FR2827666A1 - Unite de bande d'ailette de dissipation de chaleur unitaire - Google Patents

Unite de bande d'ailette de dissipation de chaleur unitaire Download PDF

Info

Publication number
FR2827666A1
FR2827666A1 FR0208665A FR0208665A FR2827666A1 FR 2827666 A1 FR2827666 A1 FR 2827666A1 FR 0208665 A FR0208665 A FR 0208665A FR 0208665 A FR0208665 A FR 0208665A FR 2827666 A1 FR2827666 A1 FR 2827666A1
Authority
FR
France
Prior art keywords
strip portions
heat dissipation
fin
straight strip
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR0208665A
Other languages
English (en)
French (fr)
Inventor
Jian Roung Cheng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of FR2827666A1 publication Critical patent/FR2827666A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Measuring And Other Instruments (AREA)
FR0208665A 2001-07-18 2002-07-10 Unite de bande d'ailette de dissipation de chaleur unitaire Withdrawn FR2827666A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90117535A TW475052B (en) 2001-07-18 2001-07-18 Heat-dissipating blade device

Publications (1)

Publication Number Publication Date
FR2827666A1 true FR2827666A1 (fr) 2003-01-24

Family

ID=21678796

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0208665A Withdrawn FR2827666A1 (fr) 2001-07-18 2002-07-10 Unite de bande d'ailette de dissipation de chaleur unitaire

Country Status (4)

Country Link
JP (1) JP3550393B2 (ja)
DE (1) DE10226654B4 (ja)
FR (1) FR2827666A1 (ja)
TW (1) TW475052B (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1062197B (it) * 1976-03-18 1983-07-28 Piemontese Radiatori Scambiatore di calore..particolarmente evaporatore o condensatore per impianti di condizionamento di autoveicoli
JP3305460B2 (ja) * 1993-11-24 2002-07-22 昭和電工株式会社 熱交換器
US5603159A (en) * 1994-09-29 1997-02-18 Zexel Corporation Method of producing heat exchangers
JP4117429B2 (ja) * 1999-02-01 2008-07-16 株式会社デンソー 熱交換器用フィン

Also Published As

Publication number Publication date
DE10226654B4 (de) 2004-07-22
JP2003098283A (ja) 2003-04-03
JP3550393B2 (ja) 2004-08-04
DE10226654A1 (de) 2003-02-06
TW475052B (en) 2002-02-01

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Legal Events

Date Code Title Description
ST Notification of lapse