FR2836598B1 - Plaquette de montage pour dispositif imageur a semiconducteur et procede pour y fixer un dispositif imageur a semiconducteur - Google Patents

Plaquette de montage pour dispositif imageur a semiconducteur et procede pour y fixer un dispositif imageur a semiconducteur

Info

Publication number
FR2836598B1
FR2836598B1 FR0302406A FR0302406A FR2836598B1 FR 2836598 B1 FR2836598 B1 FR 2836598B1 FR 0302406 A FR0302406 A FR 0302406A FR 0302406 A FR0302406 A FR 0302406A FR 2836598 B1 FR2836598 B1 FR 2836598B1
Authority
FR
France
Prior art keywords
imaging device
semiconductor imaging
fixing
mounting plate
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0302406A
Other languages
English (en)
Other versions
FR2836598A1 (fr
Inventor
Kenji Hirunuma
Keiichi Hotta
Gouji Funatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pentax Corp
Original Assignee
Pentax Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pentax Corp filed Critical Pentax Corp
Publication of FR2836598A1 publication Critical patent/FR2836598A1/fr
Application granted granted Critical
Publication of FR2836598B1 publication Critical patent/FR2836598B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
FR0302406A 2002-02-27 2003-02-27 Plaquette de montage pour dispositif imageur a semiconducteur et procede pour y fixer un dispositif imageur a semiconducteur Expired - Fee Related FR2836598B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002051096A JP4477811B2 (ja) 2002-02-27 2002-02-27 固体撮像素子の取付板及びその取付板への取付方法

Publications (2)

Publication Number Publication Date
FR2836598A1 FR2836598A1 (fr) 2003-08-29
FR2836598B1 true FR2836598B1 (fr) 2007-06-15

Family

ID=19192872

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0302406A Expired - Fee Related FR2836598B1 (fr) 2002-02-27 2003-02-27 Plaquette de montage pour dispositif imageur a semiconducteur et procede pour y fixer un dispositif imageur a semiconducteur

Country Status (8)

Country Link
US (1) US7436443B2 (fr)
JP (1) JP4477811B2 (fr)
KR (1) KR100963851B1 (fr)
CN (1) CN100507699C (fr)
DE (1) DE10308524A1 (fr)
FR (1) FR2836598B1 (fr)
GB (1) GB2387483B (fr)
TW (1) TWI290446B (fr)

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* Cited by examiner, † Cited by third party
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JP4225860B2 (ja) * 2003-07-29 2009-02-18 Ｈｏｙａ株式会社 デジタルカメラ
JP4167564B2 (ja) * 2003-07-29 2008-10-15 Ｈｏｙａ株式会社 カメラ
JP2006019343A (ja) * 2004-06-30 2006-01-19 Pentax Corp 固体撮像素子
CN100427357C (zh) * 2005-11-01 2008-10-22 江南造船(集团)有限责任公司 吊舱式电力推进装置安装用多功能工装设备
SE533704C2 (sv) 2008-12-05 2010-12-07 Flatfrog Lab Ab Pekkänslig apparat och förfarande för drivning av densamma
JP4560121B2 (ja) * 2008-12-17 2010-10-13 株式会社東芝 センサー固定装置およびカメラモジュール
US8313608B2 (en) * 2010-09-22 2012-11-20 Exelis, Inc. Method of aligning an imaging device in an optical system
JP5864890B2 (ja) 2011-04-26 2016-02-17 キヤノン株式会社 撮像装置
CN104349079B (zh) * 2013-07-29 2018-07-24 光宝科技股份有限公司 图像感测模块
JP6157993B2 (ja) * 2013-08-27 2017-07-05 東芝メディカルシステムズ株式会社 イメージセンサ固定方法及びイメージセンサ位置決め治具
WO2016122385A1 (fr) 2015-01-28 2016-08-04 Flatfrog Laboratories Ab Trames de quarantaine tactiles dynamiques
US10496227B2 (en) 2015-02-09 2019-12-03 Flatfrog Laboratories Ab Optical touch system comprising means for projecting and detecting light beams above and inside a transmissive panel
CN108369470B (zh) 2015-12-09 2022-02-08 平蛙实验室股份公司 改进的触控笔识别
WO2017138863A1 (fr) * 2016-02-12 2017-08-17 Flatfrog Laboratories Ab Outils d'assemblage pour panneau et système de détection tactile
WO2018096430A1 (fr) 2016-11-24 2018-05-31 Flatfrog Laboratories Ab Optimisation automatique de signal tactile
PT3667475T (pt) 2016-12-07 2022-10-17 Flatfrog Lab Ab Dispositivo tátil curvo
EP3458946B1 (fr) 2017-02-06 2020-10-21 FlatFrog Laboratories AB Couplage optique dans des systèmes de détection tactile
US20180275830A1 (en) 2017-03-22 2018-09-27 Flatfrog Laboratories Ab Object characterisation for touch displays
EP3602259A4 (fr) 2017-03-28 2021-01-20 FlatFrog Laboratories AB Appareil de détection tactile et son procédé d'assemblage
CN111052058B (zh) 2017-09-01 2023-10-20 平蛙实验室股份公司 改进的光学部件
US11567610B2 (en) 2018-03-05 2023-01-31 Flatfrog Laboratories Ab Detection line broadening
US11943563B2 (en) 2019-01-25 2024-03-26 FlatFrog Laboratories, AB Videoconferencing terminal and method of operating the same
EP4104042A1 (fr) 2020-02-10 2022-12-21 FlatFrog Laboratories AB Appareil de détection tactile amélioré
JP2022060038A (ja) * 2020-10-02 2022-04-14 住友電気工業株式会社 光モジュールの製造方法および光モジュール

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Publication number Priority date Publication date Assignee Title
JPS58140156A (ja) 1982-02-16 1983-08-19 Canon Inc 固体撮像装置
JPS59226568A (ja) * 1983-06-08 1984-12-19 Toshiba Corp 固体撮像装置
JPH0380676A (ja) * 1989-08-23 1991-04-05 Ricoh Co Ltd 電子パンフォーカス装置
EP0484076B1 (fr) * 1990-10-29 1996-12-18 Kabushiki Kaisha Toshiba Caméra vidéo pourvue de fonction de zoom et de traitement d'image
JP3181460B2 (ja) * 1994-01-13 2001-07-03 松下電器産業株式会社 テレビカメラの光学系支持装置
US5614763A (en) * 1995-03-13 1997-03-25 Zetetic Institute Methods for improving performance and temperature robustness of optical coupling between solid state light sensors and optical systems
US5731834A (en) 1995-06-07 1998-03-24 Eastman Kodak Company Replaceable CCD array and method of assembly
US5861654A (en) * 1995-11-28 1999-01-19 Eastman Kodak Company Image sensor assembly
EP0790652B1 (fr) * 1995-08-02 2007-02-21 Matsushita Electric Industrial Co., Ltd. Dispositif de prise de vues a semi-conducteurs et fabrication dudit dispositif
JPH1023340A (ja) * 1996-07-05 1998-01-23 Matsushita Electric Works Ltd 固体撮像装置
US5870638A (en) 1996-09-03 1999-02-09 Asahi Kogaku Kogyo Kabushiki Kaisha Camera having two operative modes
US6035147A (en) 1996-09-03 2000-03-07 Asahi Kogaku Kogyo Kabushiki Kaisha CCD mounting structure for exchangeable camera back
JP3776522B2 (ja) * 1996-09-17 2006-05-17 セイコープレシジョン株式会社 測距用受光装置及びその製造方法
JP3364574B2 (ja) * 1997-02-07 2003-01-08 富士写真光機株式会社 内視鏡用撮像装置
US6654064B2 (en) * 1997-05-23 2003-11-25 Canon Kabushiki Kaisha Image pickup device incorporating a position defining member
US6240253B1 (en) * 1998-09-14 2001-05-29 Minolta Co., Ltd. Automatic focusing camera
US6956610B1 (en) * 1999-02-18 2005-10-18 Linvatec Corporation Shock mounting system for CCD camera
US6956615B2 (en) * 2000-01-28 2005-10-18 Pentax Corporation Structure for mounting a solid-state imaging device
JP4169938B2 (ja) * 2000-01-28 2008-10-22 Ｈｏｙａ株式会社 固体撮像素子保持ブロックおよび固体撮像素子取り付け構造
US6784409B2 (en) * 2000-03-28 2004-08-31 Canon Kabushiki Kaisha Electronic device with encapsulant of photo-set resin and production process of same
JP4185236B2 (ja) * 2000-06-19 2008-11-26 イーストマン コダック カンパニー 固体撮像素子および撮像装置
US6433328B1 (en) * 2000-08-07 2002-08-13 Umax Data Systems, Inc. Stray light attenuating device
US6646316B2 (en) * 2001-01-24 2003-11-11 Kingpak Technology, Inc. Package structure of an image sensor and packaging

Also Published As

Publication number Publication date
DE10308524A1 (de) 2003-09-04
JP4477811B2 (ja) 2010-06-09
TWI290446B (en) 2007-11-21
GB2387483B (en) 2005-09-28
US7436443B2 (en) 2008-10-14
CN1441309A (zh) 2003-09-10
FR2836598A1 (fr) 2003-08-29
GB2387483A (en) 2003-10-15
KR20030071518A (ko) 2003-09-03
GB0304536D0 (en) 2003-04-02
TW200405778A (en) 2004-04-01
CN100507699C (zh) 2009-07-01
JP2003258214A (ja) 2003-09-12
KR100963851B1 (ko) 2010-06-16
US20030197786A1 (en) 2003-10-23

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Legal Events

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ST Notification of lapse

Effective date: 20081031