GB1308487A - Light emitting assemblies - Google Patents

Light emitting assemblies

Info

Publication number
GB1308487A
GB1308487A GB5853770A GB5853770A GB1308487A GB 1308487 A GB1308487 A GB 1308487A GB 5853770 A GB5853770 A GB 5853770A GB 5853770 A GB5853770 A GB 5853770A GB 1308487 A GB1308487 A GB 1308487A
Authority
GB
United Kingdom
Prior art keywords
diode
encapsulant
air
tab
diode element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5853770A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB1308487A publication Critical patent/GB1308487A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
GB5853770A 1969-12-29 1970-12-09 Light emitting assemblies Expired GB1308487A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88848569A 1969-12-29 1969-12-29

Publications (1)

Publication Number Publication Date
GB1308487A true GB1308487A (en) 1973-02-21

Family

ID=25393262

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5853770A Expired GB1308487A (en) 1969-12-29 1970-12-09 Light emitting assemblies

Country Status (5)

Country Link
US (1) US3676668A (enExample)
JP (1) JPS4913916B1 (enExample)
BE (1) BE760890A (enExample)
DE (1) DE2062209C3 (enExample)
GB (1) GB1308487A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025474U (enExample) * 1973-06-29 1975-03-24
JPS5025473U (enExample) * 1973-06-29 1975-03-24
GB2206444A (en) * 1987-06-10 1989-01-05 Yue Wen Cheng Light emitting diode

Families Citing this family (118)

* Cited by examiner, † Cited by third party
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US3746853A (en) * 1972-03-10 1973-07-17 Bell Canada Northern Electric Light emitting devices
US3774021A (en) * 1972-05-25 1973-11-20 Bell Telephone Labor Inc Light emitting device
GB1383548A (en) * 1972-06-29 1974-02-12 Plessey Co Ltd Light emitting diode assembly
US3932881A (en) * 1972-09-05 1976-01-13 Nippon Electric Co., Inc. Electroluminescent device including dichroic and infrared reflecting components
US3774086A (en) * 1972-09-25 1973-11-20 Gen Electric Solid state lamp having visible-emitting phosphor at edge of infrated-emitting element
US3764862A (en) * 1972-10-19 1973-10-09 Fairchild Camera Instr Co Lead frame for light-emitting diodes
JPS49112163U (enExample) * 1973-01-23 1974-09-25
US3860847A (en) * 1973-04-17 1975-01-14 Los Angeles Miniature Products Hermetically sealed solid state lamp
US3938177A (en) * 1973-06-25 1976-02-10 Amp Incorporated Narrow lead contact for automatic face down bonding of electronic chips
US3911430A (en) * 1974-04-17 1975-10-07 Fairchild Camera Instr Co Alpha-numeric display package
FR2285722A1 (fr) * 1974-09-18 1976-04-16 Radiotechnique Compelec Dispositif optoelectronique et son procede de fabrication
US4025896A (en) * 1975-06-11 1977-05-24 Amp Incorporated Illuminated display system and method of wiring said system
DE2542095A1 (de) * 1975-09-20 1977-03-24 Licentia Gmbh Halbleiteranordnung fuer die ziffernanzeige
US4110661A (en) * 1977-04-01 1978-08-29 Rockwell International Corporation Light emitting device for optical communications
US4255688A (en) * 1977-12-15 1981-03-10 Tokyo Shibaura Denki Kabushiki Kaisha Light emitter mounted on reflector formed on end of lead
DE3005301C2 (de) * 1980-02-13 1985-11-21 Telefunken electronic GmbH, 7100 Heilbronn Varaktor- oder Mischerdiode
US4827301A (en) * 1984-12-11 1989-05-02 Minolta Camera Kabushiki Kaisha Focus detection system and lighting device therefor
US4690538A (en) * 1984-12-11 1987-09-01 Minolta Camera Kabushiki Kaisha Focus detection system and lighting device therefor
US4843415A (en) * 1986-09-22 1989-06-27 Minolta Camera Kabushiki Kaisha Automatic focus detection system
US4920404A (en) * 1989-05-12 1990-04-24 Hewlett-Packard Company Low stress light-emitting diode mounting package
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US7695166B2 (en) * 2001-11-23 2010-04-13 Derose Anthony Shaped LED light bulb
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US7070310B2 (en) * 2002-10-01 2006-07-04 Truck-Lite Co., Inc. Light emitting diode headlamp
US7420271B2 (en) * 2003-02-20 2008-09-02 Tsung Hsin Chen Heat conductivity and brightness enhancing structure for light-emitting diode
TW560813U (en) * 2003-03-06 2003-11-01 Shang-Hua You Improved LED seat
US7289037B2 (en) 2003-05-19 2007-10-30 Donnelly Corporation Mirror assembly for vehicle
US7798667B2 (en) * 2003-07-07 2010-09-21 Brasscorp Limited LED spotlight
CA2473063C (en) * 2003-07-07 2008-09-16 Brasscorp Limited Led lamps and led driver circuits for the same
JP2007516601A (ja) * 2003-09-08 2007-06-21 ナノクリスタル・ライティング・コーポレーション 高屈折率のカプセル材料を用いたｌｅｄランプのための光の効率的なパッケージ構成
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US7446924B2 (en) 2003-10-02 2008-11-04 Donnelly Corporation Mirror reflective element assembly including electronic component
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US7553051B2 (en) 2004-03-18 2009-06-30 Brasscorp Limited LED work light
US8562184B2 (en) * 2004-03-18 2013-10-22 Brasscorp Limited LED work light
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US20080074583A1 (en) * 2006-07-06 2008-03-27 Intematix Corporation Photo-luminescence color liquid crystal display
US8947619B2 (en) 2006-07-06 2015-02-03 Intematix Corporation Photoluminescence color display comprising quantum dots material and a wavelength selective filter that allows passage of excitation radiation and prevents passage of light generated by photoluminescence materials
US20080029720A1 (en) * 2006-08-03 2008-02-07 Intematix Corporation LED lighting arrangement including light emitting phosphor
US20080151143A1 (en) * 2006-10-19 2008-06-26 Intematix Corporation Light emitting diode based backlighting for color liquid crystal displays
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US7972030B2 (en) * 2007-03-05 2011-07-05 Intematix Corporation Light emitting diode (LED) based lighting systems
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025474U (enExample) * 1973-06-29 1975-03-24
JPS5025473U (enExample) * 1973-06-29 1975-03-24
GB2206444A (en) * 1987-06-10 1989-01-05 Yue Wen Cheng Light emitting diode

Also Published As

Publication number Publication date
US3676668A (en) 1972-07-11
JPS4913916B1 (enExample) 1974-04-03
DE2062209A1 (de) 1971-07-08
BE760890A (fr) 1971-06-28
DE2062209B2 (de) 1974-06-06
DE2062209C3 (de) 1975-01-09

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees