GB1010111A - Vapour deposition of metallic films - Google Patents

Vapour deposition of metallic films

Info

Publication number
GB1010111A
GB1010111A GB20201/62A GB2020162A GB1010111A GB 1010111 A GB1010111 A GB 1010111A GB 20201/62 A GB20201/62 A GB 20201/62A GB 2020162 A GB2020162 A GB 2020162A GB 1010111 A GB1010111 A GB 1010111A
Authority
GB
United Kingdom
Prior art keywords
substrate
chromium
gold
deposit
aluminium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB20201/62A
Inventor
Stanley Gerald Ayling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE639640D priority Critical patent/BE639640A/xx
Priority to NL298258D priority patent/NL298258A/xx
Priority to BE632739D priority patent/BE632739A/xx
Priority to BE637621D priority patent/BE637621A/xx
Priority to NL292995D priority patent/NL292995A/xx
Priority to NL299522D priority patent/NL299522A/xx
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB20201/62A priority patent/GB1010111A/en
Priority to GB39650/62A priority patent/GB1023531A/en
Priority to GB48863/62A priority patent/GB1024216A/en
Priority to CH630763A priority patent/CH422927A/en
Priority to DEI23747A priority patent/DE1288174B/en
Priority to FR935770A priority patent/FR1363491A/en
Priority to FR948183A priority patent/FR84370E/en
Priority to US312930A priority patent/US3270256A/en
Priority to CH1256863A priority patent/CH468719A/en
Priority to DE1963J0024586 priority patent/DE1302005C2/en
Priority to CH1357663A priority patent/CH424889A/en
Priority to SE12333/63A priority patent/SE316221B/xx
Priority to FR953110A priority patent/FR85051E/en
Priority to FR958398A priority patent/FR85314E/en
Priority to GB3786/64A priority patent/GB1036165A/en
Priority to GB9636/64A priority patent/GB1036167A/en
Priority to GB18179/64A priority patent/GB1033785A/en
Priority to DE19651514739 priority patent/DE1514739A1/en
Priority to BE659002D priority patent/BE659002A/xx
Priority to BE659001D priority patent/BE659001A/xx
Priority to BE660746D priority patent/BE660746A/xx
Publication of GB1010111A publication Critical patent/GB1010111A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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    • H01L2224/0554External layer
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    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
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    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/484Connecting portions
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    • H01L2224/48599Principal constituent of the connecting portion of the wire connector being Gold (Au)
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
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  • Die Bonding (AREA)

Abstract

<PICT:1010111/C6-C7/1> A metallic film deposit on an insulating substrate, such as glass or plastic, contains a metal which is adhesive to the substrate material and a soft-solderable metal, the deposit being graded in composition so that the content of adhesive metal is substantially 100% near the substrate and decreases progressively and substantially uniformly to 0% at the exposed surface. The decrease may take place in a number of steps by building up the deposit of a number of homogeneous sub-layers with a finite thickness of adhesive metal adjacent the substrate and a finite thickness of soft-solderable metal over the graded sub-layers. In an example a glass substrate 1 is rinsed in acetone, dried by baking in air and ioncleaned, then placed in inverted glass bell-jars. Molybdenum boats 6 and 7 contain respectively chemically cleaned chromium and gold and are separated by a shield 11. The boats are separately heated according to a determined schedule to deposit on the substrate, through mask 12, a layer of chromium followed by a graded layer of chromium and gold and finally a layer of gold, aluminium shutter 13 being moved aside during deposition of the metals. Reference is also made to coating with chromium and copper, a final annealing in a non-oxidizing atmoshere being necessary to prevent formation of a surface oxide film. Also, chromium and gold may be deposited on an aluminium film in the production of aluminium-silica-aluminium capacitors.
GB20201/62A 1962-05-25 1962-05-25 Vapour deposition of metallic films Expired GB1010111A (en)

Priority Applications (27)

