GB1062365A - A method of electroplating an ohmic contact bump upon a semiconductor body - Google Patents

A method of electroplating an ohmic contact bump upon a semiconductor body

Info

Publication number
GB1062365A
GB1062365A GB5009/66A GB500966A GB1062365A GB 1062365 A GB1062365 A GB 1062365A GB 5009/66 A GB5009/66 A GB 5009/66A GB 500966 A GB500966 A GB 500966A GB 1062365 A GB1062365 A GB 1062365A
Authority
GB
United Kingdom
Prior art keywords
ohmic contact
electroplating
contact bump
semiconductor body
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5009/66A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of GB1062365A publication Critical patent/GB1062365A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonic waves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
GB5009/66A 1965-03-01 1966-02-04 A method of electroplating an ohmic contact bump upon a semiconductor body Expired GB1062365A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43598965A 1965-03-01 1965-03-01

Publications (1)

Publication Number Publication Date
GB1062365A true GB1062365A (en) 1967-03-22

Family

ID=23730652

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5009/66A Expired GB1062365A (en) 1965-03-01 1966-02-04 A method of electroplating an ohmic contact bump upon a semiconductor body

Country Status (2)

Country Link
GB (1) GB1062365A (cg-RX-API-DMAC7.html)
NL (1) NL6602548A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2151859A3 (en) * 2008-08-08 2011-08-17 Fei Company Method of determining characteristics of a transistor in an integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2151859A3 (en) * 2008-08-08 2011-08-17 Fei Company Method of determining characteristics of a transistor in an integrated circuit
US8278220B2 (en) 2008-08-08 2012-10-02 Fei Company Method to direct pattern metals on a substrate

Also Published As

Publication number Publication date
NL6602548A (cg-RX-API-DMAC7.html) 1966-09-02

Similar Documents

Publication Publication Date Title
GB1074974A (en) Semiconductor device manufacture
GB936264A (en) Improvements in brazing and brazing alloys
GB983840A (en) A gallium arsenide semiconductor device having at least one rectifying contact formed by alloying
BE754151A (fr) Bain aqueux pour le placage electrolytique d'or ou d'alliage d'or sur un article conducteur, procede de fabrication dudit bain aqueux et utilisation de celui-ci
FR2203169B3 (cg-RX-API-DMAC7.html)
MY7300496A (en) Method of fitting semiconductor pellet on metal body
GB1429705A (en) Selective metallization of nonconductors
JPS5727050A (en) Lead frame and semiconductor device using said lead frame
GB1034750A (en) Bath for electroless deposition of cobalt-iron-phosphorus alloy
JPS5735358A (en) Lead frame and semiconductor device using said frame
GB934559A (en) Method of preparing an age-hardened coated metal alloy article
DK136960B (da) Fremgangsmåde til elektroplettering med nikkel og bad til anvendelse derved.
GB1278927A (en) A method of manufacturing a lead frame for a semiconductor device
JPS56129349A (en) Method of manufacturing airtight terminal
IT948076B (it) Procedimento per depositare un rivestimnto metallico su un pezzo di titanio od una lega di titanio e pezzo di titanio o in lega di titanio munito di un rivestimento metallico ottenuto mediante l at tuazione di questo procedimento
GB1246781A (en) Silver electroplated wires
KARUPPANAN et al. MEASUREMENT OF THE THICKNESS OF ELECTROPLATES BY ELECTROLYTIC STRIPPING METHOD: STRIPPING SOLUTIONS FOR SILVER OVER COPPER, BRASS, MILD STEEL AND NICKEL
GB962281A (en) Gold-plating process
GB868064A (en) Extrusion and drawing of beryllium
Graf et al. THE PROBLEM OF STRESS CORROSION OF HOMOGENEOUS SOLID SOLUTIONS. PART VI. STRESS CORROSION WITH BRASS, TRANSLATION BY L. P. COSTAS, ANACONDA
GB1023339A (en) Bright gold alloy electroplating
DK105308C (da) Vandigt, kemisk nikkelpletteringsbad og fremgangsmåde til plettering med dette bad.
JPS5534473A (en) Stem for semiconductor device
LAUB THE POSSIBILITIES OF PREVENTING THE STRESS CORROSION OF BRASS BY ELECTROPLATED COATINGS--PARTS I AND II
Corrie et al. The Effect Of Exposure Time On The Embrittlement Of Cu-2% Be Alloy By Liquid Amalgam