TW475052B - Heat-dissipating blade device - Google Patents

Heat-dissipating blade device Download PDF

Info

Publication number
TW475052B
TW475052B TW90117535A TW90117535A TW475052B TW 475052 B TW475052 B TW 475052B TW 90117535 A TW90117535 A TW 90117535A TW 90117535 A TW90117535 A TW 90117535A TW 475052 B TW475052 B TW 475052B
Authority
TW
Taiwan
Prior art keywords
blade
heat transfer
scope
heat
item
Prior art date
Application number
TW90117535A
Other languages
English (en)
Chinese (zh)
Inventor
Chiun-Yau Jeng
Original Assignee
Chiun-Yau Jeng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chiun-Yau Jeng filed Critical Chiun-Yau Jeng
Priority to TW90117535A priority Critical patent/TW475052B/zh
Application granted granted Critical
Publication of TW475052B publication Critical patent/TW475052B/zh
Priority to JP2002156179A priority patent/JP3550393B2/ja
Priority to DE2002126654 priority patent/DE10226654B4/de
Priority to FR0208665A priority patent/FR2827666A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Measuring And Other Instruments (AREA)
TW90117535A 2001-07-18 2001-07-18 Heat-dissipating blade device TW475052B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW90117535A TW475052B (en) 2001-07-18 2001-07-18 Heat-dissipating blade device
JP2002156179A JP3550393B2 (ja) 2001-07-18 2002-05-29 直線ストリップ部及びｕ字型ストリップ部を有する一体式熱放散フィンストリップユニット
DE2002126654 DE10226654B4 (de) 2001-07-18 2002-06-14 Wärmeableitungsvorrichtung
FR0208665A FR2827666A1 (fr) 2001-07-18 2002-07-10 Unite de bande d'ailette de dissipation de chaleur unitaire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90117535A TW475052B (en) 2001-07-18 2001-07-18 Heat-dissipating blade device

Publications (1)

Publication Number Publication Date
TW475052B true TW475052B (en) 2002-02-01

Family

ID=21678796

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90117535A TW475052B (en) 2001-07-18 2001-07-18 Heat-dissipating blade device

Country Status (4)

Country Link
JP (1) JP3550393B2 (ja)
DE (1) DE10226654B4 (ja)
FR (1) FR2827666A1 (ja)
TW (1) TW475052B (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1062197B (it) * 1976-03-18 1983-07-28 Piemontese Radiatori Scambiatore di calore..particolarmente evaporatore o condensatore per impianti di condizionamento di autoveicoli
JP3305460B2 (ja) * 1993-11-24 2002-07-22 昭和電工株式会社 熱交換器
US5603159A (en) * 1994-09-29 1997-02-18 Zexel Corporation Method of producing heat exchangers
JP4117429B2 (ja) * 1999-02-01 2008-07-16 株式会社デンソー 熱交換器用フィン

Also Published As

Publication number Publication date
DE10226654B4 (de) 2004-07-22
JP2003098283A (ja) 2003-04-03
JP3550393B2 (ja) 2004-08-04
DE10226654A1 (de) 2003-02-06
FR2827666A1 (fr) 2003-01-24

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees