GB1313003A - Manufacture of semiconductor structures - Google Patents

Manufacture of semiconductor structures

Info

Publication number
GB1313003A
GB1313003A GB2976570A GB2976570A GB1313003A GB 1313003 A GB1313003 A GB 1313003A GB 2976570 A GB2976570 A GB 2976570A GB 2976570 A GB2976570 A GB 2976570A GB 1313003 A GB1313003 A GB 1313003A
Authority
GB
United Kingdom
Prior art keywords
substrate
lines
semi
conductor
division
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2976570A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1313003A publication Critical patent/GB1313003A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)
GB2976570A 1969-06-20 1970-06-19 Manufacture of semiconductor structures Expired GB1313003A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691931245 DE1931245A1 (de) 1969-06-20 1969-06-20 Verfahren zum Zerteilen von mit Halbleitermaterial beschichteten und mit Bauelementen versehenen Mg-Al-Spinellsubstratscheiben

Publications (1)

Publication Number Publication Date
GB1313003A true GB1313003A (en) 1973-04-11

Family

ID=5737496

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2976570A Expired GB1313003A (en) 1969-06-20 1970-06-19 Manufacture of semiconductor structures

Country Status (8)

Country Link
JP (1) JPS4827491B1 (de)
AT (1) AT317301B (de)
CH (1) CH507589A (de)
DE (1) DE1931245A1 (de)
FR (1) FR2046933B1 (de)
GB (1) GB1313003A (de)
NL (1) NL7006367A (de)
SE (1) SE351522B (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2648274B1 (fr) * 1989-06-07 1994-07-29 Commissariat Energie Atomique Procede et dispositif de marquage et de clivage de plaquettes de materiaux semi-conducteurs monocristallins

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169837A (en) * 1963-07-31 1965-02-16 Int Rectifier Corp Method of dicing semiconductor wafers
BE668918A (de) * 1965-08-27 1900-01-01
DE1652512B2 (de) * 1967-05-29 1976-08-26 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von halbleiterbauelementen

Also Published As

Publication number Publication date
AT317301B (de) 1974-08-26
DE1931245A1 (de) 1971-07-08
SE351522B (de) 1972-11-27
FR2046933B1 (de) 1974-09-20
CH507589A (de) 1971-05-15
FR2046933A1 (de) 1971-03-12
NL7006367A (de) 1970-12-22
JPS4827491B1 (de) 1973-08-23

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees