GB8714527D0 - Diode display - Google Patents

Diode display

Info

Publication number
GB8714527D0
GB8714527D0 GB878714527A GB8714527A GB8714527D0 GB 8714527 D0 GB8714527 D0 GB 8714527D0 GB 878714527 A GB878714527 A GB 878714527A GB 8714527 A GB8714527 A GB 8714527A GB 8714527 D0 GB8714527 D0 GB 8714527D0
Authority
GB
United Kingdom
Prior art keywords
diode display
diode
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB878714527A
Other versions
GB2206444A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHENG YUE WEN
Original Assignee
CHENG YUE WEN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19873719338 external-priority patent/DE3719338A1/en
Application filed by CHENG YUE WEN filed Critical CHENG YUE WEN
Priority to GB08714527A priority Critical patent/GB2206444A/en
Publication of GB8714527D0 publication Critical patent/GB8714527D0/en
Publication of GB2206444A publication Critical patent/GB2206444A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
GB08714527A 1987-06-10 1987-06-22 Light emitting diode Withdrawn GB2206444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08714527A GB2206444A (en) 1987-06-10 1987-06-22 Light emitting diode

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19873719338 DE3719338A1 (en) 1987-06-10 1987-06-10 LED DISPLAY DEVICE
GB08714527A GB2206444A (en) 1987-06-10 1987-06-22 Light emitting diode

Publications (2)

Publication Number Publication Date
GB8714527D0 true GB8714527D0 (en) 1987-07-29
GB2206444A GB2206444A (en) 1989-01-05

Family

ID=25856501

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08714527A Withdrawn GB2206444A (en) 1987-06-10 1987-06-22 Light emitting diode

Country Status (1)

Country Link
GB (1) GB2206444A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4920404A (en) * 1989-05-12 1990-04-24 Hewlett-Packard Company Low stress light-emitting diode mounting package
US5167556A (en) * 1990-07-03 1992-12-01 Siemens Aktiengesellschaft Method for manufacturing a light emitting diode display means
GB2295274A (en) * 1994-11-17 1996-05-22 Teledyne Ind Optical lens system for light emitting diodes
GB2340301B (en) * 1998-07-28 2003-06-18 Oxley Dev Co Ltd Side illuminating light emitting diode
DE19963264B4 (en) * 1999-12-17 2007-05-31 Optotransmitter-Umweltschutz-Technologie E.V. Carrier material for high-performance electronic components in SMD design and a high-performance electronic component produced therewith
US8174036B2 (en) * 2003-12-30 2012-05-08 Osram Opto Semiconductors Gmbh Lighting device
CN100391020C (en) 2004-02-26 2008-05-28 松下电器产业株式会社 Led lamp
US8975646B2 (en) 2004-05-31 2015-03-10 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and housing base for such a component
EP1958270A1 (en) * 2005-12-02 2008-08-20 Koninklijke Philips Electronics N.V. Light emitting diode module
DE102008053489A1 (en) * 2008-10-28 2010-04-29 Osram Opto Semiconductors Gmbh Carrier body for a semiconductor device, semiconductor device and method for producing a carrier body
CN110447110B (en) * 2017-08-25 2022-12-23 惠州科锐半导体照明有限公司 Multiple LED light source lens design in integrated package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676668A (en) * 1969-12-29 1972-07-11 Gen Electric Solid state lamp assembly
US3780357A (en) * 1973-02-16 1973-12-18 Hewlett Packard Co Electroluminescent semiconductor display apparatus and method of fabricating the same
EP0206176B1 (en) * 1985-06-28 1992-01-02 Takiron Co. Ltd. An optical guide matrix for a dot-matrix luminous display

Also Published As

Publication number Publication date
GB2206444A (en) 1989-01-05

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)