GB2206444A - Light emitting diode - Google Patents

Light emitting diode Download PDF

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Publication number
GB2206444A
GB2206444A GB08714527A GB8714527A GB2206444A GB 2206444 A GB2206444 A GB 2206444A GB 08714527 A GB08714527 A GB 08714527A GB 8714527 A GB8714527 A GB 8714527A GB 2206444 A GB2206444 A GB 2206444A
Authority
GB
United Kingdom
Prior art keywords
reflector
display device
cylindrical
emitting diode
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08714527A
Other versions
GB8714527D0 (en
Inventor
Cheng Yue-Wen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YUE WEN CHENG
Original Assignee
YUE WEN CHENG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19873719338 external-priority patent/DE3719338A1/en
Application filed by YUE WEN CHENG filed Critical YUE WEN CHENG
Priority to GB08714527A priority Critical patent/GB2206444A/en
Publication of GB8714527D0 publication Critical patent/GB8714527D0/en
Publication of GB2206444A publication Critical patent/GB2206444A/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A light emitting diode (LED) display device (20) has a semiconductor chip (23) which is capable of emitting light when energised and mounted in a cylindrical cavity (25) of a reflector (24) and encapsulated with epoxy resin forming a hemispherical covering (26) which gives greater visible light in comparison with conventional LED devices. The light emitted by the semiconductor chip (23) in randomly reflected by the cylindrical wall of the cylindrical cavity (25) of the reflector (24) and the epoxy resin covering (26) to become effectively visible. More than one semiconductor chip may be disposed in one cylindrical cavity. …<IMAGE>…

Description

TITRE Light Emitting Diode Display A light emitting diode (LED) generally comprises a semiconductor chip mounted onto a pair of electrodes or terminals and encapsulated or dip-coated with a transparent covering material, which may be a clear or coloured epoxy resin. When a bias voltage is applied to an LED, it produces a visible light. Because of its small size, relatively higher durability, and relatively lower power consumption, it has replaced resistance-filament type lamps in many applications.
However, an LED only produces a very limited amount of light or light of limited intensity; enlargement of the conductor chip size or increase in the bias voltage will not render any practical improvement in the light emitting capacity.
Analysis has revealed that the coating over the semiconductor chip of an LED unit tends to absorb a part of the light emitted by the chip, which reduces the amount of the visible light.
In order to increase the amount of the visible light produced by an LED unit, a known LED 10 as shown in Figure 1 is provided with a reflector 12 having an arcuate, surface 12A, with the semiconductor chip 11 disposed in the central part of the reflector 12, and encapsulated with a transparent epoxy covering 13 called a"bubble". In this arrangement a part of the light which would have been lost in an LED unit without a reflector is reflected to become visible, and the overall amount of the visible light produced by the LED unit is improved.
Nevertheless, even with the above mentioned improvement, a considerable part of the light emitted by the semiconductor chip is still not effectively turned into a visible light.
Therefore, it is a main object of this invention to offer an improved LED display device which gives a relatively greater amount of visible light.
It is another object of this invention to offer an improved LED display device which gives better display capability at a relatively low cost.
According to this invention there is provided a light emitting diode display device comprising a semiconductor chip capable of emitting a visible light when an electrical voltage is applied, a pair of electrodes on which said semiconductor chip is mounted, a reflector having a cylindrical aperture in which said semiconductor chip is disposed, and a solid cover formed into a generally hemispherical protrusion over said cylindrical aperture, said solid covering having a part which fills said cylindrical hole.
In the LED display device of the present invention the semiconductor chip is fixedly mounted onto a pair of electrodes and provided with a reflector having a cylindrical cavity in which the semiconductor chip is disposed. The cylindrical cavity of the reflector is filled with transparent material such as epoxy resin, with the upper part of the filled material formed into a solid covering of generally hemispherical or parabolic shape. In a preferred embodiment the reflector has a generally flat upper surface, and in another preferred embodiment the reflector has an arcuate concave upper surface.
According to this invention there is also provided a light emitting diode display device comprising a base plate, a plurality of pairs of electrodes formed into a printed circuit on one side of said base plate, a plurality of semiconductor chips, each one of which is capable of emitting visible light when an electrical voltage is applied and connected with each respective pair of said pairs of electrodes, a reflector having a plurality of cylindrical apertures to correspond with said semiconductor chips, said reflector being secured onto said base plate with each one of said semiconductor chips disposed in each corresponding one of said plurality of cylindrical apertures of said reflector, and a solid transparent covering that covers said reflector and secures said reflector onto said base plate, said solid transparent cover having parts filling said cylindrical apertures and a plurality of generally hemispherical protrusions over and corresponding with said cylindrical holes, said solid transparent covering being formed integrally with said plurality of hemispherical protrusions into one integral unit.
In a further preferred embodiment the reflector is provided with a plurality of cylindrical cavities of which each one contains a semiconductor chip or chips, and each one of the cylindrical cavities is provided with a respective solid, transparent, hemispherical covering which is optionally integrally connected with the other hemispherical coverings to form the LED display device into an integral, solid unit.
The invention is further described by way of examples shown in the accompanying drawings, wherein: Figure 1 shows a schematic cross sectional view of a known conventional LED unit, Figure 2 shows an enlarged schematic cross sectional view of a first embodiment of the LED display unit according to the present invention, Figure 3 shows an enlarged, exploded, perspective view of the LED display unit of Figure 2 without the solid cover, Figure 4 shows an enlarged schematic cross sectional view of a second embodiment of the LED display unit according to the present invention, Figure 5 shows an enlarged exploded perspective view of the LED display unit of Figure 4, without the solid cover, Figure 6 shows an enlarged schematic cross sectional view of a third embodiment of the LED'display unit according to the present invention, Figure 7 shows a perspective view of the reflector employed in the LED display unit of Figure 6, Figure 8 shows an enlarged schematic cross sectional view of a fourth embodiment of the LED display unit according to the present invention, Figure 9 shows an enlarged, exploded, perspective view of the LED display device of Figure 8 without the solid cover, and Figure 10 shows an enlarged schematic cross sectional view of a fifth embodiment of the LED display device according to the present invention.
A first embodiment of the LED display device of this invention is schematically shown in Figures 2 and 3; the LED display device, designated by 20 (Figure 2), comprises a base plate 21 having a pair of electrodes 22 in the form of a printed circuit, a semiconductor chip 23 mounted onto the pair of electrodes 22, a generally discshaped reflector 24 having a cylindrical opening to form a cylindrical cavity 25 in which the semiconductor chip 23 is disposed, and a generally hemispherical solid covering 26 which fills cylindrical cavity 25 to encapsulate semiconductor chip 23. The solid covering 26 is made of transparent material such as epoxy resin, which may be selectively coloured or-uncoloured, to form a generally hemispherical protrusion over cylindrical cavity 25 in which semiconductor chip 23 is placed. The base plate 21 also has a pair of mounting lugs 28 electrically connected to the pair of electrodes 22.
To make the LED display device of Figure 2, the semiconductor chip 23 is first mounted onto electrodes 22 of base plate 21 which is a printed circuit board. Base plate 21 having semiconductor chip 23 mounted thereon is then placed in a first mould (not shown), and reflector 24 is placed on base plate 21, with a cylindrical cavity or opening 25 aligned with or positioned to fit the semiconductor chip 23. Then a second mould having a cavity of shape identical with solid covering 26 is placed cavity side down on top of the first mould, to cover the base plate 21 having semiconductor chip 23 and reflector 24. The covering material in a liquid state, which may be an epoxy resin, is then poured into the cavity of the second mould through a filling gate of the second mould (not shown). A curing process is finally conducted to cure the covering material to complete the moulding of the covering of the LED display device.
In the first embodiment an LED device provided with a reflector having only one cylindrical cavity is illustrated, however, it should be understood that a reflector may also be provided with a plurality of cylindrical cavities to correspond with a plurality of LED chips mounted on a base plate, and each cylindrical cavity is provided with a hemispherical solid covering 26.
Figures 4 and 5 show a second embodiment of the LED display device of this invention, which is similar to the first embodiment except that the hemispherical solid covering 26, which fills cylindrical cavity 25 to encapsulate semiconductor chip 23, has an outskirt 27 which covers the entire reflector 24, and the reflector 24 may be provided with notches or openings 29, as shown in Figure 5, to enable covering material 26 to come in contact with or bond to base plate 21 so as to secure the reflector 24 onto the base plate 21 without a separate bonding process being required.
Figure 6 shows a third embodiment of the LED display device of this invention. In this embodiment, a reflector 24A having an arcuate, concave upper surface 24B, as shown in Figure 7, is used in place of one having a planar upper surface as in the first embodiment. A solid covering of generally hemispherical shape 26 covers the cylindrical cavity or opening 25 and the entire area or part of the concave surface of the reflector 24A.
The arrangement of cylindrical cavity or opening 25 for placing therein semiconductor chip 23 remains as in the first embodiment.
In use, a part of the light emitted by semiconductor chip 23 is randomly reflected by the cylindrical wall of the cylindrical opening 25, and the randomly reflected light is randomly emitted through hemispherical covering 26, such randomly reflected and emitted light together with the remaining part of the light directly emitted from semiconductor chip 23 makes the total amount of effective visual light greater than for a LED without the reflector having a cylindrical cavity in which the semiconductor chip is placed.
Figures 8 and 9 show a fourth embodiment of the LED display device of this invention, which comprises a base plate 21 having a plurality of pairs of electrodes 22A in the form of a printed circuit on one side, a plurality of semiconductor chips 23, each one being mounted onto a respective pair of electrodes 22A, a generally circularshaped reflector 24R having a plurality of cylindrical openings 25 corresponding to the plurality of semiconductor chips 23, arranged in such a manner that each one of semiconductor chips 23 is disposed in a cylindrical opening 25, each cylindrical opening 25 being filled with a solid covering material which is also formed into a generally hemispherical protrusion 26 over each respective cylindrical opening 25 having therein a semiconductor chip 23, the hemispherical protrusions 26 being provided with outskirts 27 which connect hemispherical protrusions 26 to form an integral covering to cover the entire reflector 24R. Notches 29 are conveniently provided on reflector 24R to ensure that covering material comes into contact with base plate 21 so that reflector 24R is secured onto the base plate 21 without the need of a separate bonding process for bonding reflector 24R onto base plate 21.
Figure 10 shows a fifth embodiment of the improved LED display device of this invention, which comprises a base plate 21, having a plurality of semiconductor chips 23, the circular reflector having a concave, arcuate upper surface 24S covered with a solid transparent covering having a plurality of protrusions 26 to correspond with the plurality of cylindrical openings 25 of the reflector 24L. In this embodiment, except for the upper surface of the reflector which is concave, the construction is the same as that of the third embodiment.
The device of this embodiment gives better reflection of the light emitted by the LED.
Although a cylindrical cavity or opening is employed in the preferred embodiments, the cylindrical cavity or opening may be replaced by an inverted cone shape cavity or opening to give different visual performance.
It should be further noted that the integral formation of the solid transparent covering with a plurality of protrusions gives better mechanical integrity and reduces manufacturing costs.
While preferred embodiments, with one semiconductor chip in each cylindrical cavity and with a generally circular-shaped reflector, have been illustrated and described, it should be understood that more than one semiconductor chip-can be placed in one cylindrical cavity in order to increase the intensity of light, and that the reflector can be of rectangular, or any other shape. Other modifications are possible without departing from the scope and spirit as defined in the appended claims.

Claims (7)

  1. CLAIMS 1. A light emitting diode display device comprising a semiconductor chip capable of emitting a visible light when an electrical voltage is applied, a pair of electrodes on which said semiconductor chip is mounted, a reflector having a cylindrical aperture in which said semiconductor chip is disposed, and a solid cover formed into a generally hemispherical protrusion over said cylindrical aperture, said solid covering having a part which fills said cylindrical hole.
  2. 2. A light emitting diode display device as claimed in Claim 1, wherein said solid covering has an outskirt which covers the entire reflector.
  3. 3. A light emitting diode display device as claimed in Claim 2, wherein said electrodes are formed by a printed circuit on a base plate and said reflector has an opening that allows the solid covering to extend therethrough to come into contact with said base plate.
  4. 4. A light emitting diode display device as claimed in Claim 3, wherein said reflector has an arcuate, concave upper surface.
  5. 5. A light emitting diode display device comprising a base plate, a plurality of pairs of electrodes formed into a printed circuit on one side of said base plate, a plurality of semiconductor chips, each one of which is capable of emitting visible light when an electrical voltage is applied and connected with each respective pair of said pairs of electrodes, a reflector having a plurality of cylindrical apertures to correspond with said semiconductor chips, said reflector being secured onto said base plate with each one of said semiconductor chips disposed in each corresponding one of said plurality of cylindrical apertures of said reflector, and a solid transparent covering that covers said reflector and secures said reflector onto said base plate, said solid transparent cover having parts filling said cylindrical apertures and a plurality of generally hemispherical protrusions over and corresponding with said cylindrical holes, said solid transparent covering being formed integrally with said plurality of hemispherical protrusions into one integral unit.
  6. 6. A light emitting diode display device as claimed in Claim 1 or 5, which further comprises a plurality of semiconductor chips disposed in one cylindrical aperture of said reflector.
  7. 7. A light emitting diode display device constructed substantially as described herein and exemplified with reference to Figures 2 to 10 of the drawings.
GB08714527A 1987-06-10 1987-06-22 Light emitting diode Withdrawn GB2206444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08714527A GB2206444A (en) 1987-06-10 1987-06-22 Light emitting diode

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19873719338 DE3719338A1 (en) 1987-06-10 1987-06-10 LED DISPLAY DEVICE
GB08714527A GB2206444A (en) 1987-06-10 1987-06-22 Light emitting diode

Publications (2)

Publication Number Publication Date
GB8714527D0 GB8714527D0 (en) 1987-07-29
GB2206444A true GB2206444A (en) 1989-01-05

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4920404A (en) * 1989-05-12 1990-04-24 Hewlett-Packard Company Low stress light-emitting diode mounting package
US5167556A (en) * 1990-07-03 1992-12-01 Siemens Aktiengesellschaft Method for manufacturing a light emitting diode display means
GB2295274A (en) * 1994-11-17 1996-05-22 Teledyne Ind Optical lens system for light emitting diodes
GB2340301A (en) * 1998-07-28 2000-02-16 Oxley Dev Co Ltd Side illuminating light emitting diode
WO2005083805A1 (en) * 2004-02-26 2005-09-09 Matsushita Electric Industrial Co., Ltd. Led light source
DE19963264B4 (en) * 1999-12-17 2007-05-31 Optotransmitter-Umweltschutz-Technologie E.V. Carrier material for high-performance electronic components in SMD design and a high-performance electronic component produced therewith
WO2007063489A1 (en) * 2005-12-02 2007-06-07 Koninklijke Philips Electronics N.V. Light emitting diode module
DE102008053489A1 (en) * 2008-10-28 2010-04-29 Osram Opto Semiconductors Gmbh Carrier body for a semiconductor device, semiconductor device and method for producing a carrier body
US8174036B2 (en) * 2003-12-30 2012-05-08 Osram Opto Semiconductors Gmbh Lighting device
US8975646B2 (en) 2004-05-31 2015-03-10 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and housing base for such a component
EP3545561A4 (en) * 2017-08-25 2020-11-25 Cree Huizhou Solid State Lighting Company Ltd. Multiple led light source lens design in an integrated package

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1308487A (en) * 1969-12-29 1973-02-21 Gen Electric Light emitting assemblies
GB1411199A (en) * 1973-02-16 1975-10-22 Hewlett Packard Co Electroluminescent semiconductor apparatus and method of fabricating the same
EP0206176A2 (en) * 1985-06-28 1986-12-30 Takiron Co. Ltd. An optical guide matrix for a dot-matrix luminous display

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1308487A (en) * 1969-12-29 1973-02-21 Gen Electric Light emitting assemblies
GB1411199A (en) * 1973-02-16 1975-10-22 Hewlett Packard Co Electroluminescent semiconductor apparatus and method of fabricating the same
EP0206176A2 (en) * 1985-06-28 1986-12-30 Takiron Co. Ltd. An optical guide matrix for a dot-matrix luminous display

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4920404A (en) * 1989-05-12 1990-04-24 Hewlett-Packard Company Low stress light-emitting diode mounting package
US5167556A (en) * 1990-07-03 1992-12-01 Siemens Aktiengesellschaft Method for manufacturing a light emitting diode display means
GB2295274A (en) * 1994-11-17 1996-05-22 Teledyne Ind Optical lens system for light emitting diodes
GB2340301A (en) * 1998-07-28 2000-02-16 Oxley Dev Co Ltd Side illuminating light emitting diode
GB2340301B (en) * 1998-07-28 2003-06-18 Oxley Dev Co Ltd Side illuminating light emitting diode
DE19963264B4 (en) * 1999-12-17 2007-05-31 Optotransmitter-Umweltschutz-Technologie E.V. Carrier material for high-performance electronic components in SMD design and a high-performance electronic component produced therewith
US8174036B2 (en) * 2003-12-30 2012-05-08 Osram Opto Semiconductors Gmbh Lighting device
WO2005083805A1 (en) * 2004-02-26 2005-09-09 Matsushita Electric Industrial Co., Ltd. Led light source
US7227195B2 (en) 2004-02-26 2007-06-05 Matsushita Electric Industrial Co., Ltd. Led lamp including a plurality of led chips
US8975646B2 (en) 2004-05-31 2015-03-10 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and housing base for such a component
WO2007063489A1 (en) * 2005-12-02 2007-06-07 Koninklijke Philips Electronics N.V. Light emitting diode module
DE102008053489A1 (en) * 2008-10-28 2010-04-29 Osram Opto Semiconductors Gmbh Carrier body for a semiconductor device, semiconductor device and method for producing a carrier body
US8629549B2 (en) 2008-10-28 2014-01-14 Osram Opto Semiconductors Gmbh Carrier body for a semiconductor component, semiconductor component and method for producing a carrier body
EP3545561A4 (en) * 2017-08-25 2020-11-25 Cree Huizhou Solid State Lighting Company Ltd. Multiple led light source lens design in an integrated package
US11094852B2 (en) 2017-08-25 2021-08-17 Cree Huizhou Solid State Lighting Company Limited Multiple LED light source lens design in an integrated package

Also Published As

Publication number Publication date
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