FR2873809B1 - Dispositif micromecanique a chauffage integre - Google Patents

Dispositif micromecanique a chauffage integre

Info

Publication number
FR2873809B1
FR2873809B1 FR0552308A FR0552308A FR2873809B1 FR 2873809 B1 FR2873809 B1 FR 2873809B1 FR 0552308 A FR0552308 A FR 0552308A FR 0552308 A FR0552308 A FR 0552308A FR 2873809 B1 FR2873809 B1 FR 2873809B1
Authority
FR
France
Prior art keywords
micromechanical device
integrated heating
heating
integrated
micromechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0552308A
Other languages
English (en)
Other versions
FR2873809A1 (fr
Inventor
Richard Muehlheim
Frank Wehrmann
Polichronis Lepidis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2873809A1 publication Critical patent/FR2873809A1/fr
Application granted granted Critical
Publication of FR2873809B1 publication Critical patent/FR2873809B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0083—Temperature control
    • B81B7/009—Maintaining a constant temperature by heating or cooling
    • B81B7/0096—Maintaining a constant temperature by heating or cooling by heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
    • B81B7/0012—Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/11—Structural features, others than packages, for protecting a device against environmental influences
    • B81B2207/115—Protective layers applied directly to the device before packaging

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Micromachines (AREA)
  • Measuring Fluid Pressure (AREA)
FR0552308A 2004-07-28 2005-07-26 Dispositif micromecanique a chauffage integre Active FR2873809B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004036604 2004-07-28
DE102005029841A DE102005029841B4 (de) 2004-07-28 2005-06-27 Mikromechanischer Drucksensor mit beheiztem Passivierungsmittel und Verfahren zu seiner Steuerung

Publications (2)

Publication Number Publication Date
FR2873809A1 FR2873809A1 (fr) 2006-02-03
FR2873809B1 true FR2873809B1 (fr) 2013-06-14

Family

ID=35613596

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0552308A Active FR2873809B1 (fr) 2004-07-28 2005-07-26 Dispositif micromecanique a chauffage integre

Country Status (4)

Country Link
US (1) US7564338B2 (fr)
JP (1) JP5095929B2 (fr)
DE (1) DE102005029841B4 (fr)
FR (1) FR2873809B1 (fr)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006010901B4 (de) 2006-03-09 2022-02-17 Robert Bosch Gmbh Fluidsensor mit Fehlerdetektionseinrichtung
US7633037B2 (en) * 2006-12-19 2009-12-15 Eveready Battery Co., Inc. Positive temperature coefficient light emitting diode light
EP2015046A1 (fr) * 2007-06-06 2009-01-14 Infineon Technologies SensoNor AS Capteur de vide
DE102008002579A1 (de) * 2008-06-23 2009-12-24 Robert Bosch Gmbh Mikro-elektromechanisches Sensorelement
DE102009003090A1 (de) * 2009-05-14 2010-11-18 Robert Bosch Gmbh Sensoranordnung zur Erfassung eines Drucks
DE102009036857A1 (de) 2009-08-10 2011-02-17 Daimler Ag Sensoranordnung für ein Brennstoffzellensystem, Brennstoffzellensysteme mit der Sensoranordnung sowie Verfahren zum Betreiben des Brennstoffzellensystems
PL2312290T3 (pl) * 2009-10-16 2020-06-01 First Sensor Mobility Gmbh Czujnik ciśnienia i jego zastosowanie w zbiorniku płynu
US9631993B2 (en) * 2010-12-10 2017-04-25 Brooks Instrument, Llc Self-heated MEMs based capacitance diaphragm gauge
JP5418618B2 (ja) * 2011-03-23 2014-02-19 株式会社デンソー 圧力センサ
DE102011081923B4 (de) * 2011-08-31 2017-02-09 Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. Sensorchip zur Bestimmung eines Strömungsparameters eines Gases und Verfahren zur Bestimmung desselben
US9021887B2 (en) 2011-12-19 2015-05-05 Infineon Technologies Ag Micromechanical semiconductor sensing device
DE102012202035B4 (de) 2012-02-10 2014-05-28 Robert Bosch Gmbh Mikromechanisches Bauelement mit einer Membran
DE102012223879A1 (de) 2012-12-20 2014-07-10 Robert Bosch Gmbh Verfahren und Vorrichtung zum Betreiben eines Drucksensors einer Abgasnachbehandlungseinrichtung eines Kraftfahrzeugs
DE102013003328A1 (de) * 2013-02-28 2014-08-28 Man Truck & Bus Ag Drucksensor zur Messung eines Drucks, insbesondere in einem Abgassystem einer Brennkraftmaschine
DE102013211693B3 (de) * 2013-06-20 2014-07-24 I-For-T Gmbh Sensor mit einem mikroelektromechanischem Chip (MEMS-Chip)
DE102013212485B4 (de) 2013-06-27 2017-05-11 Robert Bosch Gmbh Verfahren zum Betreiben einer Sensoranordnung
DE102013217094B4 (de) * 2013-08-28 2021-11-04 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Prüfverfahren für ein mikromechanisches Bauelement
US9366593B2 (en) * 2013-09-27 2016-06-14 Infineon Technologies Ag Pressure sensor package with integrated sealing
CN103743439B (zh) * 2014-01-03 2016-02-03 南京信息工程大学 具有二层基板的微机械传感器
US9804007B2 (en) * 2014-12-19 2017-10-31 Invensense, Inc. Device and method for sensor calibration
US10794728B2 (en) * 2014-12-19 2020-10-06 Invensense, Inc. Device and method for sensor calibration
US10222394B2 (en) * 2015-09-22 2019-03-05 Invensense, Inc. Systems and methods for thermally controlling sensors
DE102015222756A1 (de) 2015-11-18 2017-05-18 Robert Bosch Gmbh Sensorelement für einen Drucksensor
EP3376778B8 (fr) * 2017-03-13 2020-08-12 ams International AG Microphone et procédé de test d'un microphone
DE102017208048B3 (de) 2017-05-12 2018-09-27 Robert Bosch Gmbh Mikromechanischer Drucksensor
DE102017122607A1 (de) 2017-09-28 2019-03-28 Tdk Electronics Ag Mediengetrennter Drucktransmitter
DE102017122631A1 (de) * 2017-09-28 2019-03-28 Tdk Electronics Ag Drucksensor auf keramischen Druckstutzen
DE102017122605A1 (de) * 2017-09-28 2019-03-28 Tdk Electronics Ag Drucksensor auf keramischen Substrat
DE102017220819A1 (de) * 2017-11-22 2019-05-23 Robert Bosch Gmbh Bruchdetektionsvorrichtung
DE102018117594A1 (de) * 2018-07-20 2020-01-23 Ifm Electronic Gmbh Druckmesszelle mit Temperatursensor und Druckmessgerät mit einer solchen Druckmesszelle
DE102019200917A1 (de) 2019-01-25 2020-07-30 Robert Bosch Gmbh MEMS-Sensor sowie Verfahren zum Betreiben eines MEMS-Sensors
US20220418047A1 (en) * 2020-03-03 2022-12-29 Daishinku Corporation Thin-film heater, method of producing thin-film heater, and thermostatic oven piezoelectric oscillator
DE102020203910B3 (de) 2020-03-26 2021-06-17 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Detektieren einer Verunreinigung eines MEMS-Sensorelements
DE102020216003B3 (de) 2020-12-16 2021-12-02 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Detektion eines Einschlusses in einem Füllmedium eines mikromechanischen Sensors und ein Sensorsystem
DE102021207679A1 (de) 2021-07-19 2023-01-19 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines mikromechanischen Sensors sowie ein mit diesem Verfahren hergestellter Sensor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4966037A (en) * 1983-09-12 1990-10-30 Honeywell Inc. Cantilever semiconductor device
JPH01114732A (ja) * 1987-10-28 1989-05-08 Ricoh Co Ltd 温度補正手段を備えた半導体圧力センサ
JPH05164646A (ja) * 1991-12-18 1993-06-29 Matsushita Electric Ind Co Ltd 半導体圧力センサ
DE69418615T2 (de) * 1993-10-08 1999-09-16 Microchip (Proprietary) Ltd., Pretoria Katalytischer gassensor
DE19527861B4 (de) * 1995-07-29 2010-09-30 Robert Bosch Gmbh Massenflusssensor sowie Verfahren zur Herstellung
US6794981B2 (en) * 1998-12-07 2004-09-21 Honeywell International Inc. Integratable-fluid flow and property microsensor assembly
US6860153B2 (en) * 2000-02-22 2005-03-01 Simon Fraser University Gas pressure sensor based on short-distance heat conduction and method for fabricating same
DE10117486A1 (de) * 2001-04-07 2002-10-17 Bosch Gmbh Robert Verfahren zur Herstelung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement
JP2002310828A (ja) * 2001-04-19 2002-10-23 Hitachi Ltd 半導体圧力センサ
DE10136164A1 (de) * 2001-07-25 2003-02-20 Bosch Gmbh Robert Mikromechanisches Bauelement
US6901794B2 (en) * 2003-10-16 2005-06-07 Festo Corporation Multiple technology flow sensor

Also Published As

Publication number Publication date
DE102005029841B4 (de) 2013-09-05
US20060289415A1 (en) 2006-12-28
DE102005029841A1 (de) 2006-03-23
JP2006035423A (ja) 2006-02-09
JP5095929B2 (ja) 2012-12-12
FR2873809A1 (fr) 2006-02-03
US7564338B2 (en) 2009-07-21

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