FR2285722A1 - Dispositif optoelectronique et son procede de fabrication - Google Patents

Dispositif optoelectronique et son procede de fabrication

Info

Publication number
FR2285722A1
FR2285722A1 FR7431523A FR7431523A FR2285722A1 FR 2285722 A1 FR2285722 A1 FR 2285722A1 FR 7431523 A FR7431523 A FR 7431523A FR 7431523 A FR7431523 A FR 7431523A FR 2285722 A1 FR2285722 A1 FR 2285722A1
Authority
FR
France
Prior art keywords
semiconductor
mounting
adhesive
electronic device
metal strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7431523A
Other languages
English (en)
Other versions
FR2285722B1 (fr
Inventor
Jacques Thillays
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7431523A priority Critical patent/FR2285722A1/fr
Publication of FR2285722A1 publication Critical patent/FR2285722A1/fr
Application granted granted Critical
Publication of FR2285722B1 publication Critical patent/FR2285722B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
FR7431523A 1974-09-18 1974-09-18 Dispositif optoelectronique et son procede de fabrication Granted FR2285722A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7431523A FR2285722A1 (fr) 1974-09-18 1974-09-18 Dispositif optoelectronique et son procede de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7431523A FR2285722A1 (fr) 1974-09-18 1974-09-18 Dispositif optoelectronique et son procede de fabrication

Publications (2)

Publication Number Publication Date
FR2285722A1 true FR2285722A1 (fr) 1976-04-16
FR2285722B1 FR2285722B1 (fr) 1978-09-15

Family

ID=9143198

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7431523A Granted FR2285722A1 (fr) 1974-09-18 1974-09-18 Dispositif optoelectronique et son procede de fabrication

Country Status (1)

Country Link
FR (1) FR2285722A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2658344A1 (fr) * 1990-02-09 1991-08-16 Neiman Sa Systeme de telecommande notamment pour le verrouillage/deverrouillage de portieres pour vehicules automobiles.
US5534718A (en) * 1993-04-12 1996-07-09 Hsi-Huang Lin LED package structure of LED display

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2062209A1 (de) * 1969-12-29 1971-07-08 Gen Electric Festkörper Lampenanordnung
CA917812A (en) * 1971-05-14 1972-12-26 Dennis Effer Package for light emitting devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2062209A1 (de) * 1969-12-29 1971-07-08 Gen Electric Festkörper Lampenanordnung
CA917812A (en) * 1971-05-14 1972-12-26 Dennis Effer Package for light emitting devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2658344A1 (fr) * 1990-02-09 1991-08-16 Neiman Sa Systeme de telecommande notamment pour le verrouillage/deverrouillage de portieres pour vehicules automobiles.
EP0442789A1 (fr) * 1990-02-09 1991-08-21 Valeo Neiman Système de télécommande notamment pour le verrouillage/déverrouillage de portières pour vÀ©hicules automobiles
US5266946A (en) * 1990-02-09 1993-11-30 Valeo Neiman Remote control system, in particular for locking and unlocking the doors of motor vehicles with two axially offset light emitters
US5534718A (en) * 1993-04-12 1996-07-09 Hsi-Huang Lin LED package structure of LED display

Also Published As

Publication number Publication date
FR2285722B1 (fr) 1978-09-15

Similar Documents

Publication Publication Date Title
JPS5282183A (en) Connecting wires for semiconductor devices
GB1372216A (en) Semiconductor device manufacture
GB1295594A (fr)
GB1383297A (en) Electrical integrated circuit package
FR2285722A1 (fr) Dispositif optoelectronique et son procede de fabrication
GB1511415A (en) Connecting strips
JPS54144872A (en) Electronic circuit device
JPS5721847A (en) Semiconductor device
JPS54161270A (en) Lead frame for integrated-circuit device
NL7606781A (nl) Halfgeleiderinrichting.
JPS5751928B2 (fr)
JPS6455291A (en) Integrated circuit device
JPS51140478A (en) Lead frame
SE7415064L (fr)
JPS57154863A (en) Manufacture of resin sealing type electronic parts
JPS5688330A (en) Fixing method for lead wire
JPS5324270A (en) Semiconductor device
JPS52153647A (en) Elastic surface wave element
JPS5638846A (en) Semiconductor device
JPS5736852A (en) Circuit substrate and manufacture thereof
JPS5252386A (en) Piezoelectric vibrator
ES268767A1 (es) Procedimiento para la fabricaciën de espejos con plata soberdorada y o aleaciën de plata y sodio sobre vidrio y materias plasticas de sintesis
JPS5721880A (en) Semiconductor light emitting element and manufacture thereof
JPS6427236A (en) Wire bonding method
JPS57147259A (en) Semiconductor device using lead frame

Legal Events

Date Code Title Description
ST Notification of lapse