KR910007381B1 - Led display device - Google Patents

Abstract

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Description

Light emitting diode (LED) display device

1 is a schematic cross-sectional view of a conventional LED unit,

2 is a schematic enlarged cross-sectional view of the first embodiment of the LED display device of the present invention.

3 is an enlarged exploded perspective view of a state in which a solid covering (solid cover) which is a solid of the LED display device of FIG. 2 is removed.

4 is a schematic enlarged cross-sectional view of a second embodiment of the LED display device of the present invention.

5 is an enlarged exploded perspective view of a state in which the fixing cover of the LED display device of FIG. 4 is removed.

6 is a schematic enlarged cross-sectional view of a third embodiment of the LED display device of the present invention.

7 is a perspective view of a reflector employed in the LED display device of FIG.

8 is a schematic enlarged cross-sectional view of a fourth embodiment of the LED display device of the present invention.

9 is an enlarged exploded perspective view of a state in which the fixing cover of the LED display device of FIG. 8 is removed.

10 is a schematic enlarged cross-sectional view of a fifth embodiment of the LED display device of the present invention.

* Description of the parts of the main parts of the drawings

10: LED 11: semiconductor chip

12: reflector 12A: arch-shaped surface

13 epoxy coating (fixed cover) 20 LED display device

21 substrate 22 pair of electrodes

22A: multiple pairs of electrodes 23: semiconductor chip, 24, 24A, 24R, 24L

L: Reflector 24B, 24S: Arched concave upper surface

25: cylindrical space portion (cylindrical opening)

26: solid cover (fixed cover) (semi-spherical protrusions)

27: outer rim 28: a pair of snow bumps

29: cutting part (opening part)

The present invention relates to a light emitting diode (LED) display device.

Generally, a light emitting diode (hereinafter referred to as "LED") is thickly coated or embedded by a transparent coating material made of a material such as epoxy resin which is installed on a pair of electrodes or terminals and is also transparent or colored. Loss is made of semiconductor chips.

When a bias voltage is applied to the LED, visible light is emitted. LEDs are being replaced by resistance-filament type lamps in many applications because of their small size, relatively high durability and relatively low voltage consumption.

However, the LED emits only a very limited amount of light or limited intensity of light; Increasing the size of the semiconductor light or increasing the bias voltage could not substantially improve the light emitting capability of the LED.

As a result of the analysis, it has been found that the coating covering the semiconductor chip of the LED unit is likely to absorb some of the light emitted from the chip, thereby reducing the amount of visible light.

In order to increase the amount of visible light emitted from the LED unit, a reflector 12 having an arch-shaped surface 12A, which is conventionally shown in FIG. 1, and disposed in the central portion of the reflector 12 An LED 10 having a semiconductor chip 11 and embedded in a transparent epoxy coating (fixed lid) 13 called "Bubble" has been proposed.

With this arrangement, part of the light lost in the LED unit without the reflector is reflected and becomes visible light, thereby improving the total amount of visible light emitted by the LED unit.

However, even with the above-described configuration, a substantial part of the light emitted from the semiconductor light is still not converted into visible light efficiently.

Accordingly, the main object of the present invention is to provide an improved LED display device that can provide a considerable amount of visible light.

It is a further object of the present invention to provide an improved LED display device that provides better display capability at a significantly lower cost.

In general, the LED display device of the present invention is a semiconductor chip fixedly mounted on a pair of electrodes and capable of emitting visible light when a voltage is applied, and a cylindrical space portion (opening part) for allowing the semiconductor chip to be disposed therein. It is composed of a reflector having a).

The cylindrical space portion (opening) of the reflector is filled with a transparent material such as an epoxy resin, and the upper portion of the filling material is formed of a solid covering having a solid shape having a substantially hemispherical or elliptical shape. .

In a preferred embodiment, the reflector is formed approximately flat on the upper surface and in another preferred embodiment the upper surface of the reflector is formed in an arch shape.

In another preferred embodiment, the reflector has a plurality of cylindrical spaces, each space having one or more semiconductor chips disposed therein, each cylindrical space each having a rigid, transparent and hemispherical sheath. It has a sieve (cover), and these coatings are selectively integrally connected with other hemispherical sheaths to form the LED display device as an integrated solid unit.

EXAMPLE

An embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment]

First, the first embodiment of the present invention is schematically shown in FIG. 2 and FIG.

The LED display device indicated by reference numeral 20 in FIG. 2 includes a substrate 21 having a pair of electrodes 22 in the form of a printed circuit, and mounted on the pair of electrodes 22. A substantially disk-shaped reflector 24 having a semiconductor chip 23 and a cylindrical opening (space) for forming a cylindrical space (opening) 25 for allowing the semiconductor chip 23 to be disposed therein; And a substantially hemispherical fixed cover (solid cover) 26 that fills the cylindrical space 25 containing the semiconductor chip 23.

The fixing lid 26 is made of a transparent material such as epoxy vertical, optionally colored or uncolored, so that on the cylindrical space portion 25 in which the semiconductor chip 23 is located, a substantially hemispherical shape is formed. Forming protrusions.

The substrate 21 also has a pair of seating protrusions 28 electrically connected to the pair of electrodes 22. In order to manufacture the LED display apparatus of FIG. 2, the semiconductor chip 23 is first mounted on the pair of electrodes 22 of the board | substrate 21 which is a printed circuit board.

Subsequently, in this way, the substrate 21 on which the semiconductor chip 23 is placed is placed in a first mold (not shown), and then the cylindrical space portion (opening portion) 25 is placed on the substrate 21. The reflector 24 having the above position is positioned to be aligned or fitted to the semiconductor chip 23.

Next, the second mold having a space portion having the same shape as that of the fixing lid 26 is placed above the first mold with the space portion facing downward, whereby the semiconductor chip 23 and the reflector are placed. The substrate 21 having 24 is covered.

Next, a coating material in a liquid state such as an epoxy resin is filled into the space portion of the second mold through an injection hole of a second mold not shown.

Finally, a curing step of curing the coating material is performed to complete molding of the lid of the LED display device.

In the first embodiment described above, the LED device is shown having a reflector having only one cylindrical space portion (opening), but the reflector has a plurality of cylindrical space portions corresponding to a plurality of semiconductor chips mounted on the substrate. It is to be understood that each of these cylindrical spaces may be provided with a hemispherical fixing cover 26.

Second Embodiment

4 and 5, a second embodiment of the LED display device of the present invention is shown, which is shown in FIG. 5, in which the cylindrical space portion 25 containing the semiconductor chip 23 is incorporated. And the hemispherical fixed cover 26 has an outer rim 27 covering the entire reflector 24, except that the reflector 24 is provided with a cutout (opening) 29. This configuration is similar to that of the first embodiment, and as such, the fixed cover 26 is connected to or bonded to the substrate 21 to perform a separate bonding process for adhering the reflector 24 onto the substrate 21. It is possible to secure the reflector 24 on the substrate 21 without the need.

Third Embodiment

6 shows a third embodiment of the LED display device of the present invention.

In this embodiment, instead of having a flat upper surface as in the first embodiment, a reflector 24A having an arch-shaped concave upper surface 24B as shown in FIG. 7 is used. A substantially hemispherical fixed cover 26 covers the cylindrical space portion (opening) 25 and part or all of the concave surface of the reflector 24A.

The configuration of the cylindrical space portion (opening portion) 25 in which the semiconductor chip 23 is placed is the same as in the first embodiment. In use, a part of the light emitted from the semiconductor chip 23 is randomly reflected by the cylindrical wall of the cylindrical opening (space part) 25, and the light reflected randomly in this way is also randomly hemispherical. The light emitted through the cover 26 and thus randomly reflected and emitted and the remaining portions of the light emitted directly from the semiconductor chip 23 have a cylindrical space portion in which the semiconductor chip is located, thereby becoming the total amount of light emitted. Compared with the conventional LED without a reflector, it emits a much larger amount of effective visible light.

Fourth Embodiment

8 and 9 show a fourth embodiment of the LED display device of the present invention, which comprises a plurality of pairs of electrodes 22A and each pair of electrodes 22A formed of a printed circuit on one side. The plurality of semiconductor chips 23, 23 and the plurality of semiconductor chips 23, respectively, which are installed on the substrate, and the plurality of semiconductor chips 23, respectively, correspond to the semiconductor chips 23, 23 so as to be disposed therein. Has a substantially circular reflector 24R having a plurality of cylindrical openings (spaces) 25, 25 and each cylindrical opening (space) 25 has a semiconductor chip 23 therein. The openings 25 are filled with a covering material, which is a solid, each forming a substantially hemispherical protrusion 26, and the hemispherical protrusions 26, which are coatings of these solids, have these hemispherical protrusions 26, ( 26 to be connected to each other to form an integrated coating covering the entirety of the reflector 24R. It has been configured such that the outer rim section 27 is provided.

