FR2717326B1 - Ligne de transmission et procédé de conception associé. - Google Patents

Ligne de transmission et procédé de conception associé.

Info

Publication number
FR2717326B1
FR2717326B1 FR9502771A FR9502771A FR2717326B1 FR 2717326 B1 FR2717326 B1 FR 2717326B1 FR 9502771 A FR9502771 A FR 9502771A FR 9502771 A FR9502771 A FR 9502771A FR 2717326 B1 FR2717326 B1 FR 2717326B1
Authority
FR
France
Prior art keywords
transmission line
design method
associated design
transmission
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9502771A
Other languages
English (en)
Other versions
FR2717326A1 (fr
Inventor
Louis Jay Vannatta
James Patrick Phillips
Eric Leroy Krenz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Mobility LLC
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of FR2717326A1 publication Critical patent/FR2717326A1/fr
Application granted granted Critical
Publication of FR2717326B1 publication Critical patent/FR2717326B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
FR9502771A 1994-03-11 1995-03-09 Ligne de transmission et procédé de conception associé. Expired - Lifetime FR2717326B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/209,336 US5539360A (en) 1994-03-11 1994-03-11 Differential transmission line including a conductor having breaks therein

Publications (2)

Publication Number Publication Date
FR2717326A1 FR2717326A1 (fr) 1995-09-15
FR2717326B1 true FR2717326B1 (fr) 1997-01-10

Family

ID=22778365

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9502771A Expired - Lifetime FR2717326B1 (fr) 1994-03-11 1995-03-09 Ligne de transmission et procédé de conception associé.

Country Status (19)

Country Link
US (1) US5539360A (fr)
JP (1) JP3390010B2 (fr)
KR (1) KR100260694B1 (fr)
CN (1) CN1040268C (fr)
AU (1) AU677899B2 (fr)
BR (1) BR9505653A (fr)
CA (1) CA2160257A1 (fr)
DE (1) DE19580382C1 (fr)
ES (1) ES2120353B1 (fr)
FI (1) FI955064A0 (fr)
FR (1) FR2717326B1 (fr)
GB (1) GB2292017B (fr)
HU (1) HU9503236D0 (fr)
IT (1) IT1277859B1 (fr)
SE (1) SE507144C2 (fr)
SG (1) SG90010A1 (fr)
TW (1) TW263620B (fr)
WO (1) WO1995024743A1 (fr)
ZA (1) ZA951145B (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6141869A (en) 1998-10-26 2000-11-07 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier
JP2000151218A (ja) * 1998-10-29 2000-05-30 Agilent Technol Inc 高周波回路用伝送線路
TW413997B (en) * 1999-04-02 2000-12-01 Hon Hai Prec Ind Co Ltd Flexible printed circuit board (FPC) and method for making the same
US6624729B2 (en) * 2000-12-29 2003-09-23 Hewlett-Packard Development Company, L.P. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
US7049901B2 (en) * 2002-12-10 2006-05-23 Itt Manufacturing Enterprises Inc. Parallel plate wave-guide structure in a layered medium for transmitting complementary signals
US7088201B2 (en) * 2004-08-04 2006-08-08 Eudyna Devices Inc. Three-dimensional quasi-coplanar broadside microwave coupler
KR100713445B1 (ko) * 2005-09-24 2007-04-30 삼성전자주식회사 다수개의 보드로 구성된 휴대 단말기의 보드간 연결 구조
JP4958849B2 (ja) * 2008-06-19 2012-06-20 パナソニック株式会社 差動伝送線路
CN101861050A (zh) * 2009-04-13 2010-10-13 鸿富锦精密工业（深圳）有限公司 软性电路板
EP2391191A1 (fr) * 2010-05-28 2011-11-30 Thales Dispositif d'interconnexion pour circuits électroniques, notamment des circuits électroniques hyperfréquence
US9112550B1 (en) 2014-06-25 2015-08-18 Kandou Labs, SA Multilevel driver for high speed chip-to-chip communications
US10153591B2 (en) * 2016-04-28 2018-12-11 Kandou Labs, S.A. Skew-resistant multi-wire channel
WO2017190102A1 (fr) 2016-04-28 2017-11-02 Kandou Labs, S.A. Circuit d'attaque multiniveau de faible puissance
US10496583B2 (en) 2017-09-07 2019-12-03 Kandou Labs, S.A. Low power multilevel driver for generating wire signals according to summations of a plurality of weighted analog signal components having wire-specific sub-channel weights
CN111106418B (zh) * 2018-10-29 2022-10-14 康普技术有限责任公司 低频及直流信号隔离装置以及天线

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB747703A (en) * 1953-12-22 1956-04-11 Emi Ltd Improvements in or relating to electrical transmission lines
US3634808A (en) * 1969-11-17 1972-01-11 Aerojet General Co Electrical connectors and attachments
DE2444228C3 (de) * 1974-09-16 1978-08-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zur Erhöhung des Wellenwiderstandes von Streifenleitungen
US4441088A (en) * 1981-12-31 1984-04-03 International Business Machines Corporation Stripline cable with reduced crosstalk
US4707671A (en) * 1985-05-31 1987-11-17 Junkosha Co., Ltd. Electrical transmission line
US4891616A (en) * 1988-06-01 1990-01-02 Honeywell Inc. Parallel planar signal transmission system
JP2736107B2 (ja) * 1989-03-14 1998-04-02 株式会社東芝 信号配線基板
GB2229332A (en) * 1989-03-15 1990-09-19 Multitone Electronics Plc Frequency synthesisers
US5084864A (en) * 1990-05-14 1992-01-28 The Boeing Company Broadband, inductively coupled, duplex, rf transmission system
US5304959A (en) * 1992-10-16 1994-04-19 Spectrian, Inc. Planar microstrip balun

Also Published As

Publication number Publication date
GB2292017B (en) 1997-12-17
SG90010A1 (en) 2002-07-23
FI955064A (fi) 1995-10-24
IT1277859B1 (it) 1997-11-12
AU677899B2 (en) 1997-05-08
TW263620B (fr) 1995-11-21
JPH08510624A (ja) 1996-11-05
KR100260694B1 (ko) 2000-07-01
SE9503988D0 (sv) 1995-11-10
CN1040268C (zh) 1998-10-14
GB9522031D0 (en) 1996-01-03
GB2292017A (en) 1996-02-07
CN1124539A (zh) 1996-06-12
AU1735695A (en) 1995-09-25
BR9505653A (pt) 1996-04-09
JP3390010B2 (ja) 2003-03-24
FR2717326A1 (fr) 1995-09-15
ITRM950139A1 (it) 1996-09-08
SE9503988L (sv) 1995-11-10
SE507144C2 (sv) 1998-04-06
DE19580382C1 (de) 1998-03-26
WO1995024743A1 (fr) 1995-09-14
ES2120353A1 (es) 1998-10-16
ZA951145B (en) 1995-10-17
ES2120353B1 (es) 1999-04-16
FI955064A0 (fi) 1995-10-24
CA2160257A1 (fr) 1995-09-14
ITRM950139A0 (it) 1995-03-08
US5539360A (en) 1996-07-23
HU9503236D0 (en) 1996-01-29

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Legal Events

Date Code Title Description
TP Transmission of property

Owner name: MOTOROLA MOBILITY, INC., US

Effective date: 20110912