JPS5534473A - Stem for semiconductor device - Google Patents

Stem for semiconductor device

Info

Publication number
JPS5534473A
JPS5534473A JP10751978A JP10751978A JPS5534473A JP S5534473 A JPS5534473 A JP S5534473A JP 10751978 A JP10751978 A JP 10751978A JP 10751978 A JP10751978 A JP 10751978A JP S5534473 A JPS5534473 A JP S5534473A
Authority
JP
Japan
Prior art keywords
film
gold
stem
fitted
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10751978A
Other languages
Japanese (ja)
Other versions
JPS6249987B2 (en
Inventor
Nobuo Otani
Masahiro Ichiki
Shinichi Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Hitachi Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd, Hitachi Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP10751978A priority Critical patent/JPS5534473A/en
Publication of JPS5534473A publication Critical patent/JPS5534473A/en
Publication of JPS6249987B2 publication Critical patent/JPS6249987B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To reduce the cost of a stem by plating with gold the metal-plated surface of parts where semiconductor pellets are fitted to a header and both leads and wires are bonded. CONSTITUTION:The surfaces of a metal header 1 of a stem and leads 2, 3, 4 are coated by a Ni-sn alloy plated film 6. Moreover, the upper surface of the metal header 1 to which semiconductor pellets are fitted and the upper end to which wires for leads 2, 3, 4 are fitted are partially coated with gold-plated film 8 through Ni-plated film 7. The Ni film 7 prevents the Sn of the Ni-Sn film 6 and the gold of the gold film 8 from mixing. Co may be used as a protecting film. In this method, as the whole metal body is covered with Ni-Sn film, oxidation is prevented and as gold is carried out only partially cost can be reduced.
JP10751978A 1978-09-04 1978-09-04 Stem for semiconductor device Granted JPS5534473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10751978A JPS5534473A (en) 1978-09-04 1978-09-04 Stem for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10751978A JPS5534473A (en) 1978-09-04 1978-09-04 Stem for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5534473A true JPS5534473A (en) 1980-03-11
JPS6249987B2 JPS6249987B2 (en) 1987-10-22

Family

ID=14461246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10751978A Granted JPS5534473A (en) 1978-09-04 1978-09-04 Stem for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5534473A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03124272U (en) * 1990-03-29 1991-12-17

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS516057U (en) * 1974-06-29 1976-01-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS516057U (en) * 1974-06-29 1976-01-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03124272U (en) * 1990-03-29 1991-12-17

Also Published As

Publication number Publication date
JPS6249987B2 (en) 1987-10-22

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