GB1103905A - Improvements in or relating to the production of encapsulated electrical components - Google Patents

Improvements in or relating to the production of encapsulated electrical components

Info

Publication number
GB1103905A
GB1103905A GB39962/65A GB3996265A GB1103905A GB 1103905 A GB1103905 A GB 1103905A GB 39962/65 A GB39962/65 A GB 39962/65A GB 3996265 A GB3996265 A GB 3996265A GB 1103905 A GB1103905 A GB 1103905A
Authority
GB
United Kingdom
Prior art keywords
resin
housing
sept
semi
hardened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB39962/65A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of GB1103905A publication Critical patent/GB1103905A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
GB39962/65A 1964-09-21 1965-09-20 Improvements in or relating to the production of encapsulated electrical components Expired GB1103905A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0093267 1964-09-21

Publications (1)

Publication Number Publication Date
GB1103905A true GB1103905A (en) 1968-02-21

Family

ID=7517854

Family Applications (1)

Application Number Title Priority Date Filing Date
GB39962/65A Expired GB1103905A (en) 1964-09-21 1965-09-20 Improvements in or relating to the production of encapsulated electrical components

Country Status (3)

Country Link
CH (1) CH445648A (https=)
GB (1) GB1103905A (https=)
NL (1) NL6509449A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2429995A1 (fr) * 1978-06-28 1980-01-25 Ducellier & Cie Detecteur de proximite
JPS62500830A (ja) * 1984-11-17 1987-04-02 メツセルシユミツト−ベルコウ−ブロ−ム・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング 超小型電子回路を有機部材で封止する方法およびこの方法に適した材料による回路素子
WO1997011905A1 (en) * 1995-09-28 1997-04-03 Alliedsignal Inc. Hydrogen and moisture getter and absorber for sealed devices
JP2003096301A (ja) * 2001-09-25 2003-04-03 Shin Etsu Chem Co Ltd 電気・電子部品封止・シール用シリコーンゴム組成物

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2429995A1 (fr) * 1978-06-28 1980-01-25 Ducellier & Cie Detecteur de proximite
JPS62500830A (ja) * 1984-11-17 1987-04-02 メツセルシユミツト−ベルコウ−ブロ−ム・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング 超小型電子回路を有機部材で封止する方法およびこの方法に適した材料による回路素子
WO1997011905A1 (en) * 1995-09-28 1997-04-03 Alliedsignal Inc. Hydrogen and moisture getter and absorber for sealed devices
US5888925A (en) * 1995-09-28 1999-03-30 Alliedsignal Inc. Hydrogen and moisture getter and absorber for sealed devices
JP2003096301A (ja) * 2001-09-25 2003-04-03 Shin Etsu Chem Co Ltd 電気・電子部品封止・シール用シリコーンゴム組成物

Also Published As

Publication number Publication date
CH445648A (de) 1967-10-31
NL6509449A (https=) 1966-03-22

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