GB1050998A - - Google Patents
Info
- Publication number
- GB1050998A GB1050998A GB1050998DA GB1050998A GB 1050998 A GB1050998 A GB 1050998A GB 1050998D A GB1050998D A GB 1050998DA GB 1050998 A GB1050998 A GB 1050998A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wafer
- face
- layer
- soldered
- chromium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/027—Graded interfaces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2933664 | 1964-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1050998A true GB1050998A (https=) | 1900-01-01 |
Family
ID=10289944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1050998D Expired GB1050998A (https=) | 1964-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1050998A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2035107A1 (https=) * | 1969-03-20 | 1970-12-18 | Matsushita Electric Industrial Co Ltd | |
| EP0072273A3 (en) * | 1981-07-13 | 1985-01-02 | FAIRCHILD CAMERA & INSTRUMENT CORPORATION | Low temperature integrated circuit die attachment process |
-
0
- GB GB1050998D patent/GB1050998A/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2035107A1 (https=) * | 1969-03-20 | 1970-12-18 | Matsushita Electric Industrial Co Ltd | |
| EP0072273A3 (en) * | 1981-07-13 | 1985-01-02 | FAIRCHILD CAMERA & INSTRUMENT CORPORATION | Low temperature integrated circuit die attachment process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR840005933A (ko) | 전계효과 트랜지스터의 제조방법 | |
| US3602782A (en) | Conductor-insulator-semiconductor fieldeffect transistor with semiconductor layer embedded in dielectric underneath interconnection layer | |
| GB1058250A (en) | Improvements in and relating to the manufacture of semiconductor devices | |
| US3305708A (en) | Insulated-gate field-effect semiconductor device | |
| GB1023531A (en) | Improvements in or relating to semiconductor devices | |
| GB1053069A (https=) | ||
| GB1050998A (https=) | ||
| US3716765A (en) | Semiconductor device with protective glass sealing | |
| GB1145879A (en) | Semiconductor device fabrication | |
| GB1282616A (en) | Semiconductor devices | |
| GB1053046A (https=) | ||
| JPS58148463A (ja) | Mes型電界効果トランジスタ | |
| JPS58148464A (ja) | Mes型電界効果トランジスタ | |
| GB1230880A (https=) | ||
| GB1015588A (en) | Improvements in or relating to semiconductor devices | |
| JPS56130948A (en) | Semiconductor device | |
| JPS58207677A (ja) | ペアmosトランジスタの製造方法 | |
| GB1321503A (en) | Method for manufacturing a barrier-layer field-effect transistor | |
| JPS5467387A (en) | Field effect transistor | |
| JPS6241430B2 (https=) | ||
| JPS6279673A (ja) | 電界効果トランジスタ | |
| JPS60225469A (ja) | 絶縁基板上mos形電界効果トランジスタ | |
| JPS6020584A (ja) | 半導体装置の製法 | |
| US3400308A (en) | Metallic contacts for semiconductor devices | |
| GB1039257A (en) | Semiconductor devices |