FR3072040B1 - Corps de base avec broche de terre brasee, procede de fabrication et utilisations de celui-ci - Google Patents

Corps de base avec broche de terre brasee, procede de fabrication et utilisations de celui-ci Download PDF

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Publication number
FR3072040B1
FR3072040B1 FR1859153A FR1859153A FR3072040B1 FR 3072040 B1 FR3072040 B1 FR 3072040B1 FR 1859153 A FR1859153 A FR 1859153A FR 1859153 A FR1859153 A FR 1859153A FR 3072040 B1 FR3072040 B1 FR 3072040B1
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FR
France
Prior art keywords
base body
brazed
manufacturing
area
intended
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1859153A
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English (en)
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FR3072040A1 (fr
Inventor
Helmut Hartl
Reinhard Ranftl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott AG filed Critical Schott AG
Publication of FR3072040A1 publication Critical patent/FR3072040A1/fr
Application granted granted Critical
Publication of FR3072040B1 publication Critical patent/FR3072040B1/fr
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Air Bags (AREA)
  • Laser Beam Processing (AREA)
  • Automotive Seat Belt Assembly (AREA)
  • Adornments (AREA)

Abstract

La présente invention a pour objet un corps de base destiné à des éléments de traversée, comprenant un corps de base (1) métallique, au moins une ouverture de passage (4) destinée à recevoir un élément fonctionnel dans un matériau de fixation (10), en particulier un matériau de fixation (10) électriquement isolant, et au moins un conducteur (6) qui est relié de façon électriquement conductrice au corps de base par une liaison brasée. La liaison brasée comprend un matériau de brasage (7) métallique, sachant que le matériau de brasage métallique recouvre une zone de surface du corps de base et forme ainsi une zone de brasage (7) sur une surface du corps de base. Le corps de base (1) présente, au moins dans la zone de brasage (7), une microstructure qui comporte au moins des creux dans la surface du corps de base. De manière similaire, l'invention a pour objet des procédés de fabrication de corps de base (1) de ce type et des applications de ceux-ci.
FR1859153A 2017-10-06 2018-10-03 Corps de base avec broche de terre brasee, procede de fabrication et utilisations de celui-ci Active FR3072040B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017123278.8A DE102017123278A1 (de) 2017-10-06 2017-10-06 Grundkörper mit angelötetem Massestift, Verfahren zu seiner Herstellung und seine Verwendungen
DE102017123278.8 2017-10-06

Publications (2)

Publication Number Publication Date
FR3072040A1 FR3072040A1 (fr) 2019-04-12
FR3072040B1 true FR3072040B1 (fr) 2020-05-08

Family

ID=65816755

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1859153A Active FR3072040B1 (fr) 2017-10-06 2018-10-03 Corps de base avec broche de terre brasee, procede de fabrication et utilisations de celui-ci

Country Status (7)

Country Link
US (1) US11205610B2 (fr)
JP (2) JP6768759B2 (fr)
KR (1) KR102238064B1 (fr)
CN (1) CN109623071A (fr)
CZ (1) CZ2018532A3 (fr)
DE (1) DE102017123278A1 (fr)
FR (1) FR3072040B1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017124292A1 (de) * 2017-10-18 2019-04-18 Trw Airbag Systems Gmbh Anzünder für einen gasgenerator und verfahren zur herstellung eines anzünders
DE102018218001B4 (de) 2018-10-22 2021-09-30 Schott Ag Verfahren zur Herstellung eines Anschlussstiftes für Durchführungen, sowie Anschlussstift
HUE058671T2 (hu) * 2019-12-19 2022-09-28 Schott Ag Fém-rögzítõanyag-átvezetés, eljárás elõállítására és alkalmazásuk
DE102020202794A1 (de) 2020-03-04 2021-09-09 Electrovac Hacht und Huber Gesellschaft mit beschränkter Haftung Zündersockel
DE202020102354U1 (de) 2020-04-28 2021-07-29 Schott Ag Anzünder von Personenschutzeinrichtungen
EP4143497A1 (fr) 2020-04-28 2023-03-08 Schott Ag Allumeur pour des dispositifs de protection de passager et son procédé de production
EP3904822A1 (fr) 2020-04-28 2021-11-03 Schott AG Système d'allumage de dispositifs de protection des personnes et son procédé de fabrication
DE102021133391A1 (de) 2021-12-16 2023-06-22 Schott Ag Gehäuseteil für eine elektrische Speichereinrichtung und elektrische Speichereinrichtung