The coating material is closely bonded to the substrate 21 on the reflector 24R, so that a reflector (or a reflector) is formed on the substrate 21 without requiring a separate bonding process for adhering the reflector 24R on the substrate 24. In order to ensure 24R), the cutting part 29 as needed is provided.

[Example 5]

FIG. 10 shows a fifth embodiment of the improved LED display device of the present invention, which is a substrate 21 having a plurality of semiconductor chips 23 and a plurality of cylindrical openings corresponding to the semiconductor chips 23. FIG. It has a circular reflector 24L having a 25, and the reflector 24L is a solid transparent coating body having a plurality of projections 26 corresponding to the plurality of cylindrical openings 25 of the reflector 24L. It is comprised so that it may have the Aichi-shaped concave upper surface 24S coat | covered with (fixing cover).

In this embodiment, the rest of the configuration is the same as that of the fourth embodiment except that the upper surface of the reflector is concave.

The device of this embodiment further enhances the reflection of light emitted from the LED.

In the above-described preferred embodiments of the present invention, cylindrical spaces (openings) are employed, but these cylindrical spaces (openings) are inverse conical spaces for imparting different optical performance to the apparatus. Openings).

On the other hand, it is possible to obtain an advantage of providing a better mechanical perfection and reducing the manufacturing cost by integrally forming a transparent transparent coating having a plurality of protrusions.

Meanwhile, in the above-described preferred embodiments, one semiconductor chip is disposed in each cylindrical space portion and the reflector is shown and described to be formed in a substantially cylindrical shape, but one or more semiconductor chips are provided in order to increase the intensity of emitted light. It may be disposed in the cylindrical space portion of and the reflector may be made in a rectangular or other shape.

In addition, various modifications within the scope not departing from the spirit and scope of the invention defined in the claims of the present specification can be easily thought by those skilled in the art. have.

Claims (6)

A semiconductor chip 23 capable of emitting visible light when a voltage is applied; Reflectors 24, 24A having a pair of electrodes 22 on which the semiconductor chip 23 is mounted, cylindrical openings 25 on which the semiconductor chip 23 is disposed, and the cylindrical openings ( 25 is a solid covering body (fixed cover) 26 having a portion for filling the cylindrical opening 25, and having a portion for filling the cylindrical opening 25, and formed in a substantially hemispherical protrusion shape. Light emitting diode (LED) display device consisting of. The light emitting diode (LED) display device according to claim 1, wherein the solid cover (26) has an outer edge (27) covering the entire reflector (24). The pair of electrodes 22 according to claim 2 is formed as a printed circuit on a substrate 21 and the reflector 24 extends through the opening 29 to the reflector 24 so that the substrate ( Light-emitting diode (LED) display device, characterized in that it has an opening (29) to be bonded to the 21 4. Display device according to claim 3, characterized in that the reflector (24A) has an arched concave upper surface (24B). A substrate 21; A plurality of pairs of electrodes (22A, 22A) formed as a printed circuit on one side of the substrate (21); The plurality of semiconductor chips 23 and 23 are respectively bonded on the pair of electrodes 22A of the plurality of pairs of electrodes 22A and 22A, and may emit visible light when a voltage is applied. ) And; The plurality of semiconductor chips 23, 23 secured on the substrate 21 and described above are disposed in respective corresponding plurality of cylindrical openings 25, 25, respectively. Reflectors 24L, 24R having a plurality of cylindrical openings 25, 25 corresponding to the plurality of semiconductor chips 23, 23; A portion which covers the reflectors 24L and 24R to secure the substrates 24L and 24R on the substrate 21 and fills the cylindrical openings 25 and 25; A solid transparent coating body 26 having a plurality of roughly hemispherical protrusions corresponding to the cylindrical openings 25 and 25, wherein the plurality of hemispherical protrusions are formed as a single fixed fixture. Light emitting diode (LED) display device consisting of. The light emitting diode (LED) display according to claim 5, characterized in that a plurality of semiconductor chips (23) and (23) are disposed in one cylindrical opening (25) of the reflectors (24L) and (24R). Device.

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