GB1259602A - - Google Patents

Info

Publication number
GB1259602A
GB1259602A GB409468A GB1259602DA GB1259602A GB 1259602 A GB1259602 A GB 1259602A GB 409468 A GB409468 A GB 409468A GB 1259602D A GB1259602D A GB 1259602DA GB 1259602 A GB1259602 A GB 1259602A
Authority
GB
United Kingdom
Prior art keywords
gold
pillars
layer
resist
underlay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB409468A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1259602A publication Critical patent/GB1259602A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB409468A 1968-01-26 1968-01-26 Expired GB1259602A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB409468 1968-01-26

Publications (1)

Publication Number Publication Date
GB1259602A true GB1259602A (https=) 1972-01-05

Family

ID=9770635

Family Applications (1)

Application Number Title Priority Date Filing Date
GB409468A Expired GB1259602A (https=) 1968-01-26 1968-01-26

Country Status (1)

Country Link
GB (1) GB1259602A (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2211759A1 (https=) * 1972-12-26 1974-07-19 Ibm
GB2174840A (en) * 1985-04-29 1986-11-12 Energy Conversion Devices Inc Surface mounted circuits and methods of preparing the circuits
GB2237691A (en) * 1989-10-30 1991-05-08 Mitsubishi Electric Corp Semiconductor device and wiring board module
DE4038168A1 (de) * 1990-11-30 1992-06-04 Daimler Benz Ag Multichip-modul und verfahren zu dessen herstellung
WO2006134220A1 (en) * 2005-06-16 2006-12-21 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
CN101199244B (zh) * 2005-06-16 2012-06-27 伊姆贝拉电子有限公司 电路板结构的制造方法和电路板结构

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2211759A1 (https=) * 1972-12-26 1974-07-19 Ibm
GB2174840A (en) * 1985-04-29 1986-11-12 Energy Conversion Devices Inc Surface mounted circuits and methods of preparing the circuits
GB2237691A (en) * 1989-10-30 1991-05-08 Mitsubishi Electric Corp Semiconductor device and wiring board module
GB2237691B (en) * 1989-10-30 1993-08-25 Mitsubishi Electric Corp Electronic device
DE4038168A1 (de) * 1990-11-30 1992-06-04 Daimler Benz Ag Multichip-modul und verfahren zu dessen herstellung
DE4038168C2 (de) * 1990-11-30 1998-09-24 Daimler Benz Ag Verfahren zur Herstellung eines Multichip-Moduls
WO2006134220A1 (en) * 2005-06-16 2006-12-21 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
GB2441265A (en) * 2005-06-16 2008-02-27 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
GB2441265B (en) * 2005-06-16 2012-01-11 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
CN101199244B (zh) * 2005-06-16 2012-06-27 伊姆贝拉电子有限公司 电路板结构的制造方法和电路板结构
US8225499B2 (en) 2005-06-16 2012-07-24 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee