GB1313537A - Alumina palladium composite - Google Patents
Alumina palladium compositeInfo
- Publication number
- GB1313537A GB1313537A GB2820770A GB2820770A GB1313537A GB 1313537 A GB1313537 A GB 1313537A GB 2820770 A GB2820770 A GB 2820770A GB 2820770 A GB2820770 A GB 2820770A GB 1313537 A GB1313537 A GB 1313537A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- palladium
- gold
- connector
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title abstract 10
- 229910052763 palladium Inorganic materials 0.000 title abstract 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title abstract 2
- 239000002131 composite material Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 6
- 238000010304 firing Methods 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 230000005496 eutectics Effects 0.000 abstract 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000005065 mining Methods 0.000 abstract 1
- 238000012216 screening Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US83191169A | 1969-06-10 | 1969-06-10 | |
| US83480369A | 1969-06-19 | 1969-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1313537A true GB1313537A (en) | 1973-04-11 |
Family
ID=27125475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2820770A Expired GB1313537A (en) | 1969-06-10 | 1970-06-10 | Alumina palladium composite |
Country Status (4)
| Country | Link |
|---|---|
| CA (1) | CA942433A (enrdf_load_stackoverflow) |
| DE (1) | DE2028605A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2049170B2 (enrdf_load_stackoverflow) |
| GB (1) | GB1313537A (enrdf_load_stackoverflow) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2124830A (en) * | 1982-07-30 | 1984-02-22 | Xerox Corp | Electrical circuit assembly |
| US10682952B2 (en) | 2017-06-28 | 2020-06-16 | Honda Motor Co., Ltd. | Embossed smart functional premium natural leather |
| US10742061B2 (en) | 2017-06-28 | 2020-08-11 | Honda Motor Co., Ltd. | Smart functional leather for recharging a portable electronic device |
| US10946797B2 (en) | 2017-06-28 | 2021-03-16 | Honda Motor Co., Ltd. | Smart functional leather for steering wheel and dash board |
| US10953793B2 (en) | 2017-06-28 | 2021-03-23 | Honda Motor Co., Ltd. | Haptic function leather component and method of making the same |
| US11665830B2 (en) | 2017-06-28 | 2023-05-30 | Honda Motor Co., Ltd. | Method of making smart functional leather |
| US11751337B2 (en) | 2019-04-26 | 2023-09-05 | Honda Motor Co., Ltd. | Wireless power of in-mold electronics and the application within a vehicle |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3210503B2 (ja) * | 1993-09-30 | 2001-09-17 | 株式会社東芝 | マルチチップモジュールおよびその製造方法 |
-
1970
- 1970-06-09 CA CA085,064A patent/CA942433A/en not_active Expired
- 1970-06-09 FR FR7021109A patent/FR2049170B2/fr not_active Expired
- 1970-06-10 GB GB2820770A patent/GB1313537A/en not_active Expired
- 1970-06-10 DE DE19702028605 patent/DE2028605A1/de active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2124830A (en) * | 1982-07-30 | 1984-02-22 | Xerox Corp | Electrical circuit assembly |
| US10682952B2 (en) | 2017-06-28 | 2020-06-16 | Honda Motor Co., Ltd. | Embossed smart functional premium natural leather |
| US10742061B2 (en) | 2017-06-28 | 2020-08-11 | Honda Motor Co., Ltd. | Smart functional leather for recharging a portable electronic device |
| US10946797B2 (en) | 2017-06-28 | 2021-03-16 | Honda Motor Co., Ltd. | Smart functional leather for steering wheel and dash board |
| US10953793B2 (en) | 2017-06-28 | 2021-03-23 | Honda Motor Co., Ltd. | Haptic function leather component and method of making the same |
| US11027647B2 (en) | 2017-06-28 | 2021-06-08 | Honda Motor Co., Ltd. | Embossed smart functional premium natural leather |
| US11665830B2 (en) | 2017-06-28 | 2023-05-30 | Honda Motor Co., Ltd. | Method of making smart functional leather |
| US11827143B2 (en) | 2017-06-28 | 2023-11-28 | Honda Motor Co., Ltd. | Embossed smart functional premium natural leather |
| US11751337B2 (en) | 2019-04-26 | 2023-09-05 | Honda Motor Co., Ltd. | Wireless power of in-mold electronics and the application within a vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2028605A1 (enrdf_load_stackoverflow) | 1970-12-17 |
| FR2049170B2 (enrdf_load_stackoverflow) | 1973-02-02 |
| CA942433A (en) | 1974-02-19 |
| FR2049170A2 (enrdf_load_stackoverflow) | 1971-03-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |