JPH04107861U - light emitting display device - Google Patents

Abstract

(57) [Summary] [Purpose] To increase the brightness and directivity of a light emitting diode, and to facilitate and ensure suction by the suction collet 30. [Structure] A recess 15 having an inclined wall surface 16 is provided in the substrate 11, and light reflective wiring conductors 18 and 19 are provided on the inclined wall surface 16.
will be established. In addition to having a portion filling the recess 15, a pedestal portion 14a and a lens portion 14b protrude beyond the substrate 11.
A light-transmissive resin encapsulant 14 is provided. colette 3
In order to enable suction by zero, the lens portion 14b is arranged inside the pedestal portion 14a.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

The present invention relates to a surface-mounted light emitting display device that is highly photostimulable.

0002

[Conventional technology]

As shown in FIG. 6, a conventional surface-mounted light emitting diode has an insulating substrate 1 and an insulating substrate 1. Wiring conductors 5 and 6 arranged above, light emitting diode chip 2, and thin lead wire 3 and a light-transmissive resin sealing body 4. The tip side of the wiring conductors 5 and 6 is the substrate 1 The connection electrode is formed by extending to the back surface of the electrode. Therefore, the light emitting diode in Figure 6 is Surface mounting can be performed with the back surface of the substrate 1 facing downward.

0003 Today, there is a strong demand for higher brightness even for this type of surface-mounted light emitting diode. It is. As a means of realizing this, a light emitting diode chip 2 is placed on the top surface of the substrate 1. A structure in which a reflector is disposed to surround the reflector is known. This structure According to the company, higher brightness can be achieved compared to the light emitting diode shown in FIG. However, a separate The disadvantage is that the device becomes larger due to the reflector. to solve this kind of problem In order to achieve this, the inventor of the present invention provided an inclined part of the substrate 1 where the light emitting diode chip 2 is disposed. A recess with walls is formed, and a wiring conductor that also serves as a reflector is arranged on the sloped wall of the recess. I tried to make a photodiode. High brightness can be achieved with this light emitting diode. However, since a separate reflector is not required, the device does not become bulky.

0004

[Problem that the idea aims to solve]

By the way, there is a light-emitting table that can be mounted on a circuit board efficiently and reliably. display device is required.

[0005] Therefore, the purpose of the present invention is to achieve high brightness and high directivity. Both are light emitting display devices that can be mounted on circuit boards efficiently and reliably. Our goal is to provide the following.

[0006]

[Means to solve the problem]

To achieve the above purpose, this invention consists of an insulating substrate, a light emitting element, a thin lead wire, and a light emitting element. a transparent resin encapsulant, and a recess is formed on one main surface of the insulating substrate. The bottom and wall surfaces of the recess have light reflective properties and are electrically isolated from each other. A first wiring conductor and a second wiring conductor are formed on the lower surface of the light emitting element. A side electrode is fixed to the first wiring conductor on the bottom surface, and a side electrode is fixed to the first wiring conductor on the bottom surface, and The electrode on the upper surface side of the child is electrically connected to the second wiring conductor via the lead thin wire. The resin encapsulant is formed between the first wiring conductor and the second wiring conductor. the recess so as to cover the separated region formed, the light emitting element, and the thin lead wire; and a portion that protrudes from the upper surface of the insulating substrate and has a flat surface. a pedestal portion formed in the pedestal portion; and a lens portion formed to produce a lens action for the element. The present invention relates to a light emitting display device characterized by:

[0007]

[Effect]

According to the present invention, the first and second wiring conductors formed on the bottom and wall surfaces of the recess are Since it functions as a reflector, high brightness is achieved. Also, optically transparent resin sealing The directivity can be set arbitrarily depending on the lens part of the body. As a result, the photoirritability increases This makes it possible to realize a light-emitting display device. The resin sealing body has a pedestal part, and a lens part is placed inside this pedestal part. Since a vacuum suction device (collet) is applied to the pedestal, the light emitting display device is The position can be aspirated. Therefore, luminescent display can be performed without damaging the wiring conductor. The device can be efficiently and reliably suctioned.

[0008]

【Example】

Next, referring to FIGS. 1 to 5, a surface-mounted light emitting diode according to an embodiment of the present invention will be described. Explain the ode. As shown in FIG. 1, the light emitting diode of this embodiment includes an insulating substrate 11 and a light emitting diode. Consists of an iode chip 12, a thin lead wire 13, and a light-transmissive resin encapsulant 14 has been done. The insulating substrate 11, which has a rectangular planar shape, has an ultra-high heat resistance and moldability. It is made of functional resin, liquid crystal polymer, etc., and is formed using a well-known resin molding method. . A recess 15 formed approximately at the center of the insulating substrate 11 has an inclined wall surface 16. The angle of inclination of this wall surface 16 is about 45 degrees with respect to the plane including the bottom surface 17. Note that this angle of inclination is preferably in the range of 40 to 50 degrees to obtain good reflection. .

[0009] In the recess 15 of the insulating substrate 11, a first wiring conductor (electrode layer) having light reflectivity is provided. 18 and a second wiring conductor (electrode layer) 19 are formed. The first wiring conductor 18 and The second wiring conductor 19 has a separation region 20 along the center line in the short side direction of the insulating substrate 11. electrically isolated via The wall surface 16 and bottom surface 17 of the recess 15 are the separation area 2 All but 0 are covered with wiring conductors 18 and 19.

0010 Notches 21 and 22 are formed at both ends of the insulating substrate 11 in the long side direction. one One notch 22 has an arc shape when viewed from above, and the other notch 21 has a planar shape. It is rectangular in shape. The first and second wiring conductors 18 and 19 each have a notch. As shown in FIG. The sea urchin connection electrodes 23 and 24 are configured. The first and second wiring conductors 18 and 19 are From the insulating substrate 11 side, a copper layer with a thickness of about 10 μm, a nickel layer with a thickness of about 25 μm, a thickness of It becomes a three-layer metal layer with light reflective properties, which is made by sequentially plating silver layers with a thickness of about 5 μm. ing.

[0011] The lower surface side electrode (cathode electrode) of the light emitting diode chip 12 is connected to the bottom surface 1 of the recess 15. 7, it is fixed to the first wiring conductor 18. light emitting diode chip 12 The transparent electrode formed on the upper surface is electrically connected to the second wiring conductor 19 via the thin lead wire 13. physically connected.

0012 The resin sealing body 14 is made of a light-transmitting epoxy resin, and is made of a well-known transfer mode. It is formed by the rudo method. As is particularly clear from FIG. It has a pedestal part 14a and a lens part 14b, and the recess 15 is filled with a light emitting diode chip. The cap 12 and the thin lead wire 13 are coated. with a flat surface, as shown in Figure 1 The pedestal portion 14a is a part of both ends of the insulating substrate 11 in the long side direction, that is, the cutout portion 21, The surface of the insulating substrate 11 is coated except for a part of the side where the insulating substrate 22 is formed. Lens section The center point of 14b is located on the top surface of the light emitting diode chip 12 when viewed from above. It is formed like this and is arranged inside the pedestal part 14a.

[0013] The above light emitting diode is made of an insulating substrate with multiple cavities formed in it. A light emitting diode chip and thin lead wires are arranged, and the transfer molding method is used. A resin sealing body is formed so as to extend in the short side direction of the insulating substrate 11 shown in FIG. It is manufactured by dicing and individualizing it. Therefore, in this example Although a single-chip single-color light-emitting diode in which only one concave portion 15 is formed is shown, The number of recesses 15 can be selected arbitrarily to form a composite light emitting diode.

[0014] In the light emitting diode of this embodiment, the light emitted from the light emitting diode chip 12 is The path of the light is mainly a first path emitted from the top surface of the chip 12 and directed upward. , a second radiation emitted from the side surface of the chip 12, reflected by the side wall of the recess 15, and directed upward. Divided into routes. Here, the first and second wiring conductors 18 and 19 are connected to light emitting diodes. The light reflectance of the insulating substrate 11 for light in the wavelength range emitted by the hard chip 12 is It is sufficiently large compared to this. Therefore, the wall surface of the recess 15 is a reflective plate with a high light reflectance. functions as Therefore, the amount of light in the second path can be increased, resulting in a high Brightness can be increased.

[0015] Furthermore, in the diode of this embodiment, the center of the lens portion 14b of the resin sealing body 14 is flat. It is arranged so as to coincide with the center of the chip 12 when viewed from the surface. For this reason, the lens The lens action of the lens portion 14b can be effectively obtained, and sharp directivity can be obtained. as a result, A light emitting diode with high photostimulability can be obtained. Of course, the light emitting diode of this example does not require a separate reflector, so the device does not become bulky.

[0016] When mounting the light emitting diode on a circuit board (not shown), Place the tip of the collet (suction device) 30 on the top surface of the pedestal 14a, and The lens portion 14b is accommodated in the recess 31, and vacuum suction is applied. This allows the lens section to The light emitting diode can be reliably attracted regardless of 14b. Also, this Since the tip of the wire 30 does not touch the wiring conductors 18 and 19, such damage does not occur. .

[0017]

[Modified example]

The present invention is not limited to the above-mentioned embodiments, but can be modified as follows, for example. It is. (1) Even if the inclination angle of the wall surface 16 of the recess 15 is gradually increased from the bottom surface 17 side, good. This allows the planar size of the device to be reduced. in this case, It is desirable that the inclination angle of the portion facing the side surface of the chip 12 is 40 to 50 degrees. (2) The shape of the lens portion 14b can be variously modified depending on the required use. example For example, it may be cylindrical or spheroidal. (3) An annular groove is formed between the lens part 14b and the pedestal part 14a, and the lens part The lower side of 14b may be disposed below the upper surface of pedestal portion 14a. However, in this place In this case, the upper side of the lens portion 14b is It is desirable to make it protrude beyond the upper surface of the pedestal part 14a.

[0018]

[Effect of the idea]

According to the present invention, high brightness and high directivity can be achieved, and absorption during mounting can be achieved. It can be easily and reliably put on.

[Brief explanation of drawings]

[Fig. 1] Fig. 2 shows a light emitting diode according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line A-A of FIG.

FIG. 2 is a plan view of the light emitting diode of FIG. 1;

FIG. 3 is a diagram showing the relationship between the light emitting diode and collet in FIG. 2 on the right side of FIG. 2;

FIG. 4 is a bottom view of the light emitting diode of FIG. 2;

FIG. 5 is a plan view showing the light emitting diode of FIG. 2 with the resin sealant removed.

FIG. 6 is a perspective view of a conventional light emitting diode.

[Explanation of symbols]

11 Board 12 chips 14 Resin sealing body 14a Pedestal part 14b Lens section

Claims (1)

[Scope of utility model registration request] 1. A semiconductor device comprising an insulating substrate, a light emitting element, a thin lead wire, and a light-transmissive resin encapsulant, wherein a recess is formed on one main surface of the insulating substrate, and a bottom surface of the recess. A first wiring conductor and a second wiring conductor are formed on the wall surface and have a light reflective property and are electrically separated from each other, and the electrode on the lower surface side of the light emitting element is connected to the first
The electrode on the upper surface side of the light emitting element is electrically connected to the second wiring conductor via the thin lead wire, and the resin encapsulant is fixed to the first wiring conductor. A portion filling the recess so as to cover a separation region formed between the conductor and the second wiring conductor, the light emitting element and the thin lead wire, and a flat surface protruding from the upper surface of the insulating substrate. a pedestal portion formed to have a pedestal portion; and a lens portion disposed inside the pedestal portion when viewed in plan and formed to produce a lens action for the light emitting element. A light emitting display device characterized by: