GB1126327A - Electroless copper plating - Google Patents
Electroless copper platingInfo
- Publication number
- GB1126327A GB1126327A GB1815566A GB1815566A GB1126327A GB 1126327 A GB1126327 A GB 1126327A GB 1815566 A GB1815566 A GB 1815566A GB 1815566 A GB1815566 A GB 1815566A GB 1126327 A GB1126327 A GB 1126327A
- Authority
- GB
- United Kingdom
- Prior art keywords
- april
- oxides
- reducing agent
- atoms per
- rare earths
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010949 copper Substances 0.000 title abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 title abstract 2
- 238000007747 plating Methods 0.000 title 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical group O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052787 antimony Inorganic materials 0.000 abstract 2
- 229910052785 arsenic Inorganic materials 0.000 abstract 2
- 239000003638 chemical reducing agent Substances 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 229910052746 lanthanum Inorganic materials 0.000 abstract 2
- 229910052702 rhenium Inorganic materials 0.000 abstract 2
- 150000003839 salts Chemical class 0.000 abstract 2
- 239000000243 solution Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 229910052721 tungsten Inorganic materials 0.000 abstract 2
- 229910052720 vanadium Inorganic materials 0.000 abstract 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 abstract 1
- DJHGAFSJWGLOIV-UHFFFAOYSA-K Arsenate3- Chemical class [O-][As]([O-])([O-])=O DJHGAFSJWGLOIV-UHFFFAOYSA-K 0.000 abstract 1
- 101150003085 Pdcl gene Proteins 0.000 abstract 1
- 150000001242 acetic acid derivatives Chemical class 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 229910052767 actinium Inorganic materials 0.000 abstract 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract 1
- APUPEJJSWDHEBO-UHFFFAOYSA-P ammonium molybdate Chemical compound [NH4+].[NH4+].[O-][Mo]([O-])(=O)=O APUPEJJSWDHEBO-UHFFFAOYSA-P 0.000 abstract 1
- 229940010552 ammonium molybdate Drugs 0.000 abstract 1
- 235000018660 ammonium molybdate Nutrition 0.000 abstract 1
- 239000011609 ammonium molybdate Substances 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 abstract 1
- 150000004820 halides Chemical class 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 229910052758 niobium Inorganic materials 0.000 abstract 1
- 150000002823 nitrates Chemical class 0.000 abstract 1
- 239000003002 pH adjusting agent Substances 0.000 abstract 1
- 150000003014 phosphoric acid esters Chemical class 0.000 abstract 1
- 230000000087 stabilizing effect Effects 0.000 abstract 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical class [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US45133565A | 1965-04-27 | 1965-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1126327A true GB1126327A (en) | 1968-09-05 |
Family
ID=23791808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1815566A Expired GB1126327A (en) | 1965-04-27 | 1966-04-26 | Electroless copper plating |
Country Status (6)
| Country | Link |
|---|---|
| AT (1) | AT270331B (enrdf_load_stackoverflow) |
| CH (1) | CH476856A (enrdf_load_stackoverflow) |
| DE (1) | DE1521444B1 (enrdf_load_stackoverflow) |
| DK (1) | DK131998C (enrdf_load_stackoverflow) |
| GB (1) | GB1126327A (enrdf_load_stackoverflow) |
| SE (1) | SE339372B (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2747562A1 (de) * | 1977-10-20 | 1979-05-03 | Schering Ag | Verfahren und anlage zur wiedergewinnung von im abwasser von anlagen zur chemischen oberflaechenbehandlung befindlichen metallen und anderen wertstoffen |
| EP0132594A1 (en) * | 1983-07-25 | 1985-02-13 | Hitachi, Ltd. | Electroless copper plating solution |
-
1966
- 1966-04-25 AT AT388566A patent/AT270331B/de active
- 1966-04-25 CH CH597466A patent/CH476856A/de not_active IP Right Cessation
- 1966-04-25 DE DE19661521444 patent/DE1521444B1/de active Pending
- 1966-04-26 DK DK211466A patent/DK131998C/da active
- 1966-04-26 GB GB1815566A patent/GB1126327A/en not_active Expired
- 1966-04-27 SE SE572466A patent/SE339372B/xx unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2747562A1 (de) * | 1977-10-20 | 1979-05-03 | Schering Ag | Verfahren und anlage zur wiedergewinnung von im abwasser von anlagen zur chemischen oberflaechenbehandlung befindlichen metallen und anderen wertstoffen |
| EP0132594A1 (en) * | 1983-07-25 | 1985-02-13 | Hitachi, Ltd. | Electroless copper plating solution |
Also Published As
| Publication number | Publication date |
|---|---|
| SE339372B (enrdf_load_stackoverflow) | 1971-10-04 |
| DE1521444B1 (de) | 1969-11-06 |
| AT270331B (de) | 1969-04-25 |
| DK131998B (da) | 1975-10-06 |
| CH476856A (de) | 1969-08-15 |
| DK131998C (da) | 1976-05-03 |
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