NL6817108A - - Google Patents

Info

Publication number
NL6817108A
NL6817108A NL6817108A NL6817108A NL6817108A NL 6817108 A NL6817108 A NL 6817108A NL 6817108 A NL6817108 A NL 6817108A NL 6817108 A NL6817108 A NL 6817108A NL 6817108 A NL6817108 A NL 6817108A
Authority
NL
Netherlands
Application number
NL6817108A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6817108A publication Critical patent/NL6817108A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01Manufacture or treatment
    • H10W70/05Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
NL6817108A 1967-12-01 1968-11-29 NL6817108A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68727867A 1967-12-01 1967-12-01

Publications (1)

Publication Number Publication Date
NL6817108A true NL6817108A (https=) 1969-06-03

Family

ID=24759796

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6817108A NL6817108A (https=) 1967-12-01 1968-11-29

Country Status (4)

Country Link
DE (1) DE1812157A1 (https=)
FR (1) FR1593872A (https=)
GB (1) GB1255334A (https=)
NL (1) NL6817108A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3919602A (en) * 1972-03-23 1975-11-11 Bosch Gmbh Robert Electric circuit arrangement and method of making the same

Also Published As

Publication number Publication date
GB1255334A (en) 1971-12-01
DE1812157A1 (de) 1969-07-17
FR1593872A (https=) 1970-06-01

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