GB1001517A - Improvements in and relating to jigs for alloying material to semiconductor bodies - Google Patents
Improvements in and relating to jigs for alloying material to semiconductor bodiesInfo
- Publication number
- GB1001517A GB1001517A GB3269461A GB3269461A GB1001517A GB 1001517 A GB1001517 A GB 1001517A GB 3269461 A GB3269461 A GB 3269461A GB 3269461 A GB3269461 A GB 3269461A GB 1001517 A GB1001517 A GB 1001517A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plates
- alloying
- semi
- jig
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 title abstract 5
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 238000005275 alloying Methods 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 230000000717 retained effect Effects 0.000 abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 229910010293 ceramic material Inorganic materials 0.000 abstract 1
- 229910002804 graphite Inorganic materials 0.000 abstract 1
- 239000010439 graphite Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000008188 pellet Substances 0.000 abstract 1
- 229910052594 sapphire Inorganic materials 0.000 abstract 1
- 239000010980 sapphire Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
- 239000011009 synthetic ruby Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
1,001,517. Semi-conductor devices. MULLARD Ltd. June 15, 1962 [Sept. 12, 1961], No. 32694/61. Heading H1K. In a jig for use in the alloying of material to a semi-conductor body, three rectangular plates 4, 5, 6 (Figs. 2, 3) are retained in a recess 3 of a jig body 1 so that the surfaces 2 of the plates are flush with the surface 8 of the body, the alloying material being introduced into recesses 7 of the two outer plates and the semi-conductor body being located when in position against surface 8, by means of raised portions 9. The nature of the plates depends on the materials to be alloyed, so that if In pellets are to be alloyed to Ge they may be of stainless steel or of natural or synthetic ruby or sapphire. If A1 is present in one of the materials the plates are preferably of graphite or a ceramic material. In a mass production process for manufacturing diodes or transistors, a plurality of sets of three plates 23 (Fig. 4) are mounted in recesses 22 in a jig body and retained therein by spacing members (Fig. 6, not shown) contained in channels 27. Projections 30 on the surface of the jig body, spacing members 32 and projections 33 on the members in channels 27 serve to restrain three semiconductor wafers in position during the alloying process.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3269461A GB1001517A (en) | 1961-09-12 | 1961-09-12 | Improvements in and relating to jigs for alloying material to semiconductor bodies |
| DEN22071A DE1177254B (en) | 1961-09-12 | 1962-09-08 | Alloy form and method for manufacturing semiconductor devices |
| FR909161A FR1333438A (en) | 1961-09-12 | 1962-09-11 | Semiconductor device manufacturing apparatus and methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3269461A GB1001517A (en) | 1961-09-12 | 1961-09-12 | Improvements in and relating to jigs for alloying material to semiconductor bodies |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1001517A true GB1001517A (en) | 1965-08-18 |
Family
ID=10342609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3269461A Expired GB1001517A (en) | 1961-09-12 | 1961-09-12 | Improvements in and relating to jigs for alloying material to semiconductor bodies |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE1177254B (en) |
| GB (1) | GB1001517A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114308764A (en) * | 2021-12-31 | 2022-04-12 | 无锡小迪电子科技有限公司 | Silicon-based plasma photoresist remover compatible with third-generation semiconductor material |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE559757A (en) * | 1957-08-01 | |||
| NL219744A (en) * | 1957-08-08 | |||
| NL106425C (en) * | 1958-01-14 | |||
| DE1096501B (en) * | 1958-04-12 | 1961-01-05 | Intermetall | Alloy delimitation form for the production of alloy contacts on semiconductor components |
-
1961
- 1961-09-12 GB GB3269461A patent/GB1001517A/en not_active Expired
-
1962
- 1962-09-08 DE DEN22071A patent/DE1177254B/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114308764A (en) * | 2021-12-31 | 2022-04-12 | 无锡小迪电子科技有限公司 | Silicon-based plasma photoresist remover compatible with third-generation semiconductor material |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1177254B (en) | 1964-09-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1421409A (en) | Fixture for storing discrete semiconductor chips | |
| GB1152444A (en) | Heating Element suitable for use in the Epitaxial Deposition of Semiconductor Materials | |
| GB1001517A (en) | Improvements in and relating to jigs for alloying material to semiconductor bodies | |
| GB1214238A (en) | A process for manufacturing a semiconductor device | |
| JPS5253665A (en) | Semiconductor device | |
| GB1098760A (en) | Method of making semiconductor device | |
| GB869863A (en) | Improvements in or relating to the manufacture of transistors, rectifiers and other semi-conductor devices | |
| GB916379A (en) | Improvements in and relating to semiconductor junction units | |
| JPS5274280A (en) | Semiconductor device and its production | |
| FR2081017A2 (en) | Fabrication of a semiconductor device | |
| GB877469A (en) | Improvements in or relating to the production of semi-conductor material | |
| CA618558A (en) | Production of p.n. junctions in semi-conductor material | |
| JPS5295164A (en) | Dividing and cleansing for semi-conductor pellet | |
| JPS5310279A (en) | Mesa type semiconductor device | |
| GB860400A (en) | Improvements relating to semi-conductor diodes | |
| FR1280248A (en) | Method for establishing electrical contacts on elements made of non-weldable semiconductor materials | |
| AU232310B2 (en) | Improvements in processes for manufacturing semiconductor materials | |
| JPS5217768A (en) | Production method of semi-conductor device | |
| IE35247B1 (en) | Improvements in ceramic passivated semi-conductor device and process for its manufacture | |
| JPS5339870A (en) | Semiconductor device | |
| JPS51118960A (en) | Wafer form semiconductor doping material | |
| AU3960158A (en) | Improvements in processes for manufacturing semiconductor materials | |
| CA647914A (en) | Method of obtaining junctions by solid diffusion in semi-conductor materials | |
| JPS5361277A (en) | Semiconductor element | |
| GB1107343A (en) | Microminiaturised, integrated circuit arrangement |