FR2792084A1 - Dispositif de chauffage et de refroidissement integre dans un reacteur de traitement thermique d'un substrat - Google Patents

Dispositif de chauffage et de refroidissement integre dans un reacteur de traitement thermique d'un substrat Download PDF

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Publication number
FR2792084A1
FR2792084A1 FR9904680A FR9904680A FR2792084A1 FR 2792084 A1 FR2792084 A1 FR 2792084A1 FR 9904680 A FR9904680 A FR 9904680A FR 9904680 A FR9904680 A FR 9904680A FR 2792084 A1 FR2792084 A1 FR 2792084A1
Authority
FR
France
Prior art keywords
heating
substrate
plate
cooling device
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR9904680A
Other languages
English (en)
French (fr)
Inventor
Pierre Ducret
Herve Guillon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Joint Industrial Processors for Electronics
Original Assignee
Joint Industrial Processors for Electronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joint Industrial Processors for Electronics filed Critical Joint Industrial Processors for Electronics
Priority to FR9904680A priority Critical patent/FR2792084A1/fr
Priority to JP2000611309A priority patent/JP2002541428A/ja
Priority to PCT/FR2000/000946 priority patent/WO2000062333A1/fr
Priority to KR1020017012943A priority patent/KR20010110737A/ko
Priority to EP00918959A priority patent/EP1173881A1/fr
Publication of FR2792084A1 publication Critical patent/FR2792084A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Furnace Details (AREA)
  • Resistance Heating (AREA)
FR9904680A 1999-04-12 1999-04-12 Dispositif de chauffage et de refroidissement integre dans un reacteur de traitement thermique d'un substrat Withdrawn FR2792084A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR9904680A FR2792084A1 (fr) 1999-04-12 1999-04-12 Dispositif de chauffage et de refroidissement integre dans un reacteur de traitement thermique d'un substrat
JP2000611309A JP2002541428A (ja) 1999-04-12 2000-04-12 基板を熱処理するための反応室に一体化された加熱および冷却装置
PCT/FR2000/000946 WO2000062333A1 (fr) 1999-04-12 2000-04-12 Dispositif de chauffage et de refroidissement integre dans un reacteur de traitement thermique d'un substrat
KR1020017012943A KR20010110737A (ko) 1999-04-12 2000-04-12 기판의 열처리를 위한 반응기에서의 통합된 가열 및 냉각장치
EP00918959A EP1173881A1 (fr) 1999-04-12 2000-04-12 Dispositif de chauffage et de refroidissement integre dans un reacteur de traitement thermique d'un substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9904680A FR2792084A1 (fr) 1999-04-12 1999-04-12 Dispositif de chauffage et de refroidissement integre dans un reacteur de traitement thermique d'un substrat

Publications (1)

Publication Number Publication Date
FR2792084A1 true FR2792084A1 (fr) 2000-10-13

Family

ID=9544396

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9904680A Withdrawn FR2792084A1 (fr) 1999-04-12 1999-04-12 Dispositif de chauffage et de refroidissement integre dans un reacteur de traitement thermique d'un substrat

Country Status (5)

Country Link
EP (1) EP1173881A1 (ja)
JP (1) JP2002541428A (ja)
KR (1) KR20010110737A (ja)
FR (1) FR2792084A1 (ja)
WO (1) WO2000062333A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002082511A2 (en) * 2001-03-19 2002-10-17 Applied Materials, Inc. Pedestal assembly with enhanced thermal conductivity

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002221394A (ja) * 2001-01-24 2002-08-09 Showa Mfg Co Ltd 電子部品の加熱装置
US20030173346A1 (en) * 2002-03-18 2003-09-18 Renken Wayne Glenn System and method for heating and cooling wafer at accelerated rates
US8007591B2 (en) 2004-01-30 2011-08-30 Tokyo Electron Limited Substrate holder having a fluid gap and method of fabricating the substrate holder
TW200612512A (en) 2004-06-28 2006-04-16 Ngk Insulators Ltd Substrate heating sapparatus
KR101289346B1 (ko) * 2006-05-15 2013-07-29 주성엔지니어링(주) 기판 처리 장치
JP2009010005A (ja) * 2007-06-26 2009-01-15 Yac Co Ltd 加熱冷却装置
CN102460650B (zh) 2009-06-24 2014-10-01 佳能安内华股份有限公司 真空加热/冷却装置及磁阻元件的制造方法
KR101398970B1 (ko) * 2012-11-15 2014-05-27 (주)와이에스썸텍 대면적 글라스 히팅 및 냉각 장치
JP7053939B1 (ja) * 2021-12-10 2022-04-12 株式会社オリジン 半田付け装置及び半田付け製品の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0452779A2 (en) * 1990-04-20 1991-10-23 Applied Materials, Inc. Physical vapor deposition clamping mechanism
US5113929A (en) * 1990-04-09 1992-05-19 Anelva Corporation Temperature control system for semiconductor wafer or substrate
JPH05263243A (ja) * 1992-03-16 1993-10-12 Murata Mfg Co Ltd 薄膜形成装置
JPH0745523A (ja) * 1993-07-27 1995-02-14 Nec Corp 減圧室の半導体基板加熱装置
JPH08176827A (ja) * 1994-12-27 1996-07-09 Hitachi Ltd 半導体製造装置
JPH1083960A (ja) * 1996-09-05 1998-03-31 Nec Corp スパッタリング装置
US5775416A (en) * 1995-11-17 1998-07-07 Cvc Products, Inc. Temperature controlled chuck for vacuum processing
GB2330003A (en) * 1997-09-30 1999-04-07 Smc Corp Thermal processing apparatus

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5113929A (en) * 1990-04-09 1992-05-19 Anelva Corporation Temperature control system for semiconductor wafer or substrate
EP0452779A2 (en) * 1990-04-20 1991-10-23 Applied Materials, Inc. Physical vapor deposition clamping mechanism
JPH05263243A (ja) * 1992-03-16 1993-10-12 Murata Mfg Co Ltd 薄膜形成装置
JPH0745523A (ja) * 1993-07-27 1995-02-14 Nec Corp 減圧室の半導体基板加熱装置
JPH08176827A (ja) * 1994-12-27 1996-07-09 Hitachi Ltd 半導体製造装置
US5775416A (en) * 1995-11-17 1998-07-07 Cvc Products, Inc. Temperature controlled chuck for vacuum processing
JPH1083960A (ja) * 1996-09-05 1998-03-31 Nec Corp スパッタリング装置
GB2330003A (en) * 1997-09-30 1999-04-07 Smc Corp Thermal processing apparatus

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 18, no. 40 (C - 1155) 21 January 1994 (1994-01-21) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 5 30 June 1995 (1995-06-30) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 11 29 November 1996 (1996-11-29) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 8 30 June 1998 (1998-06-30) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002082511A2 (en) * 2001-03-19 2002-10-17 Applied Materials, Inc. Pedestal assembly with enhanced thermal conductivity
WO2002082511A3 (en) * 2001-03-19 2003-02-20 Applied Materials Inc Pedestal assembly with enhanced thermal conductivity
US6563686B2 (en) 2001-03-19 2003-05-13 Applied Materials, Inc. Pedestal assembly with enhanced thermal conductivity

Also Published As

Publication number Publication date
WO2000062333A1 (fr) 2000-10-19
EP1173881A1 (fr) 2002-01-23
JP2002541428A (ja) 2002-12-03
KR20010110737A (ko) 2001-12-13

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