FR2834822B1 - Interface monolithique d'interconnexion pour l'empilage de composants electroniques - Google Patents

Interface monolithique d'interconnexion pour l'empilage de composants electroniques

Info

Publication number
FR2834822B1
FR2834822B1 FR0200282A FR0200282A FR2834822B1 FR 2834822 B1 FR2834822 B1 FR 2834822B1 FR 0200282 A FR0200282 A FR 0200282A FR 0200282 A FR0200282 A FR 0200282A FR 2834822 B1 FR2834822 B1 FR 2834822B1
Authority
FR
France
Prior art keywords
electronic components
interconnect interface
monolithic interconnect
stacking electronic
stacking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0200282A
Other languages
English (en)
Other versions
FR2834822A1 (fr
Inventor
Francis Bourrieres
Clement Kaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novatec SA
Original Assignee
Novatec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novatec SA filed Critical Novatec SA
Priority to FR0200282A priority Critical patent/FR2834822B1/fr
Priority to AU2002361336A priority patent/AU2002361336A1/en
Priority to PCT/FR2002/004009 priority patent/WO2003058719A1/fr
Publication of FR2834822A1 publication Critical patent/FR2834822A1/fr
Application granted granted Critical
Publication of FR2834822B1 publication Critical patent/FR2834822B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
FR0200282A 2002-01-11 2002-01-11 Interface monolithique d'interconnexion pour l'empilage de composants electroniques Expired - Fee Related FR2834822B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0200282A FR2834822B1 (fr) 2002-01-11 2002-01-11 Interface monolithique d'interconnexion pour l'empilage de composants electroniques
AU2002361336A AU2002361336A1 (en) 2002-01-11 2002-11-22 Monolithic interconnection interface for the stacking of electronic components and the production method thereof
PCT/FR2002/004009 WO2003058719A1 (fr) 2002-01-11 2002-11-22 Interface monolithique d'interconnexion pour l'empilage de composants electroniques et procede de realisation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0200282A FR2834822B1 (fr) 2002-01-11 2002-01-11 Interface monolithique d'interconnexion pour l'empilage de composants electroniques

Publications (2)

Publication Number Publication Date
FR2834822A1 FR2834822A1 (fr) 2003-07-18
FR2834822B1 true FR2834822B1 (fr) 2005-01-07

Family

ID=8871236

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0200282A Expired - Fee Related FR2834822B1 (fr) 2002-01-11 2002-01-11 Interface monolithique d'interconnexion pour l'empilage de composants electroniques

Country Status (3)

Country Link
AU (1) AU2002361336A1 (fr)
FR (1) FR2834822B1 (fr)
WO (1) WO2003058719A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104681510A (zh) * 2013-12-03 2015-06-03 晟碟信息科技（上海）有限公司 用于嵌入半导体裸片的桥结构

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09214097A (ja) * 1996-02-06 1997-08-15 Toshiba Corp プリント回路基板
DE19642488A1 (de) * 1996-10-15 1998-04-16 Bernd Klose Verfahren zur Kontaktierung von Mikrochips und zur Herstellung von Mehrlagen-Dünnschichtleiterplatten, insbesondere für superflache Multichip-Modul- und Chipcard-Anwendungen
US6313998B1 (en) * 1999-04-02 2001-11-06 Legacy Electronics, Inc. Circuit board assembly having a three dimensional array of integrated circuit packages
JP3681155B2 (ja) * 1999-12-22 2005-08-10 新光電気工業株式会社 電子部品の実装構造、電子部品装置、電子部品の実装方法及び電子部品装置の製造方法
US6236565B1 (en) * 2000-06-15 2001-05-22 Mark G. Gordon Chip stack with active cooling system

Also Published As

Publication number Publication date
AU2002361336A1 (en) 2003-07-24
WO2003058719A1 (fr) 2003-07-17
WO2003058719B1 (fr) 2004-05-27
FR2834822A1 (fr) 2003-07-18

Similar Documents

Publication Publication Date Title
DE10226373B4 (de) Elektronischer Anschlusskasten
DE60135963D1 (de) Mehrschichtelektronikbauteil
GB2381990B (en) Foldable electronic device
NO20006133D0 (no) Elektronisk halvlederkomponent
GB0101238D0 (en) Electronic chip functioned lock
FR2825527B1 (fr) Accessoire d'angle pour goulotte
DE50206101D1 (de) Induktives bauteil
GB2381955B (en) Electronic circuits
DE60035917D1 (de) Elektronisches Bauteil
FR2822565B1 (fr) Composant electronique securise
DE60226188D1 (de) Elektronisches Filter
DE10083663T1 (de) Mehrschichtiges elektronisches Keramikbauelement
FR2803340B3 (fr) Element de raccord pour structures modulaires
FR2858138B1 (fr) Circuit de protection d'entree pour amplificateur
FR2834822B1 (fr) Interface monolithique d'interconnexion pour l'empilage de composants electroniques
DE60201193D1 (de) Induktives Bauteil
GB0108344D0 (en) Electronic module
DE50201814D1 (de) Elektronischer baustein
DE60041856D1 (de) Elektronisches bauteil
DE60139439D1 (de) LC-integriertes elektronisches Bauteil
FR2844815B3 (fr) Couvercle de surete pour bouches d'egouts
DE60035632D1 (de) Mikrochip Elektronikbauteil
FR2833979B1 (fr) Dispositif broyeur pour wc
FR2847496B1 (fr) Masselotte utilisee pour la fonderie
FR2889550B1 (fr) Element de coffrage perdu et module pour la realisation d'un tel element

Legal Events

Date Code Title Description
CL Concession to grant licenses
ST Notification of lapse

Effective date: 20130930