GB1036579A - Improvements in and relating to electroplating baths - Google Patents

Improvements in and relating to electroplating baths

Info

Publication number
GB1036579A
GB1036579A GB4814/65A GB481465A GB1036579A GB 1036579 A GB1036579 A GB 1036579A GB 4814/65 A GB4814/65 A GB 4814/65A GB 481465 A GB481465 A GB 481465A GB 1036579 A GB1036579 A GB 1036579A
Authority
GB
United Kingdom
Prior art keywords
compound
residue
relating
acid
sulphonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4814/65A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DEHYDAG GmbH
Dehydag Deutsche Hydrierwerke GmbH
Original Assignee
DEHYDAG GmbH
Dehydag Deutsche Hydrierwerke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DEHYDAG GmbH, Dehydag Deutsche Hydrierwerke GmbH filed Critical DEHYDAG GmbH
Publication of GB1036579A publication Critical patent/GB1036579A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D295/00Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
    • C07D295/16Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms acylated on ring nitrogen atoms
    • C07D295/20Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms acylated on ring nitrogen atoms by radicals derived from carbonic acid, or sulfur or nitrogen analogues thereof
    • C07D295/21Radicals derived from sulfur analogues of carbonic acid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B61RAILWAYS
    • B61DBODY DETAILS OR KINDS OF RAILWAY VEHICLES
    • B61D3/00Wagons or vans
    • B61D3/16Wagons or vans adapted for carrying special loads
    • B61D3/18Wagons or vans adapted for carrying special loads for vehicles
    • B61D3/182Wagons or vans adapted for carrying special loads for vehicles specially adapted for heavy vehicles, e.g. public work vehicles, trucks, trailers
    • B61D3/184Wagons or vans adapted for carrying special loads for vehicles specially adapted for heavy vehicles, e.g. public work vehicles, trucks, trailers the heavy vehicles being of the trailer or semi-trailer type
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

An acid electroplating bath for copper-plating, e.g. comprising 210 g/l CuSO4 and 60 g/l H2SO4, having a chlorine ion concentration above 60 mg/l, contains as levelling agent e.g. in amount of 0.001-20 g/l a compound of the formula:- <FORM:1036579/C6-C7/1> in which R, R1 and R2 are H, aliphatic, cycloaliphati or aromatic radicals, or R is further dithiocarbamic acid-S-methyl ester residue corresponding to above formula and R1 and R2 together with the adjacent N form a heterocyclic ring, the compound being free from sulphonic or carboxylic acid groups. Examples are give e.g. N, N-diethylthiocarbamylmercapto-methyl-N1-phenylthiourea. The bath may further contains as lustring agents sulphonic acids or their salts having at least one thiourea residue and at least one dithiocarbamic acid residue.
GB4814/65A 1964-03-07 1965-02-04 Improvements in and relating to electroplating baths Expired GB1036579A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DED43821A DE1248415B (en) 1964-03-07 1964-03-07 Acid galvanic copper baths

Publications (1)

Publication Number Publication Date
GB1036579A true GB1036579A (en) 1966-07-20

Family

ID=7047882

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4814/65A Expired GB1036579A (en) 1964-03-07 1965-02-04 Improvements in and relating to electroplating baths

Country Status (10)

Country Link
US (1) US3400059A (en)
AT (1) AT254647B (en)
BE (1) BE660606A (en)
BR (1) BR6567577D0 (en)
CH (1) CH450859A (en)
DE (1) DE1248415B (en)
FR (1) FR1425983A (en)
GB (1) GB1036579A (en)
NL (1) NL147194B (en)
SE (1) SE303075B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112030199A (en) * 2020-08-27 2020-12-04 江苏艾森半导体材料股份有限公司 High-speed electro-coppering additive for advanced packaging and electroplating solution

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3725220A (en) * 1972-04-27 1973-04-03 Lea Ronal Inc Electrodeposition of copper from acidic baths
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1007592B (en) * 1955-01-19 1957-05-02 Dehydag Gmbh Bath for the production of galvanic metal coatings
NL274211A (en) * 1961-02-02
DE1177142B (en) * 1961-07-08 1964-09-03 Dehydag Gmbh Process for the preparation of dithiocarbamic acid ester derivatives containing sulfonic acid groups
DE1184172B (en) * 1961-08-31 1964-12-23 Dehydag Gmbh Process for the galvanic deposition of firmly adhering and high-gloss copper coatings

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112030199A (en) * 2020-08-27 2020-12-04 江苏艾森半导体材料股份有限公司 High-speed electro-coppering additive for advanced packaging and electroplating solution

Also Published As

Publication number Publication date
SE303075B (en) 1968-08-12
NL6501501A (en) 1965-09-08
AT254647B (en) 1967-05-26
NL147194B (en) 1975-09-15
CH450859A (en) 1968-04-30
BE660606A (en) 1965-09-06
FR1425983A (en) 1966-01-24
DE1248415B (en) 1967-08-24
BR6567577D0 (en) 1973-12-27
US3400059A (en) 1968-09-03

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