FR3004289B1 - Composant a ondes acoustiques de surface et sa methode de fabrication - Google Patents

Composant a ondes acoustiques de surface et sa methode de fabrication

Info

Publication number
FR3004289B1
FR3004289B1 FR1300824A FR1300824A FR3004289B1 FR 3004289 B1 FR3004289 B1 FR 3004289B1 FR 1300824 A FR1300824 A FR 1300824A FR 1300824 A FR1300824 A FR 1300824A FR 3004289 B1 FR3004289 B1 FR 3004289B1
Authority
FR
France
Prior art keywords
manufacturing
same
acoustic wave
surface acoustic
wave component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1300824A
Other languages
English (en)
French (fr)
Other versions
FR3004289A1 (fr
Inventor
Christophe Zinck
Eric Desbonnets
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR1300824A priority Critical patent/FR3004289B1/fr
Application filed by Soitec SA filed Critical Soitec SA
Priority to JP2016506835A priority patent/JP6619327B2/ja
Priority to EP14711532.3A priority patent/EP2984754B1/en
Priority to US14/782,548 priority patent/US10270413B2/en
Priority to CN201480020179.5A priority patent/CN105308860B/zh
Priority to PCT/EP2014/055746 priority patent/WO2014166722A1/en
Priority to KR1020157028039A priority patent/KR102184208B1/ko
Publication of FR3004289A1 publication Critical patent/FR3004289A1/fr
Application granted granted Critical
Publication of FR3004289B1 publication Critical patent/FR3004289B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
FR1300824A 2013-04-08 2013-04-08 Composant a ondes acoustiques de surface et sa methode de fabrication Active FR3004289B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR1300824A FR3004289B1 (fr) 2013-04-08 2013-04-08 Composant a ondes acoustiques de surface et sa methode de fabrication
EP14711532.3A EP2984754B1 (en) 2013-04-08 2014-03-21 Advanced thermally compensated surface acoustic wave device and fabrication method
US14/782,548 US10270413B2 (en) 2013-04-08 2014-03-21 Advanced thermally compensated surface acoustic wave device and fabrication
CN201480020179.5A CN105308860B (zh) 2013-04-08 2014-03-21 先进热补偿表面声波器件及其制造方法
JP2016506835A JP6619327B2 (ja) 2013-04-08 2014-03-21 改良型の熱補償形表面弾性波デバイスおよび製造方法
PCT/EP2014/055746 WO2014166722A1 (en) 2013-04-08 2014-03-21 Advanced thermally compensated surface acoustic wave device and fabrication method
KR1020157028039A KR102184208B1 (ko) 2013-04-08 2014-03-21 진보되고 열적으로 보상된 표면 탄성파 소자 및 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1300824A FR3004289B1 (fr) 2013-04-08 2013-04-08 Composant a ondes acoustiques de surface et sa methode de fabrication

Publications (2)

Publication Number Publication Date
FR3004289A1 FR3004289A1 (fr) 2014-10-10
FR3004289B1 true FR3004289B1 (fr) 2015-05-15

Family

ID=48771526

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1300824A Active FR3004289B1 (fr) 2013-04-08 2013-04-08 Composant a ondes acoustiques de surface et sa methode de fabrication

Country Status (7)

Country Link
US (1) US10270413B2 (enExample)
EP (1) EP2984754B1 (enExample)
JP (1) JP6619327B2 (enExample)
KR (1) KR102184208B1 (enExample)
CN (1) CN105308860B (enExample)
FR (1) FR3004289B1 (enExample)
WO (1) WO2014166722A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11158783B2 (en) 2015-10-13 2021-10-26 Northeastern University Piezoelectric cross-sectional Lamé mode transformer
CN107302348A (zh) * 2016-04-15 2017-10-27 上海新昇半导体科技有限公司 表面声波器件及其制造方法、温度检测设备
FR3051785B1 (fr) * 2016-05-25 2025-04-25 Soitec Silicon On Insulator Procede de fabrication d'une couche
FR3052298B1 (fr) * 2016-06-02 2018-07-13 Soitec Structure hybride pour dispositif a ondes acoustiques de surface
CN106209003B (zh) * 2016-07-06 2019-03-22 中国科学院上海微系统与信息技术研究所 利用薄膜转移技术制备薄膜体声波器件的方法
JP7169083B2 (ja) * 2018-04-04 2022-11-10 太陽誘電株式会社 弾性波デバイスおよびマルチプレクサ
US20200044621A1 (en) * 2018-07-31 2020-02-06 Qualcomm Incorporated Thin film devices
US11804822B2 (en) 2019-10-23 2023-10-31 Skyworks Solutions, Inc. Surface acoustic wave resonator with reduced frequency shift
CN112448687B (zh) * 2020-11-23 2024-05-03 广东广纳芯科技有限公司 一种tc-saw滤波器制造方法
KR20230103296A (ko) * 2021-12-31 2023-07-07 삼성전기주식회사 음향 공진기 패키지
US20250323620A1 (en) * 2024-04-10 2025-10-16 Rf360 Singapore Pte. Ltd. Surface acoustic wave (saw) device with high-dielectric-constant material

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Publication number Priority date Publication date Assignee Title
WO1996004713A1 (en) 1994-08-05 1996-02-15 Japan Energy Corporation Surface acoustic wave device and production method thereof
JP3702050B2 (ja) 1996-09-09 2005-10-05 株式会社東芝 弾性境界波デバイス
JPH11284162A (ja) 1998-03-30 1999-10-15 Sony Corp 固体撮像素子
JP3832214B2 (ja) * 2000-09-08 2006-10-11 セイコーエプソン株式会社 Ｓａｗ素子及びその製造方法
WO2002082644A1 (fr) * 2001-03-30 2002-10-17 Mitsubishi Denki Kabushiki Kaisha Dispositif d'onde acoustique et procede de fabrication correspondant
US6662419B2 (en) 2001-12-17 2003-12-16 Intel Corporation Method for fabricating film bulk acoustic resonators to achieve high-Q and low loss
JP2004297693A (ja) * 2003-03-28 2004-10-21 Fujitsu Media Device Kk 弾性表面波デバイスの製造方法及び弾性表面波デバイス
JP2005206576A (ja) 2003-10-09 2005-08-04 Unitika Ltd ハナビラタケ由来のセラミド含有組成物
JPWO2005086345A1 (ja) 2004-03-05 2008-01-24 株式会社村田製作所 弾性境界波装置
DE102004049498A1 (de) 2004-10-11 2006-04-13 Epcos Ag Mit akustischen Wellen arbeitendes Bauelement und Verfahren zu dessen Herstellung
US20080206892A1 (en) 2005-06-17 2008-08-28 Koninklijke Philips Electronics, N.V. Rapid Magnetic Biosensor With Integrated Arrival Time Measuremnt
JP2007049482A (ja) * 2005-08-10 2007-02-22 Seiko Epson Corp 弾性境界波素子
JP4707056B2 (ja) * 2005-08-31 2011-06-22 富士通株式会社 集積型電子部品および集積型電子部品製造方法
JP4943787B2 (ja) * 2006-09-13 2012-05-30 太陽誘電株式会社 弾性波デバイス、共振器およびフィルタ
WO2008038506A1 (fr) * 2006-09-27 2008-04-03 Murata Manufacturing Co., Ltd. Dispositif d'onde acoustique limite
JP2008131128A (ja) * 2006-11-17 2008-06-05 Matsushita Electric Ind Co Ltd 弾性表面波フィルタ、アンテナ共用器、およびそれらの製造方法
WO2008078481A1 (ja) * 2006-12-25 2008-07-03 Murata Manufacturing Co., Ltd. 弾性境界波装置
JP4793450B2 (ja) * 2007-01-19 2011-10-12 株式会社村田製作所 弾性境界波装置の製造方法
JP4724682B2 (ja) 2007-03-15 2011-07-13 日世株式会社 ミックスバルブ及びミックスバルブを備えた冷菓製造装置
US8362853B2 (en) 2009-06-19 2013-01-29 Qualcomm Incorporated Tunable MEMS resonators
JP5429200B2 (ja) * 2010-05-17 2014-02-26 株式会社村田製作所 複合圧電基板の製造方法および圧電デバイス
JP5637068B2 (ja) * 2010-08-27 2014-12-10 株式会社村田製作所 弾性境界波装置の製造方法および弾性境界波装置
JPWO2013031651A1 (ja) 2011-09-02 2015-03-23 株式会社村田製作所 弾性波装置及びその製造方法

Also Published As

Publication number Publication date
CN105308860A (zh) 2016-02-03
KR102184208B1 (ko) 2020-11-27
JP6619327B2 (ja) 2019-12-11
EP2984754B1 (en) 2019-08-28
CN105308860B (zh) 2018-07-13
EP2984754A1 (en) 2016-02-17
KR20150139856A (ko) 2015-12-14
US10270413B2 (en) 2019-04-23
JP2016519897A (ja) 2016-07-07
US20160065162A1 (en) 2016-03-03
WO2014166722A1 (en) 2014-10-16
FR3004289A1 (fr) 2014-10-10

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