GB1255334A - Integrated circuits - Google Patents
Integrated circuitsInfo
- Publication number
- GB1255334A GB1255334A GB56906/68A GB5690668A GB1255334A GB 1255334 A GB1255334 A GB 1255334A GB 56906/68 A GB56906/68 A GB 56906/68A GB 5690668 A GB5690668 A GB 5690668A GB 1255334 A GB1255334 A GB 1255334A
- Authority
- GB
- United Kingdom
- Prior art keywords
- mesas
- substrate
- electrodes
- strips
- photo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68727867A | 1967-12-01 | 1967-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1255334A true GB1255334A (en) | 1971-12-01 |
Family
ID=24759796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB56906/68A Expired GB1255334A (en) | 1967-12-01 | 1968-11-29 | Integrated circuits |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE1812157A1 (https=) |
| FR (1) | FR1593872A (https=) |
| GB (1) | GB1255334A (https=) |
| NL (1) | NL6817108A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3919602A (en) * | 1972-03-23 | 1975-11-11 | Bosch Gmbh Robert | Electric circuit arrangement and method of making the same |
-
1968
- 1968-11-29 NL NL6817108A patent/NL6817108A/xx unknown
- 1968-11-29 FR FR1593872D patent/FR1593872A/fr not_active Expired
- 1968-11-29 GB GB56906/68A patent/GB1255334A/en not_active Expired
- 1968-12-02 DE DE19681812157 patent/DE1812157A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE1812157A1 (de) | 1969-07-17 |
| NL6817108A (https=) | 1969-06-03 |
| FR1593872A (https=) | 1970-06-01 |
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