FR3057394B1 - Dispositif de protection contre les decharges electrostatiques avec circuit de declenchement distribue - Google Patents

Dispositif de protection contre les decharges electrostatiques avec circuit de declenchement distribue Download PDF

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Publication number
FR3057394B1
FR3057394B1 FR1661085A FR1661085A FR3057394B1 FR 3057394 B1 FR3057394 B1 FR 3057394B1 FR 1661085 A FR1661085 A FR 1661085A FR 1661085 A FR1661085 A FR 1661085A FR 3057394 B1 FR3057394 B1 FR 3057394B1
Authority
FR
France
Prior art keywords
terminal
resistive
protection against
triggering circuit
against electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1661085A
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English (en)
Other versions
FR3057394A1 (fr
Inventor
Philippe Galy
Sotirios Athanasiou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Publication of FR3057394A1 publication Critical patent/FR3057394A1/fr
Application granted granted Critical
Publication of FR3057394B1 publication Critical patent/FR3057394B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
    • H01L27/027—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements specially adapted to provide an electrical current path other than the field effect induced current path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
    • H01L27/0285—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements bias arrangements for gate electrode of field effect transistors, e.g. RC networks, voltage partitioning circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
    • H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45—Ohmic electrodes
    • H01L29/456—Ohmic electrodes on silicon

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)

Abstract

Le dispositif de protection est réalisé dans et sur un film semi-conducteur (1) situé sur une couche isolante enterrée (2) elle-même située au-dessus d'un caisson semi-conducteur (3). Il comprend une première borne (B1) et une deuxième borne (B2), au moins un module (MD1) comportant au moins un transistor MOS (TR) connecté entre la première borne (B1) et la deuxième borne (B2) et ayant sa région de grille (G), son substrat (B) et ledit caisson (3) électriquement couplés, au moins un circuit résistif-capacitif (RC) configuré pour rendre passant le transistor MOS (TR) lors de l'apparition d'une décharge électrostatique sur la première borne (B1) ou sur la deuxième borne (B2), ledit au moins un circuit résistif-capacitif (RC) possédant une partie commune avec l'une au moins des régions de source, de grille et de drain du transistor et comportant un élément capacitif et un élément résistif, une première électrode de l'élément capacitif comportant l'élément résistif et une deuxième électrode de l'élément capacitif comportant au moins une portion du film semi-conducteur (1).
FR1661085A 2016-10-10 2016-11-16 Dispositif de protection contre les decharges electrostatiques avec circuit de declenchement distribue Expired - Fee Related FR3057394B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GR20160100522 2016-10-10
GR20160100522 2016-10-10

Publications (2)

Publication Number Publication Date
FR3057394A1 FR3057394A1 (fr) 2018-04-13
FR3057394B1 true FR3057394B1 (fr) 2019-05-03

Family

ID=61783928

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1661085A Expired - Fee Related FR3057394B1 (fr) 2016-10-10 2016-11-16 Dispositif de protection contre les decharges electrostatiques avec circuit de declenchement distribue

Country Status (3)

Country Link
US (2) US9947650B1 (fr)
CN (2) CN207320106U (fr)
FR (1) FR3057394B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3057394B1 (fr) * 2016-10-10 2019-05-03 Stmicroelectronics Sa Dispositif de protection contre les decharges electrostatiques avec circuit de declenchement distribue
CN112259605B (zh) * 2020-10-22 2022-08-23 东南大学 一种耐瞬时电流冲击的异质结半导体器件
CN112765922B (zh) * 2020-12-31 2024-04-19 中国科学院上海微系统与信息技术研究所 采用soi衬底的射频晶体管的仿真模型

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208719A (en) 1991-08-20 1993-05-04 Vlsi Technology, Inc. Output pad electrostatic discharge protection circuit for mos devices
US5631793A (en) 1995-09-05 1997-05-20 Winbond Electronics Corporation Capacitor-couple electrostatic discharge protection circuit
US20060044716A1 (en) * 2004-08-31 2006-03-02 Taiwan Semiconductor Manufacturing Co., Ltd. ESD protection circuit with improved trigger-on voltage
US7746607B2 (en) 2006-04-27 2010-06-29 International Business Machines Corporation Substrate triggering for ESD protection in SOI
JP2010016177A (ja) * 2008-07-03 2010-01-21 Toshiba Corp 静電気放電保護素子
US7982523B2 (en) * 2008-12-05 2011-07-19 Infineon Technologies Ag Electro static discharge clamping device
US9019666B2 (en) 2010-01-22 2015-04-28 Stmicroelectronics S.A. Electronic device, in particular for protection against electrostatic discharges, and method for protecting a component against electrostatic discharges
JP5701684B2 (ja) * 2011-05-23 2015-04-15 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置
FR3038775A1 (fr) 2015-07-09 2017-01-13 St Microelectronics Sa Prise de contact substrat pour un transistor mos dans un substrat soi, en particulier fdsoi
FR3057394B1 (fr) * 2016-10-10 2019-05-03 Stmicroelectronics Sa Dispositif de protection contre les decharges electrostatiques avec circuit de declenchement distribue

Also Published As

Publication number Publication date
FR3057394A1 (fr) 2018-04-13
US20180102358A1 (en) 2018-04-12
US10211201B2 (en) 2019-02-19
CN107919353A (zh) 2018-04-17
CN107919353B (zh) 2022-01-04
CN207320106U (zh) 2018-05-04
US20180197848A1 (en) 2018-07-12
US9947650B1 (en) 2018-04-17

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