FR3004373B1 - Composition de polissage de pastille de silicium stable et concentrable et procedes apparentes - Google Patents

Composition de polissage de pastille de silicium stable et concentrable et procedes apparentes Download PDF

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Publication number
FR3004373B1
FR3004373B1 FR1453226A FR1453226A FR3004373B1 FR 3004373 B1 FR3004373 B1 FR 3004373B1 FR 1453226 A FR1453226 A FR 1453226A FR 1453226 A FR1453226 A FR 1453226A FR 3004373 B1 FR3004373 B1 FR 3004373B1
Authority
FR
France
Prior art keywords
concentrable
pastille
silicon
stable
polishing composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1453226A
Other languages
English (en)
Other versions
FR3004373A1 (fr
Inventor
Kumar Penta Naresh
Melbourne Cook Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR3004373A1 publication Critical patent/FR3004373A1/fr
Application granted granted Critical
Publication of FR3004373B1 publication Critical patent/FR3004373B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
FR1453226A 2013-04-11 2014-04-11 Composition de polissage de pastille de silicium stable et concentrable et procedes apparentes Active FR3004373B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/860,830 US8801959B1 (en) 2013-04-11 2013-04-11 Stable, concentratable silicon wafer polishing composition and related methods
US13860830 2013-04-11

Publications (2)

Publication Number Publication Date
FR3004373A1 FR3004373A1 (fr) 2014-10-17
FR3004373B1 true FR3004373B1 (fr) 2018-02-16

Family

ID=51267238

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1453226A Active FR3004373B1 (fr) 2013-04-11 2014-04-11 Composition de polissage de pastille de silicium stable et concentrable et procedes apparentes

Country Status (7)

Country Link
US (1) US8801959B1 (fr)
JP (1) JP6302335B2 (fr)
KR (1) KR102311193B1 (fr)
CN (1) CN104099026B (fr)
DE (1) DE102014005125A1 (fr)
FR (1) FR3004373B1 (fr)
TW (1) TWI627244B (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8795548B1 (en) * 2013-04-11 2014-08-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Silicon wafer polishing composition and related methods
CN105911533B (zh) * 2016-06-24 2018-04-03 北京航空航天大学 一种基于平面扫描结构的三维成像降采样快速扫描方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4588421A (en) * 1984-10-15 1986-05-13 Nalco Chemical Company Aqueous silica compositions for polishing silicon wafers
US5860848A (en) 1995-06-01 1999-01-19 Rodel, Inc. Polishing silicon wafers with improved polishing slurries
JP2007012679A (ja) * 2005-06-28 2007-01-18 Asahi Glass Co Ltd 研磨剤および半導体集積回路装置の製造方法
US20090311947A1 (en) * 2006-07-05 2009-12-17 Dupont Aurproducts Nanomaterials Limited Company Polishing Composition for Silicon Wafer and Polishing Method of Silicon Wafer
US8017524B2 (en) * 2008-05-23 2011-09-13 Cabot Microelectronics Corporation Stable, high rate silicon slurry
JP5309692B2 (ja) 2008-05-28 2013-10-09 株式会社Ｓｕｍｃｏ シリコンウェーハの研磨方法
CN101637884A (zh) * 2008-07-30 2010-02-03 长兴开发科技股份有限公司 硅贯通电极晶圆的研磨方法与其所使用的研磨组成物
JP2011142284A (ja) * 2009-12-10 2011-07-21 Hitachi Chem Co Ltd Ｃｍｐ研磨液、基板の研磨方法及び電子部品
CN102725374B (zh) 2010-01-29 2016-04-27 福吉米株式会社 半导体晶片的再生方法和研磨用组合物
CN101870852B (zh) * 2010-06-13 2013-07-10 北京国瑞升科技有限公司 一种大尺寸硅片用化学机械抛光液及其制备方法
JP2012021151A (ja) * 2010-06-16 2012-02-02 Sanyo Chem Ind Ltd 銅配線半導体用洗浄剤
TWI465556B (zh) * 2010-09-14 2014-12-21 Everlight Chem Ind Corp 用於粗拋晶圓之研磨組成物
JP5939578B2 (ja) 2011-02-03 2016-06-22 ニッタ・ハース株式会社 研磨用組成物およびそれを用いた研磨方法
CN102816530B (zh) * 2011-06-08 2016-01-27 安集微电子（上海）有限公司 一种化学机械抛光液
JP2014125628A (ja) * 2012-12-27 2014-07-07 Sanyo Chem Ind Ltd 電子材料用研磨液

Also Published As

Publication number Publication date
CN104099026A (zh) 2014-10-15
KR102311193B1 (ko) 2021-10-08
TW201446902A (zh) 2014-12-16
JP2014207449A (ja) 2014-10-30
CN104099026B (zh) 2016-06-22
KR20140123012A (ko) 2014-10-21
TWI627244B (zh) 2018-06-21
US8801959B1 (en) 2014-08-12
FR3004373A1 (fr) 2014-10-17
JP6302335B2 (ja) 2018-03-28
DE102014005125A1 (de) 2014-10-16

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