Family Cites Families (26)

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Publication number Priority date Publication date Assignee Title
US3339008A (en) * 1966-09-14 1967-08-29 Roger A Macarthur Circuit board having grooves to limit solder flow
JPH0758719B2 (ja) 1989-03-17 1995-06-21 サンケン電気株式会社 電子素子の固着方法
JPH04199557A (ja) 1990-11-28 1992-07-20 Mitsubishi Electric Corp 半導体装置用リードフレーム
JPH04223364A (ja) 1990-12-25 1992-08-13 Mitsubishi Electric Corp 半導体装置
JP2857648B2 (ja) 1991-02-28 1999-02-17 サンケン電気株式会社 電子部品の製造方法
US5324890A (en) 1993-09-09 1994-06-28 Delco Electronics Corporation Direct bond copper-output footprint
US6288451B1 (en) 1998-06-24 2001-09-11 Vanguard International Semiconductor Corporation Flip-chip package utilizing a printed circuit board having a roughened surface for increasing bond strength
EP1366521A2 (fr) 2000-08-18 2003-12-03 Koninklijke Philips Electronics N.V. Procede de fabrication d'un dispositif a semi-conducteur et d'une plaque de support, et dispositif a semi-conducteur obtenu par ce procede
US6506083B1 (en) * 2001-03-06 2003-01-14 Schlumberger Technology Corporation Metal-sealed, thermoplastic electrical feedthrough
DE10133223A1 (de) 2001-07-09 2002-10-17 Trw Airbag Sys Gmbh & Co Kg Anzünder
JP2003110231A (ja) 2001-09-28 2003-04-11 Olympus Optical Co Ltd 配線板、半田付け方法及び半田接合構造体
JP4093818B2 (ja) 2002-08-07 2008-06-04 三洋電機株式会社 半導体装置の製造方法
DE102005009644B4 (de) * 2005-03-03 2013-09-12 Schott Ag Zündvorrichtung für eine pyrotechnische Schutzvorrichtung, Verfahren zur Herstellung einer solchen Zündvorrichtung sowie Gasgenerator mit einer solchen Zündvorrichtung
JP4702196B2 (ja) 2005-09-12 2011-06-15 株式会社デンソー 半導体装置
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DE102007061175B3 (de) 2007-12-17 2009-08-27 Schott Ag Verfahren zur Herstellung einer elektrischen Durchführung
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HUE044117T2 (hu) 2010-09-17 2019-10-28 Schott Ag Fém-rögzítõanyag átvezetés és eljárás annak az elõállítására
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US10076800B2 (en) * 2015-11-30 2018-09-18 Cree Fayetteville, Inc. Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly

Also Published As

Publication number Publication date
CN109623071A (zh) 2019-04-16
FR3072040A1 (fr) 2019-04-12
JP2019069471A (ja) 2019-05-09
DE102017123278A1 (de) 2019-04-11
JP2021000663A (ja) 2021-01-07
JP6768759B2 (ja) 2020-10-14
CZ2018532A3 (cs) 2019-10-16
US20190109071A1 (en) 2019-04-11
KR102238064B1 (ko) 2021-04-08
KR20190039872A (ko) 2019-04-16
US11205610B2 (en) 2021-12-21
JP7330933B2 (ja) 2023-08-22

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