FR2829627B1 - Agencement de boitier de circuit integre et carte a circuit imprime - Google Patents

Agencement de boitier de circuit integre et carte a circuit imprime

Info

Publication number
FR2829627B1
FR2829627B1 FR0211216A FR0211216A FR2829627B1 FR 2829627 B1 FR2829627 B1 FR 2829627B1 FR 0211216 A FR0211216 A FR 0211216A FR 0211216 A FR0211216 A FR 0211216A FR 2829627 B1 FR2829627 B1 FR 2829627B1
Authority
FR
France
Prior art keywords
box arrangement
circuit board
integrated circuit
printed circuit
circuit box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0211216A
Other languages
English (en)
Other versions
FR2829627A1 (fr
Inventor
Olivier Boireau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sendo International Ltd
Original Assignee
Sendo International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sendo International Ltd filed Critical Sendo International Ltd
Publication of FR2829627A1 publication Critical patent/FR2829627A1/fr
Application granted granted Critical
Publication of FR2829627B1 publication Critical patent/FR2829627B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
FR0211216A 2001-09-11 2002-09-11 Agencement de boitier de circuit integre et carte a circuit imprime Expired - Fee Related FR2829627B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0121891A GB2377080B (en) 2001-09-11 2001-09-11 Integrated circuit package and printed circuit board arrangement

Publications (2)

Publication Number Publication Date
FR2829627A1 FR2829627A1 (fr) 2003-03-14
FR2829627B1 true FR2829627B1 (fr) 2006-03-31

Family

ID=9921847

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0211216A Expired - Fee Related FR2829627B1 (fr) 2001-09-11 2002-09-11 Agencement de boitier de circuit integre et carte a circuit imprime

Country Status (5)

Country Link
US (2) US6734555B2 (fr)
CN (1) CN1407618A (fr)
FR (1) FR2829627B1 (fr)
GB (1) GB2377080B (fr)
HK (1) HK1051742A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7818157B2 (en) * 2002-06-19 2010-10-19 LS1 Corporation Instantaneous voltage drop sensitivity analysis tool (IVDSAT)
US6916995B2 (en) * 2003-02-25 2005-07-12 Broadcom Corporation Optimization of routing layers and board space requirements for ball grid array package implementations including single and multi-layer routing
JP3819901B2 (ja) * 2003-12-25 2006-09-13 松下電器産業株式会社 半導体装置及びそれを用いた電子機器
US7402757B1 (en) 2005-05-19 2008-07-22 Sun Microsystems, Inc. Method, system, and apparatus for reducing transition capacitance
US9466545B1 (en) 2007-02-21 2016-10-11 Amkor Technology, Inc. Semiconductor package in package
US7863724B2 (en) * 2008-02-12 2011-01-04 International Business Machines Corporation Circuit substrate having post-fed die side power supply connections
US7923847B2 (en) * 2008-08-27 2011-04-12 Fairchild Semiconductor Corporation Semiconductor system-in-a-package containing micro-layered lead frame
CN114760756B (zh) * 2022-06-14 2022-09-06 四川明泰微电子有限公司 高频集成封装模块及其封装方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8322432D0 (en) * 1983-08-19 1983-09-21 British Petroleum Co Plc Mineral slurries
US4994902A (en) * 1988-11-30 1991-02-19 Hitachi, Ltd. Semiconductor devices and electronic system incorporating them
JPH02267947A (ja) * 1989-04-07 1990-11-01 Mitsubishi Electric Corp 半導体装置
JPH05160292A (ja) * 1991-06-06 1993-06-25 Toshiba Corp 多層パッケージ
JP3287673B2 (ja) * 1993-11-30 2002-06-04 富士通株式会社 半導体装置
GB2288286A (en) * 1994-03-30 1995-10-11 Plessey Semiconductors Ltd Ball grid array arrangement
JPH09213829A (ja) * 1995-06-06 1997-08-15 Circuit Components Inc Ｂｇａ型ｉ／ｏフォーマットを使用した高性能デジタルｉｃパッケージ及びバイメタル充填バイア技術による単層セラミックス基板
MY123146A (en) * 1996-03-28 2006-05-31 Intel Corp Perimeter matrix ball grid array circuit package with a populated center
US6512680B2 (en) * 1997-09-19 2003-01-28 Canon Kabushiki Kaisha Semiconductor package
US6057600A (en) * 1997-11-27 2000-05-02 Kyocera Corporation Structure for mounting a high-frequency package
DE19754874A1 (de) * 1997-12-10 1999-06-24 Siemens Ag Verfahren zur Umformung eines Substrats mit Randkontakten in ein Ball Grid Array, nach diesem Verfahren hergestelltes Ball Grid Array und flexible Verdrahtung zur Umformung eines Substrats mit Randkontakten in ein Ball Grid Array
JPH11297872A (ja) * 1998-04-13 1999-10-29 Mitsubishi Electric Corp 半導体装置
WO1999060627A1 (fr) * 1998-05-19 1999-11-25 Siemens Aktiengesellschaft Bloc de composants electroniques
JP2000100851A (ja) * 1998-09-25 2000-04-07 Sony Corp 半導体部品及びその製造方法、半導体部品の実装構造及びその実装方法
JP3297387B2 (ja) * 1998-11-20 2002-07-02 沖電気工業株式会社 半導体装置の製造方法
US6927491B1 (en) * 1998-12-04 2005-08-09 Nec Corporation Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
JP3437107B2 (ja) * 1999-01-27 2003-08-18 シャープ株式会社 樹脂封止型半導体装置
US6037677A (en) * 1999-05-28 2000-03-14 International Business Machines Corporation Dual-pitch perimeter flip-chip footprint for high integration asics
JP2001203470A (ja) * 2000-01-21 2001-07-27 Toshiba Corp 配線基板、半導体パッケージ、および半導体装置
US6448639B1 (en) * 2000-09-18 2002-09-10 Advanced Semiconductor Engineering, Inc. Substrate having specific pad distribution
US6403896B1 (en) * 2000-09-27 2002-06-11 Advanced Semiconductor Engineering, Inc. Substrate having specific pad distribution
US6445066B1 (en) * 2001-06-20 2002-09-03 Lsi Logic Corporation Splitting and assigning power planes

Also Published As

Publication number Publication date
GB2377080A8 (en) 2004-01-12
GB2377080B (en) 2003-05-07
GB2377080A (en) 2002-12-31
HK1051742A1 (en) 2003-08-15
CN1407618A (zh) 2003-04-02
US20030047349A1 (en) 2003-03-13
US20040113257A1 (en) 2004-06-17
FR2829627A1 (fr) 2003-03-14
US6900544B2 (en) 2005-05-31
US6734555B2 (en) 2004-05-11
GB0121891D0 (en) 2001-10-31

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20090529