FR2771666B1 - Systeme et procede de metrologie in situ - Google Patents

Systeme et procede de metrologie in situ

Info

Publication number
FR2771666B1
FR2771666B1 FR9815143A FR9815143A FR2771666B1 FR 2771666 B1 FR2771666 B1 FR 2771666B1 FR 9815143 A FR9815143 A FR 9815143A FR 9815143 A FR9815143 A FR 9815143A FR 2771666 B1 FR2771666 B1 FR 2771666B1
Authority
FR
France
Prior art keywords
metrology system
situ metrology
situ
metrology
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9815143A
Other languages
English (en)
Other versions
FR2771666A1 (fr
Inventor
Flemming Tinker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zygo Corp
Original Assignee
Zygo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zygo Corp filed Critical Zygo Corp
Publication of FR2771666A1 publication Critical patent/FR2771666A1/fr
Application granted granted Critical
Publication of FR2771666B1 publication Critical patent/FR2771666B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
FR9815143A 1997-12-01 1998-12-01 Systeme et procede de metrologie in situ Expired - Lifetime FR2771666B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/982,236 US6301009B1 (en) 1997-12-01 1997-12-01 In-situ metrology system and method

Publications (2)

Publication Number Publication Date
FR2771666A1 FR2771666A1 (fr) 1999-06-04
FR2771666B1 true FR2771666B1 (fr) 2004-08-06

Family

ID=25528970

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9815143A Expired - Lifetime FR2771666B1 (fr) 1997-12-01 1998-12-01 Systeme et procede de metrologie in situ

Country Status (4)

Country Link
US (1) US6301009B1 (fr)
JP (1) JP4393608B2 (fr)
DE (1) DE19855455B4 (fr)
FR (1) FR2771666B1 (fr)

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GB2373466B (en) * 2001-03-22 2004-05-19 Unova Uk Ltd Method of reducing thermal distortion in grinding machines
JP2002346899A (ja) * 2001-03-23 2002-12-04 Ricoh Co Ltd 曲面加工法及び加工装置
NL1018943C2 (nl) * 2001-09-13 2003-03-14 Tno Werkwijze en inrichting voor het polijsten van een werkstukoppervlak.
NL1022293C2 (nl) * 2002-12-31 2004-07-15 Tno Inrichting en werkwijze voor het vervaardigen of bewerken van optische elementen en/of optische vormelementen, alsmede dergelijke elementen.
US6770494B1 (en) 2003-01-15 2004-08-03 Fairchild Semiconductor Corporation Process of compensating for layer thickness by determining device parameters on different surface areas of a substrate
US7009714B2 (en) * 2003-02-26 2006-03-07 Hitachi High-Technologies Corporation Method of dry etching a sample and dry etching system
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EP1643209B1 (fr) * 2004-09-30 2020-11-04 Ansaldo Energia IP UK Limited Procédé de mesure de l'épaisseur d'une couche
DE102006001496B4 (de) * 2006-01-11 2019-02-21 Siemens Aktiengesellschaft System und Verfahren zur Bestimmung geometrischer Veränderungen eines Werkstücks
JP5122854B2 (ja) * 2007-04-13 2013-01-16 株式会社ディスコ デバイスの研削方法
US7795555B2 (en) 2007-06-08 2010-09-14 Caterpillar Inc Process for determining whether used friction elements may be returned to service
JP4955624B2 (ja) * 2008-07-31 2012-06-20 信越半導体株式会社 両面研磨装置
DE112009001875B4 (de) 2008-07-31 2023-06-22 Shin-Etsu Handotai Co., Ltd. Waferpolierverfahren und Doppelseitenpoliervorrichtung
DE102008049972A1 (de) * 2008-10-01 2010-04-22 Peter Wolters Gmbh Verfahren zum Messen der Dicke von in einer Bearbeitungsmaschine bearbeiteten scheibenförmigen Werkstücken
EP2199021A1 (fr) * 2008-12-22 2010-06-23 Essilor International (Compagnie Générale D'Optique) Procédé et appareil pour la fabrication d'une lentille optique
DE102009010019B4 (de) * 2009-02-21 2012-05-31 Jos. Schneider Optische Werke Gmbh Verfahren zum berührungslosen Messen der Topographie
US9760020B2 (en) 2012-11-21 2017-09-12 Kla-Tencor Corporation In-situ metrology
US9494485B2 (en) 2014-03-07 2016-11-15 Google Inc. Measuring parallelism in lightguide surfaces
KR20170092522A (ko) 2014-09-08 2017-08-11 더 리서치 파운데이션 포 더 스테이트 유니버시티 오브 뉴욕 금속 격자 및 이의 측정 방법
EP3234987B1 (fr) * 2014-12-19 2020-09-23 GlobalWafers Co., Ltd. Systèmes et procédés destinés à effectuer des processus de lissage épitaxial sur des structures semi-conductrices
JP6765887B2 (ja) * 2016-07-21 2020-10-07 スピードファム株式会社 研磨装置
US11415409B1 (en) * 2019-08-22 2022-08-16 Charles S. Powers Apparatuses and methods for measuring parameters of an object
CN114623786B (zh) * 2022-05-16 2022-07-15 成都市鸿侠科技有限责任公司 一种飞行器大型弧形构件表面光洁度检测装置
CN114986325B (zh) * 2022-06-10 2023-09-22 中国工程物理研究院激光聚变研究中心 光学元件全口径抛光局部区域恒温加工装置及抛光机

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JPH08330259A (ja) * 1995-05-30 1996-12-13 Komatsu Electron Metals Co Ltd 半導体ウェハの研磨方法
JP3689175B2 (ja) * 1995-06-08 2005-08-31 オリンパス株式会社 圧電素子の位置決め方法及び位置決め精度確認方法
JPH09123057A (ja) * 1995-10-31 1997-05-13 Sony Corp 基板研磨装置
JPH09131660A (ja) * 1995-11-06 1997-05-20 Toshiba Corp 半導体製造装置及び方法
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Also Published As

Publication number Publication date
FR2771666A1 (fr) 1999-06-04
DE19855455B4 (de) 2013-06-06
JP4393608B2 (ja) 2010-01-06
DE19855455A1 (de) 1999-06-02
JPH11262858A (ja) 1999-09-28
US6301009B1 (en) 2001-10-09

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