FR2829495B1 - Masse de coulee ayant une stabilite thermique elevee - Google Patents

Masse de coulee ayant une stabilite thermique elevee

Info

Publication number
FR2829495B1
FR2829495B1 FR0211311A FR0211311A FR2829495B1 FR 2829495 B1 FR2829495 B1 FR 2829495B1 FR 0211311 A FR0211311 A FR 0211311A FR 0211311 A FR0211311 A FR 0211311A FR 2829495 B1 FR2829495 B1 FR 2829495B1
Authority
FR
France
Prior art keywords
thermal stability
high thermal
casting mass
casting
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0211311A
Other languages
English (en)
Other versions
FR2829495A1 (fr
Inventor
Irene Jennrich
Richard Spitz
Wolfgang Endres
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2829495A1 publication Critical patent/FR2829495A1/fr
Application granted granted Critical
Publication of FR2829495B1 publication Critical patent/FR2829495B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR0211311A 2001-09-12 2002-09-12 Masse de coulee ayant une stabilite thermique elevee Expired - Fee Related FR2829495B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10144871A DE10144871A1 (de) 2001-09-12 2001-09-12 Vergußmasse mit hoher thermischer Stabilität

Publications (2)

Publication Number Publication Date
FR2829495A1 FR2829495A1 (fr) 2003-03-14
FR2829495B1 true FR2829495B1 (fr) 2006-12-15

Family

ID=7698737

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0211311A Expired - Fee Related FR2829495B1 (fr) 2001-09-12 2002-09-12 Masse de coulee ayant une stabilite thermique elevee

Country Status (4)

Country Link
US (1) US20030114556A1 (fr)
JP (1) JP2003213091A (fr)
DE (1) DE10144871A1 (fr)
FR (1) FR2829495B1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1518889B1 (fr) * 2003-09-29 2008-06-11 Robert Bosch Gmbh Système durcissable de résine réactive
DE102005014958A1 (de) * 2005-03-30 2006-10-05 Sensient Imaging Technologies Gmbh Deckschicht für eletrophotografische Druckwalzen
WO2007132770A1 (fr) 2006-05-12 2007-11-22 Denki Kagaku Kogyo Kabushiki Kaisha Poudre céramique et procédé d'utilisation associé
TWI370525B (en) * 2008-04-25 2012-08-11 Ind Tech Res Inst Encapsulant composition and method for fabricating encapsulant material
WO2010068488A1 (fr) * 2008-11-25 2010-06-17 Lord Corporation Procédés de protection de la surface d’une puce avec des matériaux photodurcissables
US9093448B2 (en) 2008-11-25 2015-07-28 Lord Corporation Methods for protecting a die surface with photocurable materials
GB2466251B (en) * 2008-12-16 2011-03-09 Ind Tech Res Inst Encapsulant compositions and method for fabricating encapsulant materials

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2915686A (en) * 1958-08-28 1959-12-01 Burroughs Corp Diode matrix
NL262934A (fr) * 1960-03-30
JPS5125559A (ja) * 1974-08-28 1976-03-02 Hitachi Ltd Ehokishijushichukeibutsu
JPS5277151A (en) * 1975-12-24 1977-06-29 Hitachi Ltd Process for surface treating of fillers for molding materials
US4732962A (en) * 1987-02-18 1988-03-22 General Motors Corporation High temperature epoxy tooling composition of bisphenol-A epoxy, trifunctional epoxy, anhydride curing agent and an imidazole catalyst
ATE146305T1 (de) * 1989-03-08 1996-12-15 Siemens Ag Tropfenabdeckmassen für elektrische und elektronische bauelemente
JP2570002B2 (ja) * 1991-05-29 1997-01-08 信越化学工業株式会社 フリップチップ用封止材及び半導体装置
DE19523897C2 (de) * 1995-06-30 2002-10-24 Bosch Gmbh Robert Verwendung von Silicon-modifizierten Epoxidharzen als Vergußmassen für elektrotechnische oder elektronische Bauteile
JP3154208B2 (ja) * 1995-10-24 2001-04-09 信越化学工業株式会社 シリコーンゴム組成物
DE69722106T2 (de) * 1996-08-29 2004-04-01 Mitsubishi Denki K.K. Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen
DE19638630B4 (de) * 1996-09-20 2004-11-18 Siemens Ag UV- und thermisch härtbare Gießharzformulierung und ihre Verwendung zum Unterfüllprozeß bei elektrischen und elektronischen Bauelementen
DE19648283A1 (de) * 1996-11-21 1998-05-28 Thera Ges Fuer Patente Polymerisierbare Massen auf der Basis von Epoxiden
SG63803A1 (en) * 1997-01-23 1999-03-30 Toray Industries Epoxy-resin composition to seal semiconductors and resin-sealed semiconductor device
EP0899304B1 (fr) * 1997-08-27 2005-03-16 Huntsman Advanced Materials (Switzerland) GmbH Composition de résines époxydes Hydrophobes
US6498200B1 (en) * 1999-01-12 2002-12-24 Namics Corporation Cationically polymerizable resin composition
JP2000234048A (ja) * 1999-02-15 2000-08-29 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
DE10051051A1 (de) * 2000-10-14 2002-04-18 Bosch Gmbh Robert Silikonmodifizierte Einkomponentenvergußmasse

Also Published As

Publication number Publication date
FR2829495A1 (fr) 2003-03-14
US20030114556A1 (en) 2003-06-19
JP2003213091A (ja) 2003-07-30
DE10144871A1 (de) 2003-03-27

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20150529