Application Number Priority Date Filing Date Title
NL298258D NL298258A (en) 1962-05-25
BE632739D BE632739A (en) 1962-05-25
BE637621D BE637621A (en) 1962-05-25
NL292995D NL292995A (en) 1962-05-25
NL299522D NL299522A (en) 1962-05-25
BE639640D BE639640A (en) 1962-05-25
GB20201/62A GB1010111A (en) 1962-05-25 1962-05-25 Vapour deposition of metallic films
GB39650/62A GB1023531A (en) 1962-05-25 1962-10-19 Improvements in or relating to semiconductor devices
GB48863/62A GB1024216A (en) 1962-05-25 1962-12-28 Improvements in or relating to circuit modules including semiconductor devices
CH630763A CH422927A (en) 1962-05-25 1963-05-20 Metal layer on an insulating base
DEI23747A DE1288174B (en) 1962-05-25 1963-05-21 Metallic coating on an insulating base
FR935770A FR1363491A (en) 1962-05-25 1963-05-22 Adhering metal layer for electrical connections, in particular for semiconductor components
FR948183A FR84370E (en) 1962-05-25 1963-09-20 Adhering metal layer for electrical connections, in particular for semiconductor components
US312930A US3270256A (en) 1962-05-25 1963-10-01 Continuously graded electrode of two metals for semiconductor devices
CH1256863A CH468719A (en) 1962-05-25 1963-10-14 Semiconductor device
DE1963J0024586 DE1302005C2 (en) 1962-05-25 1963-10-18 USE OF A METALLIC COATING AS A LARGE AREA CONNECTION FOR PLENAR SEMICONDUCTOR ELEMENTS
CH1357663A CH424889A (en) 1962-05-25 1963-11-05 Process for the production of solderable contact points
SE12333/63A SE316221B (en) 1962-05-25 1963-11-08
FR953110A FR85051E (en) 1962-05-25 1963-11-08 Adhering metal layer for electrical connections, in particular for semiconductor components
FR958398A FR85314E (en) 1962-05-25 1963-12-24 Adhering metal layer for electrical connections, in particular for semiconductor components
GB3786/64A GB1036165A (en) 1962-05-25 1964-01-29 Improvements in or relating to semiconductor devices
GB9636/64A GB1036167A (en) 1962-05-25 1964-03-06 Improvements in or relating to semiconductor devices
GB18179/64A GB1033785A (en) 1962-05-25 1964-05-01 Improvements in or relating to semiconductor devices
DE19651514739 DE1514739A1 (en) 1962-05-25 1965-01-27 Electric semiconductor device
BE659002D BE659002A (en) 1962-05-25 1965-01-29
BE659001D BE659001A (en) 1962-05-25 1965-01-29
BE660746D BE660746A (en) 1962-05-25 1965-03-08

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB20201/62A GB1010111A (en) 1962-05-25 1962-05-25 Vapour deposition of metallic films
GB18179/64A GB1033785A (en) 1962-05-25 1964-05-01 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB1010111A true GB1010111A (en) 1965-11-17

Family

ID=62527904

Family Applications (2)

Application Number Title Priority Date Filing Date
GB20201/62A Expired GB1010111A (en) 1962-05-25 1962-05-25 Vapour deposition of metallic films
GB18179/64A Expired GB1033785A (en) 1962-05-25 1964-05-01 Improvements in or relating to semiconductor devices

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GB18179/64A Expired GB1033785A (en) 1962-05-25 1964-05-01 Improvements in or relating to semiconductor devices

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3496513A (en) * 1967-11-17 1970-02-17 Sprague Electric Co Film resistor with securely soldered leads
EP1733096B2 (en) 2004-03-27 2019-09-04 W & D McCulloch Ltd. Railway rail handling apparatus and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3496513A (en) * 1967-11-17 1970-02-17 Sprague Electric Co Film resistor with securely soldered leads
EP1733096B2 (en) 2004-03-27 2019-09-04 W & D McCulloch Ltd. Railway rail handling apparatus and method

Also Published As

Publication number Publication date
GB1033785A (en) 1966-06-22

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