GB1243175A - Electrical component assemblies - Google Patents

Electrical component assemblies

Info

Publication number
GB1243175A
GB1243175A GB40090/67A GB4009067A GB1243175A GB 1243175 A GB1243175 A GB 1243175A GB 40090/67 A GB40090/67 A GB 40090/67A GB 4009067 A GB4009067 A GB 4009067A GB 1243175 A GB1243175 A GB 1243175A
Authority
GB
United Kingdom
Prior art keywords
substrate
circuits
slide
secured
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB40090/67A
Other languages
English (en)
Inventor
Ronald William Rigby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd filed Critical Lucas Industries Ltd
Priority to GB40090/67A priority Critical patent/GB1243175A/en
Priority to US755691A priority patent/US3558993A/en
Priority to DE19681791024 priority patent/DE1791024B1/de
Priority to FR1577883D priority patent/FR1577883A/fr
Publication of GB1243175A publication Critical patent/GB1243175A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Casings For Electric Apparatus (AREA)
  • Multi-Conductor Connections (AREA)
GB40090/67A 1967-09-01 1967-09-01 Electrical component assemblies Expired GB1243175A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB40090/67A GB1243175A (en) 1967-09-01 1967-09-01 Electrical component assemblies
US755691A US3558993A (en) 1967-09-01 1968-08-27 Electrical component assemblies with improved printed circuit construction
DE19681791024 DE1791024B1 (de) 1967-09-01 1968-08-29 Leiterplatte und verfahren zu deren herstellung
FR1577883D FR1577883A (https=) 1967-09-01 1968-09-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB40090/67A GB1243175A (en) 1967-09-01 1967-09-01 Electrical component assemblies

Publications (1)

Publication Number Publication Date
GB1243175A true GB1243175A (en) 1971-08-18

Family

ID=10413156

Family Applications (1)

Application Number Title Priority Date Filing Date
GB40090/67A Expired GB1243175A (en) 1967-09-01 1967-09-01 Electrical component assemblies

Country Status (4)

Country Link
US (1) US3558993A (https=)
DE (1) DE1791024B1 (https=)
FR (1) FR1577883A (https=)
GB (1) GB1243175A (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3848077A (en) * 1970-10-16 1974-11-12 M Whitman Package for electronic semiconductor devices
US3885304A (en) * 1972-03-23 1975-05-27 Bosch Gmbh Robert Electric circuit arrangement and method of making the same
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
DE3030620A1 (de) * 1980-08-13 1982-03-11 Siemens AG, 1000 Berlin und 8000 München Anordnung zur aenderung der elektrischen schaltungskonfiguration von integrierten halbleiterschaltkreisen
FR2498814B1 (fr) * 1981-01-26 1985-12-20 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
US4377316A (en) * 1981-02-27 1983-03-22 International Business Machines Corporation High density interconnection means for chip carriers
US4633573A (en) * 1982-10-12 1987-01-06 Aegis, Inc. Microcircuit package and sealing method
US4860166A (en) * 1983-09-06 1989-08-22 Raytheon Company Integrated circuit termination device
US4560826A (en) * 1983-12-29 1985-12-24 Amp Incorporated Hermetically sealed chip carrier
US4802859A (en) * 1988-04-01 1989-02-07 Gte Products Corporation Electrical connector
FR2640846B1 (fr) * 1988-12-16 1996-04-12 Thomson Csf Dispositif d'encapsulation hermetique pour composants electroniques
FR2654891A1 (fr) * 1989-11-20 1991-05-24 Alcatel Radiotelephone Blindage pour circuit radiofrequence.
DE4008658A1 (de) * 1990-03-17 1991-09-19 Rohde & Schwarz Mikrowellen-schaltung
DE4129917A1 (de) * 1991-09-09 1993-03-11 Bodenseewerk Geraetetech Hermetisch dichte baugruppe
US5750926A (en) * 1995-08-16 1998-05-12 Alfred E. Mann Foundation For Scientific Research Hermetically sealed electrical feedthrough for use with implantable electronic devices
US6516808B2 (en) 1997-09-12 2003-02-11 Alfred E. Mann Foundation For Scientific Research Hermetic feedthrough for an implantable device
FR2897503B1 (fr) * 2006-02-16 2014-06-06 Valeo Sys Controle Moteur Sas Procede de fabrication d'un module electronique par fixation sequentielle des composants et ligne de production correspondante

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1059988B (de) * 1955-12-09 1959-06-25 Ibm Deutschland Elektrische Baugruppe
DE1069236B (https=) * 1956-09-04 1959-11-19
DE1233924B (de) * 1960-08-22 1967-02-09 Amphenol Corp Als Bauelement ausgebildete mit eingebauten Schaltelementen versehene elektrische Schaltung und Verfahren zu ihrer Herstellung

Also Published As

Publication number Publication date
US3558993A (en) 1971-01-26
FR1577883A (https=) 1969-08-08
DE1791024B1 (de) 1971-05-19

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