR2133561B1 (enrdf_load_stackoverflow)
GB (1) GB1330081A (enrdf_load_stackoverflow)
IT (1) IT957175B (enrdf_load_stackoverflow)
NL (1) NL7202856A (enrdf_load_stackoverflow)
SE (1) SE383583B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011017563B4 (de) * 2010-04-27 2015-10-22 Mitsubishi Electric Corp. Druckkontakthalbleitervorrichtung

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2654532C3 (de) * 1976-12-02 1982-03-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Scheibenförmige Halbleiterzelle
FR2440077A1 (fr) * 1978-10-23 1980-05-23 Transformation En Cie Indle Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication
DE3221794A1 (de) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
US4829364A (en) * 1985-11-29 1989-05-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
DE102015113111B4 (de) * 2015-08-10 2020-01-30 Infineon Technologies Ag Leistungshalbleitermodul mit verbesserter Abdichtung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE316534B (enrdf_load_stackoverflow) * 1965-07-09 1969-10-27 Asea Ab
US3476986A (en) * 1966-09-17 1969-11-04 Nippon Electric Co Pressure contact semiconductor devices
GB1189062A (en) * 1967-03-23 1970-04-22 Motorola Inc Semiconductor Rectifier Assembly
GB1219570A (en) * 1967-08-04 1971-01-20 Lucas Industries Ltd Diode units
CH494471A (de) * 1967-11-09 1970-07-31 Ckd Praha Halbleiterbauelement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011017563B4 (de) * 2010-04-27 2015-10-22 Mitsubishi Electric Corp. Druckkontakthalbleitervorrichtung

Also Published As

Publication number Publication date
DE2118356A1 (de) 1972-10-26
FR2133561B1 (enrdf_load_stackoverflow) 1977-03-18
IT957175B (it) 1973-10-10
NL7202856A (enrdf_load_stackoverflow) 1972-10-17
FR2133561A1 (enrdf_load_stackoverflow) 1972-12-01
SE383583B (sv) 1976-03-15

Similar Documents

Publication Publication Date Title
ES389451A1 (es) Perfeccionamientos en los componentes semiconductores y procedimiento de fabricacion correspondiente.
SE334422B (enrdf_load_stackoverflow)
GB1330081A (en) Semiconductor components
ATE21539T1 (de) Druckentlastungsvorrichtung.
ES448440A1 (es) Perfeccionamientos en conjuntos de dispositivos semiconduc- tores.
CA1022690A (en) Ohmic contacts for group iii-v n-type semiconductors
GB1140677A (en) Improvements relating to semi-conductor devices
ES406779A1 (es) Un dispositivo semiconductor encapsulado.
GB869934A (en) Improvements in and relating to semi-conductor units and methods of making them
CA1026014A (en) Semiconductor component with pressure contact
GB824347A (en) Improvements in or relating to thermoelectric devices
FR2440077A1 (fr) Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication
ES367042A1 (es) Perfeccionamientos en la construccion de dispositivos meta-loplasticos de estanquidad.
AU4030972A (en) Housing assembly for contacts
GB893493A (en) Improvements in or relating to semi-conductor devices
GB890668A (en) Zone refining apparatus
JPS5240257A (en) Packing structure
GB878590A (en) Diodes
GB1191232A (en) Semiconductor Devices and Their Manufacture
GB910249A (en) Method of manufacturing hermetically sealed exposure devices
CA884591A (en) Pressure electrical contact assembly for an electrical device
GB866455A (en) Improvements in or relating to semi-conductor assemblies
GB1023332A (en) Bursting disc mounting
JPS5348471A (en) Production of resin seal type semiconductor device
NL7415172A (nl) Tegen drukgas geisoleerde, ingekapselde hoog- spanningsinrichting.

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee