CH518620A - Halbleiterbauelement mit Kunststoffabdeckung - Google Patents

Halbleiterbauelement mit Kunststoffabdeckung

Info

Publication number
CH518620A
CH518620A CH585971A CH585971A CH518620A CH 518620 A CH518620 A CH 518620A CH 585971 A CH585971 A CH 585971A CH 585971 A CH585971 A CH 585971A CH 518620 A CH518620 A CH 518620A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
plastic cover
plastic
cover
semiconductor
Prior art date
Application number
CH585971A
Other languages
English (en)
Inventor
Walter Georg
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH518620A publication Critical patent/CH518620A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CH585971A 1970-06-04 1971-04-22 Halbleiterbauelement mit Kunststoffabdeckung CH518620A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702027598 DE2027598A1 (de) 1970-06-04 1970-06-04 Halbleiterbauelement mit Kunststoff abdeckung

Publications (1)

Publication Number Publication Date
CH518620A true CH518620A (de) 1972-01-31

Family

ID=5773077

Family Applications (1)

Application Number Title Priority Date Filing Date
CH585971A CH518620A (de) 1970-06-04 1971-04-22 Halbleiterbauelement mit Kunststoffabdeckung

Country Status (7)

Country Link
US (1) US3713007A (de)
CA (1) CA937336A (de)
CH (1) CH518620A (de)
DE (1) DE2027598A1 (de)
FR (1) FR2094027A1 (de)
GB (1) GB1294623A (de)
NL (1) NL7107723A (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3916435A (en) * 1974-09-09 1975-10-28 Gen Motors Corp Heat sink assembly for button diode rectifiers
US4196444A (en) * 1976-12-03 1980-04-01 Texas Instruments Deutschland Gmbh Encapsulated power semiconductor device with single piece heat sink mounting plate
DE2727178A1 (de) * 1977-06-16 1979-01-04 Bosch Gmbh Robert Gleichrichteranordnung
US4375578A (en) * 1981-02-06 1983-03-01 General Dynamics, Pomona Division Semiconductor device and method of making the same
DE19549202B4 (de) * 1995-12-30 2006-05-04 Robert Bosch Gmbh Gleichrichterdiode
JPH11307682A (ja) * 1998-04-23 1999-11-05 Hitachi Ltd 半導体装置
US20040263007A1 (en) * 2003-05-19 2004-12-30 Wetherill Associates, Inc. Thermal transfer container for semiconductor component
JP4961398B2 (ja) * 2008-06-30 2012-06-27 株式会社日立製作所 半導体装置

Also Published As

Publication number Publication date
CA937336A (en) 1973-11-20
FR2094027A1 (de) 1972-02-04
DE2027598A1 (de) 1971-12-09
GB1294623A (en) 1972-11-01
NL7107723A (de) 1971-12-07
US3713007A (en) 1973-01-23

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Legal Events

Date Code Title Description
PL Patent ceased