ES395341A1 - Un metodo para romper un cuerpo de material monocristalino, fragil. - Google Patents

Un metodo para romper un cuerpo de material monocristalino, fragil.

Info

Publication number
ES395341A1
ES395341A1 ES395341A ES395341A ES395341A1 ES 395341 A1 ES395341 A1 ES 395341A1 ES 395341 A ES395341 A ES 395341A ES 395341 A ES395341 A ES 395341A ES 395341 A1 ES395341 A1 ES 395341A1
Authority
ES
Spain
Prior art keywords
breaking
translation
machine
legally binding
google translate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES395341A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of ES395341A1 publication Critical patent/ES395341A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30608—Anisotropic liquid etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Weting (AREA)
  • Silicon Compounds (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • ing And Chemical Polishing (AREA)
ES395341A 1970-09-30 1971-09-23 Un metodo para romper un cuerpo de material monocristalino, fragil. Expired ES395341A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7677770A 1970-09-30 1970-09-30

Publications (1)

Publication Number Publication Date
ES395341A1 true ES395341A1 (es) 1974-12-16

Family

ID=22134121

Family Applications (2)

Application Number Title Priority Date Filing Date
ES395341A Expired ES395341A1 (es) 1970-09-30 1971-09-23 Un metodo para romper un cuerpo de material monocristalino, fragil.
ES419651A Expired ES419651A1 (es) 1970-09-30 1973-10-15 Un metodo para dividir un cuerpo monocristalino fragil.

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES419651A Expired ES419651A1 (es) 1970-09-30 1973-10-15 Un metodo para dividir un cuerpo monocristalino fragil.

Country Status (9)

Country Link
JP (1) JPS5010095B1 (es)
BE (1) BE773286A (es)
CA (1) CA926035A (es)
DE (1) DE2147703A1 (es)
ES (2) ES395341A1 (es)
FR (1) FR2108602A5 (es)
GB (1) GB1297235A (es)
NL (1) NL7113366A (es)
SE (1) SE382772B (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5284893A (en) * 1975-12-30 1977-07-14 Matsushita Electric Works Ltd Shoulder patting device circuit configuration
JPS5284894A (en) * 1975-12-30 1977-07-14 Matsushita Electric Works Ltd Shoulder patting device circuit configuration
JP4515790B2 (ja) * 2004-03-08 2010-08-04 株式会社東芝 半導体装置の製造方法及びその製造装置

Also Published As

Publication number Publication date
AU3334071A (en) 1973-03-15
SE382772B (sv) 1976-02-16
DE2147703A1 (de) 1972-04-06
NL7113366A (es) 1972-04-05
GB1297235A (es) 1972-11-22
FR2108602A5 (es) 1972-05-19
CA926035A (en) 1973-05-08
ES419651A1 (es) 1976-05-16
BE773286A (fr) 1972-01-17
JPS5010095B1 (es) 1975-04-18

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