FR2939564B1 - Capteur et son procede de fabrication - Google Patents

Capteur et son procede de fabrication Download PDF

Info

Publication number
FR2939564B1
FR2939564B1 FR0958726A FR0958726A FR2939564B1 FR 2939564 B1 FR2939564 B1 FR 2939564B1 FR 0958726 A FR0958726 A FR 0958726A FR 0958726 A FR0958726 A FR 0958726A FR 2939564 B1 FR2939564 B1 FR 2939564B1
Authority
FR
France
Prior art keywords
sensor
manufacturing same
manufacturing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0958726A
Other languages
English (en)
Other versions
FR2939564A1 (fr
Inventor
Jochen Reinmuth
Neil Davies
Simon Armbruster
Ando Feyh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2939564A1 publication Critical patent/FR2939564A1/fr
Application granted granted Critical
Publication of FR2939564B1 publication Critical patent/FR2939564B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0853—Optical arrangements having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14649—Infrared imagers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Pressure Sensors (AREA)
FR0958726A 2008-12-10 2009-12-08 Capteur et son procede de fabrication Expired - Fee Related FR2939564B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008054481.7A DE102008054481B4 (de) 2008-12-10 2008-12-10 Sensor und Verfahren zu dessen Herstellung
DE102008054481.7 2008-12-10

Publications (2)

Publication Number Publication Date
FR2939564A1 FR2939564A1 (fr) 2010-06-11
FR2939564B1 true FR2939564B1 (fr) 2018-10-26

Family

ID=42168258

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0958726A Expired - Fee Related FR2939564B1 (fr) 2008-12-10 2009-12-08 Capteur et son procede de fabrication

Country Status (4)

Country Link
US (1) US8334534B2 (fr)
JP (1) JP5725705B2 (fr)
DE (1) DE102008054481B4 (fr)
FR (1) FR2939564B1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI388038B (zh) * 2009-07-23 2013-03-01 Ind Tech Res Inst 感測元件結構與製造方法
PL2515195T3 (pl) 2011-04-18 2014-10-31 Voegele Ag J System do sterowania pojazdami placu budowy
PL2514873T3 (pl) 2011-04-18 2014-08-29 Voegele Ag J Sposób i system do nanoszenia nawierzchni drogowej
EP2515255A1 (fr) 2011-04-18 2012-10-24 Joseph Vögele AG Appareil de lecture portable pour la caractérisation d'un engin de chantier
DE102012218414A1 (de) 2012-10-10 2014-04-10 Robert Bosch Gmbh Integrierte Diodenanordnung und entsprechendes Herstellungsverfahren
WO2018201308A1 (fr) * 2017-05-03 2018-11-08 Shenzhen Xpectvision Technology Co., Ltd. Procédé de fabrication de détecteur de rayonnement
WO2019043299A1 (fr) * 2017-08-31 2019-03-07 Teknologian Tutkimuskeskus Vtt Oy Détecteur thermique et réseau de détecteurs thermiques
CN114122040B (zh) * 2022-01-26 2022-04-22 中国人民解放军火箭军工程大学 面向医疗应用的半导体硅基混合成像芯片及制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03212979A (ja) * 1990-01-17 1991-09-18 Nec Corp 赤外線センサ
DE19645036B4 (de) 1996-10-31 2006-04-20 Siemens Ag Pyroelektrische Halbleiter-Detektoreinrichtung für Infrarotstrahlung und Verfahren zur Herstellung
JP3574368B2 (ja) * 1997-01-27 2004-10-06 三菱電機株式会社 赤外線固体撮像素子
JP3583704B2 (ja) 2000-01-12 2004-11-04 独立行政法人 科学技術振興機構 温度測定装置、熱型赤外線イメージセンサ及び温度測定方法
JP3672516B2 (ja) * 2001-09-28 2005-07-20 株式会社東芝 赤外線センサ装置及びその製造方法
JP2003185496A (ja) * 2001-12-13 2003-07-03 Mitsubishi Electric Corp 赤外線検出アレイおよびその製造方法
JP2005072126A (ja) * 2003-08-21 2005-03-17 Toshiba Matsushita Display Technology Co Ltd 回路基板、アレイ基板、その製造方法、液晶表示装置およびその製造方法
JP4737956B2 (ja) * 2003-08-25 2011-08-03 東芝モバイルディスプレイ株式会社 表示装置および光電変換素子
JP2006300816A (ja) * 2005-04-22 2006-11-02 Mitsubishi Electric Corp 赤外線検出器および赤外線固体撮像装置
DE102006007729A1 (de) 2006-02-20 2007-08-23 Robert Bosch Gmbh Verfahren zur Herstellung eines MEMS-Substrats, entsprechendes MEMS-Substrat und MEMS-Prozess unter Verwendung des MEMS-Substrats
DE102006028435A1 (de) 2006-06-21 2007-12-27 Robert Bosch Gmbh Sensor und Verfahren zu seiner Herstellung
DE102008000261B4 (de) 2007-02-22 2012-09-13 Denso Corporation Halbleitervorrichtung und Verfahren zu ihrer Herstellung
JP4867792B2 (ja) * 2007-05-24 2012-02-01 パナソニック電工株式会社 ウェハレベルパッケージ構造体およびセンサ装置

Also Published As

Publication number Publication date
US20100140618A1 (en) 2010-06-10
US8334534B2 (en) 2012-12-18
FR2939564A1 (fr) 2010-06-11
DE102008054481B4 (de) 2021-11-25
JP2010141333A (ja) 2010-06-24
DE102008054481A1 (de) 2010-06-17
JP5725705B2 (ja) 2015-05-27

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