GB1298115A - Electric circuit module - Google Patents

Electric circuit module

Info

Publication number
GB1298115A
GB1298115A GB35468/70A GB3546870A GB1298115A GB 1298115 A GB1298115 A GB 1298115A GB 35468/70 A GB35468/70 A GB 35468/70A GB 3546870 A GB3546870 A GB 3546870A GB 1298115 A GB1298115 A GB 1298115A
Authority
GB
United Kingdom
Prior art keywords
connections
solder
wettable
joints
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB35468/70A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US850094A external-priority patent/US3871015A/en
Priority claimed from US850093A external-priority patent/US3871014A/en
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1298115A publication Critical patent/GB1298115A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays

Landscapes

  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
GB35468/70A 1969-08-14 1970-07-22 Electric circuit module Expired GB1298115A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US850094A US3871015A (en) 1969-08-14 1969-08-14 Flip chip module with non-uniform connector joints
US850093A US3871014A (en) 1969-08-14 1969-08-14 Flip chip module with non-uniform solder wettable areas on the substrate

Publications (1)

Publication Number Publication Date
GB1298115A true GB1298115A (en) 1972-11-29

Family

ID=27126902

Family Applications (1)

Application Number Title Priority Date Filing Date
GB35468/70A Expired GB1298115A (en) 1969-08-14 1970-07-22 Electric circuit module

Country Status (2)

Country Link
FR (1) FR2057697A5 (https=)
GB (1) GB1298115A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2194387A (en) * 1986-08-20 1988-03-02 Plessey Co Plc Bonding integrated circuit devices

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4228387A (en) * 1977-09-14 1980-10-14 Exxon Research & Engineering Co. Variable reluctance stepper motor drive and method of operation as a DC brushless motor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2194387A (en) * 1986-08-20 1988-03-02 Plessey Co Plc Bonding integrated circuit devices

Also Published As

Publication number Publication date
DE2031725A1 (de) 1971-02-18
DE2031725B2 (https=) 1974-11-07
FR2057697A5 (https=) 1971-05-21

Similar Documents

Publication Publication Date Title
GB1109806A (en) Improvements in the interconnection of electrical circuit devices
JPS5331967A (en) Method of assembling circuit package
TW358230B (en) Semiconductor package
CA941980A (en) Flip chip module with non-uniform solder wettable areas on the substrate
FR2579798B1 (fr) Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede
GB1362136A (en) Transistor package
GB1352557A (en) Wire scribed circuit boards
FR2020723A1 (https=)
DE3115017A1 (de) Elektronisches bauelement
ATE39395T1 (de) Ueberbrueckungselement.
GB1515160A (en) Electrically integrated circuit package protectors
JPS552735B1 (https=)
GB1152809A (en) Electric Circuit Assembly
FR2057697A5 (https=)
GB1445591A (en) Mounting integrated circuit elements
GB1273175A (en) Semi-conductor devices
GB1234314A (https=)
GB1106530A (en) A metallic bridge for a thermoelectric arrangement
JPS55165657A (en) Multi-chip package
GB1369995A (en) Electrical connecting devices
JPS6459947A (en) Semiconductor device
JPS5645039A (en) Optical head
JPS6471165A (en) Resin capsule sealed multi-chip modular circuit
JPS6450539A (en) Connection of electronic component and transfer type microlead faceplate used therefor
GB1199231A (en) Improvements in or relating to Printed Circuit Structures

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee