FR2878075B1 - Procede et appareil de mesure de plaques de semi-conducteur - Google Patents

Procede et appareil de mesure de plaques de semi-conducteur

Info

Publication number
FR2878075B1
FR2878075B1 FR0412064A FR0412064A FR2878075B1 FR 2878075 B1 FR2878075 B1 FR 2878075B1 FR 0412064 A FR0412064 A FR 0412064A FR 0412064 A FR0412064 A FR 0412064A FR 2878075 B1 FR2878075 B1 FR 2878075B1
Authority
FR
France
Prior art keywords
measuring semiconductor
semiconductor plates
plates
measuring
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0412064A
Other languages
English (en)
Other versions
FR2878075A1 (fr
Inventor
Cedric Angellier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR0412064A priority Critical patent/FR2878075B1/fr
Priority to PCT/FR2005/050948 priority patent/WO2006051243A1/fr
Priority to EP05819322A priority patent/EP1812205A1/fr
Priority to JP2007540693A priority patent/JP4646986B2/ja
Publication of FR2878075A1 publication Critical patent/FR2878075A1/fr
Application granted granted Critical
Publication of FR2878075B1 publication Critical patent/FR2878075B1/fr
Priority to US11/748,179 priority patent/US7375830B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
FR0412064A 2004-11-15 2004-11-15 Procede et appareil de mesure de plaques de semi-conducteur Active FR2878075B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0412064A FR2878075B1 (fr) 2004-11-15 2004-11-15 Procede et appareil de mesure de plaques de semi-conducteur
PCT/FR2005/050948 WO2006051243A1 (fr) 2004-11-15 2005-11-15 Procede et appareil de mesure de plaques de semi-conducteur
EP05819322A EP1812205A1 (fr) 2004-11-15 2005-11-15 Procede et appareil de mesure de plaques de semi-conducteur
JP2007540693A JP4646986B2 (ja) 2004-11-15 2005-11-15 半導体ウェーハを測定する方法および装置
US11/748,179 US7375830B2 (en) 2004-11-15 2007-05-14 Method and instrument for measuring semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0412064A FR2878075B1 (fr) 2004-11-15 2004-11-15 Procede et appareil de mesure de plaques de semi-conducteur

Publications (2)

Publication Number Publication Date
FR2878075A1 FR2878075A1 (fr) 2006-05-19
FR2878075B1 true FR2878075B1 (fr) 2007-03-02

Family

ID=34951949

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0412064A Active FR2878075B1 (fr) 2004-11-15 2004-11-15 Procede et appareil de mesure de plaques de semi-conducteur

Country Status (5)

Country Link
US (1) US7375830B2 (fr)
EP (1) EP1812205A1 (fr)
JP (1) JP4646986B2 (fr)
FR (1) FR2878075B1 (fr)
WO (1) WO2006051243A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008002753B4 (de) * 2007-12-19 2010-03-25 Vistec Semiconductor Systems Gmbh Verfahren zur optischen Inspektion, Detektion und Visualisierung von Defekten auf scheibenförmigen Objekten
US20090291510A1 (en) * 2008-05-20 2009-11-26 International Business Machines Corporation Method for creating wafer test pattern
KR101054887B1 (ko) * 2009-03-09 2011-08-05 한양대학교 산학협력단 균일도 측정 방법 및 장치
FR2948494B1 (fr) 2009-07-27 2011-09-16 Soitec Silicon On Insulator Procede de determination d'une position centree d'un substrat semi-conducteur dans un four de recuit, dispositif pour traiter thermiquement des substrats semi-conducteurs et procede pour calibrer un tel dispositif
CN115143911A (zh) * 2022-09-06 2022-10-04 江苏科路电气有限公司 一种半导体器件测量装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624433B2 (en) * 1994-02-22 2003-09-23 Nikon Corporation Method and apparatus for positioning substrate and the like
US20040057044A1 (en) * 1994-12-08 2004-03-25 Mehrdad Nikoonahad Scanning system for inspecting anamolies on surfaces
JP3763664B2 (ja) * 1998-04-08 2006-04-05 松下電器産業株式会社 テスト回路
JP3175765B2 (ja) * 1998-12-08 2001-06-11 日本電気株式会社 半導体ウエハーの検査方法
AU3187100A (en) * 1999-03-10 2000-09-28 Nova Measuring Instruments Ltd. Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects
US6538733B2 (en) * 2000-08-22 2003-03-25 Ade Corporation Ring chuck to hold 200 and 300 mm wafer
US7698012B2 (en) * 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
JP3849547B2 (ja) * 2002-02-28 2006-11-22 信越半導体株式会社 半導体エピタキシャルウェーハの測定方法、半導体エピタキシャルウェーハの測定装置、半導体エピタキシャルウェーハの製造方法及びコンピュータプログラム
JP2004012302A (ja) * 2002-06-07 2004-01-15 Hitachi Ltd 膜厚分布計測方法及びその装置

Also Published As

Publication number Publication date
WO2006051243A1 (fr) 2006-05-18
JP2008520092A (ja) 2008-06-12
US7375830B2 (en) 2008-05-20
JP4646986B2 (ja) 2011-03-09
US20070229812A1 (en) 2007-10-04
FR2878075A1 (fr) 2006-05-19
EP1812205A1 (fr) 2007-08-01

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