GB1297235A - - Google Patents

Info

Publication number
GB1297235A
GB1297235A GB1297235DA GB1297235A GB 1297235 A GB1297235 A GB 1297235A GB 1297235D A GB1297235D A GB 1297235DA GB 1297235 A GB1297235 A GB 1297235A
Authority
GB
United Kingdom
Prior art keywords
wafer
etching
sept
break
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1297235A publication Critical patent/GB1297235A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30608—Anisotropic liquid etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Weting (AREA)
  • Dicing (AREA)
  • ing And Chemical Polishing (AREA)
  • Silicon Compounds (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
GB1297235D 1970-09-30 1971-09-23 Expired GB1297235A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7677770A 1970-09-30 1970-09-30

Publications (1)

Publication Number Publication Date
GB1297235A true GB1297235A (enrdf_load_stackoverflow) 1972-11-22

Family

ID=22134121

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1297235D Expired GB1297235A (enrdf_load_stackoverflow) 1970-09-30 1971-09-23

Country Status (9)

Country Link
JP (1) JPS5010095B1 (enrdf_load_stackoverflow)
BE (1) BE773286A (enrdf_load_stackoverflow)
CA (1) CA926035A (enrdf_load_stackoverflow)
DE (1) DE2147703A1 (enrdf_load_stackoverflow)
ES (2) ES395341A1 (enrdf_load_stackoverflow)
FR (1) FR2108602A5 (enrdf_load_stackoverflow)
GB (1) GB1297235A (enrdf_load_stackoverflow)
NL (1) NL7113366A (enrdf_load_stackoverflow)
SE (1) SE382772B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1667798B (zh) * 2004-03-08 2011-11-02 株式会社东芝 晶片的分割方法、装置、半导体器件的制造方法、制造装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5284894A (en) * 1975-12-30 1977-07-14 Matsushita Electric Works Ltd Shoulder patting device circuit configuration
JPS5284893A (en) * 1975-12-30 1977-07-14 Matsushita Electric Works Ltd Shoulder patting device circuit configuration

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1667798B (zh) * 2004-03-08 2011-11-02 株式会社东芝 晶片的分割方法、装置、半导体器件的制造方法、制造装置

Also Published As

Publication number Publication date
AU3334071A (en) 1973-03-15
ES395341A1 (es) 1974-12-16
NL7113366A (enrdf_load_stackoverflow) 1972-04-05
CA926035A (en) 1973-05-08
DE2147703A1 (de) 1972-04-06
ES419651A1 (es) 1976-05-16
FR2108602A5 (enrdf_load_stackoverflow) 1972-05-19
BE773286A (fr) 1972-01-17
JPS5010095B1 (enrdf_load_stackoverflow) 1975-04-18
SE382772B (sv) 1976-02-16

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees