GB1036165A - Improvements in or relating to semiconductor devices - Google Patents
Improvements in or relating to semiconductor devicesInfo
- Publication number
- GB1036165A GB1036165A GB3786/64A GB378664A GB1036165A GB 1036165 A GB1036165 A GB 1036165A GB 3786/64 A GB3786/64 A GB 3786/64A GB 378664 A GB378664 A GB 378664A GB 1036165 A GB1036165 A GB 1036165A
- Authority
- GB
- United Kingdom
- Prior art keywords
- silicon
- header
- transistor
- strips
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
- H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
- H10P14/6308—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
- H10P14/6309—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors of silicon in uncombined form, i.e. pure silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6322—Formation by thermal treatments
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/161—Containers comprising no base
Landscapes
- Die Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US421178A US3324357A (en) | 1964-01-29 | 1964-12-28 | Multi-terminal semiconductor device having active element directly mounted on terminal leads |
| DE1514736A DE1514736C3 (de) | 1964-01-29 | 1965-01-21 | Verfahren zum Herstellen einer Mehrzahl von Halbleiterbauelementen |
| DE19651514739 DE1514739A1 (de) | 1962-05-25 | 1965-01-27 | Elektrische Halbleitervorrichtung |
| NL6501142A NL6501142A (https=) | 1964-01-29 | 1965-01-29 | |
| BE659002D BE659002A (https=) | 1962-05-25 | 1965-01-29 | |
| BE659001D BE659001A (https=) | 1962-05-25 | 1965-01-29 | |
| FR3688A FR1427264A (fr) | 1964-01-29 | 1965-01-29 | Perfectionnements aux dispositifs semi-conducteurs |
| NL6501141A NL6501141A (https=) | 1964-01-29 | 1965-01-29 | |
| DE19651514742 DE1514742A1 (de) | 1964-01-29 | 1965-02-06 | Halbleiteranordnung |
| NL6501745A NL6501745A (https=) | 1964-01-29 | 1965-02-12 | |
| BE659624D BE659624A (https=) | 1964-01-29 | 1965-02-12 | |
| FR8137A FR87924E (fr) | 1964-01-29 | 1965-03-05 | Perfectionnements aux dispositifs semi-conducteurs |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB20201/62A GB1010111A (en) | 1962-05-25 | 1962-05-25 | Vapour deposition of metallic films |
| GB36013/62A GB1044689A (en) | 1962-09-21 | 1962-09-21 | Improvements in or relating to mountings for semi-conductor devices |
| GB39650/62A GB1023531A (en) | 1962-05-25 | 1962-10-19 | Improvements in or relating to semiconductor devices |
| DEST19973A DE1179280B (de) | 1962-11-09 | 1962-11-09 | Verfahren zur Herstellung von loetfaehigen Kontaktstellen |
| GB48863/62A GB1024216A (en) | 1962-05-25 | 1962-12-28 | Improvements in or relating to circuit modules including semiconductor devices |
| GB9636/64A GB1036167A (en) | 1962-05-25 | 1964-03-06 | Improvements in or relating to semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1036165A true GB1036165A (en) | 1966-07-13 |
Family
ID=27544935
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3786/64A Expired GB1036165A (en) | 1962-05-25 | 1964-01-29 | Improvements in or relating to semiconductor devices |
| GB9636/64A Expired GB1036167A (en) | 1962-05-25 | 1964-03-06 | Improvements in or relating to semiconductor devices |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9636/64A Expired GB1036167A (en) | 1962-05-25 | 1964-03-06 | Improvements in or relating to semiconductor devices |
Country Status (2)
| Country | Link |
|---|---|
| BE (1) | BE660746A (https=) |
| GB (2) | GB1036165A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2545653A1 (fr) * | 1983-05-04 | 1984-11-09 | Pichot Michel | Procede et dispositif d'encapsulation de circuits integres |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4235014A (en) | 1979-03-26 | 1980-11-25 | Western Electric Company, Inc. | Apparatus for assembling a plurality of articles |
| US4253280A (en) | 1979-03-26 | 1981-03-03 | Western Electric Company, Inc. | Method of labelling directional characteristics of an article having two opposite major surfaces |
-
1964
- 1964-01-29 GB GB3786/64A patent/GB1036165A/en not_active Expired
- 1964-03-06 GB GB9636/64A patent/GB1036167A/en not_active Expired
-
1965
- 1965-03-08 BE BE660746D patent/BE660746A/xx unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2545653A1 (fr) * | 1983-05-04 | 1984-11-09 | Pichot Michel | Procede et dispositif d'encapsulation de circuits integres |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1036167A (en) | 1966-07-13 |
| BE660746A (https=) | 1965-09-08 |
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