GB1294623A - Improvements in or relating to semiconductor components - Google Patents

Improvements in or relating to semiconductor components

Info

Publication number
GB1294623A
GB1294623A GB08752/71D GB1875271D GB1294623A GB 1294623 A GB1294623 A GB 1294623A GB 08752/71 D GB08752/71 D GB 08752/71D GB 1875271 D GB1875271 D GB 1875271D GB 1294623 A GB1294623 A GB 1294623A
Authority
GB
United Kingdom
Prior art keywords
base
june
synthetic resin
lugs
encapsulant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08752/71D
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of GB1294623A publication Critical patent/GB1294623A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
GB08752/71D 1970-06-04 1971-06-03 Improvements in or relating to semiconductor components Expired GB1294623A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702027598 DE2027598A1 (de) 1970-06-04 1970-06-04 Halbleiterbauelement mit Kunststoff abdeckung

Publications (1)

Publication Number Publication Date
GB1294623A true GB1294623A (en) 1972-11-01

Family

ID=5773077

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08752/71D Expired GB1294623A (en) 1970-06-04 1971-06-03 Improvements in or relating to semiconductor components

Country Status (7)

Country Link
US (1) US3713007A (enExample)
CA (1) CA937336A (enExample)
CH (1) CH518620A (enExample)
DE (1) DE2027598A1 (enExample)
FR (1) FR2094027A1 (enExample)
GB (1) GB1294623A (enExample)
NL (1) NL7107723A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3916435A (en) * 1974-09-09 1975-10-28 Gen Motors Corp Heat sink assembly for button diode rectifiers
US4196444A (en) * 1976-12-03 1980-04-01 Texas Instruments Deutschland Gmbh Encapsulated power semiconductor device with single piece heat sink mounting plate
DE2727178A1 (de) * 1977-06-16 1979-01-04 Bosch Gmbh Robert Gleichrichteranordnung
US4375578A (en) * 1981-02-06 1983-03-01 General Dynamics, Pomona Division Semiconductor device and method of making the same
DE19549202B4 (de) * 1995-12-30 2006-05-04 Robert Bosch Gmbh Gleichrichterdiode
JPH11307682A (ja) * 1998-04-23 1999-11-05 Hitachi Ltd 半導体装置
US20040263007A1 (en) * 2003-05-19 2004-12-30 Wetherill Associates, Inc. Thermal transfer container for semiconductor component
JP4961398B2 (ja) * 2008-06-30 2012-06-27 株式会社日立製作所 半導体装置

Also Published As

Publication number Publication date
CA937336A (en) 1973-11-20
US3713007A (en) 1973-01-23
CH518620A (de) 1972-01-31
FR2094027A1 (enExample) 1972-02-04
DE2027598A1 (de) 1971-12-09
NL7107723A (enExample) 1971-12-07

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees