FR2708780B1 - Matériau de polymère fluoré à faible coefficient thermique de constante diélectrique, pour substrat électrique. - Google Patents
Matériau de polymère fluoré à faible coefficient thermique de constante diélectrique, pour substrat électrique.Info
- Publication number
- FR2708780B1 FR2708780B1 FR9409354A FR9409354A FR2708780B1 FR 2708780 B1 FR2708780 B1 FR 2708780B1 FR 9409354 A FR9409354 A FR 9409354A FR 9409354 A FR9409354 A FR 9409354A FR 2708780 B1 FR2708780 B1 FR 2708780B1
- Authority
- FR
- France
- Prior art keywords
- dielectric constant
- low thermal
- thermal coefficient
- electrical substrate
- fluoropolymer material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/259—Silicic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
- Y10T428/2995—Silane, siloxane or silicone coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/099,245 US5358775A (en) | 1993-07-29 | 1993-07-29 | Fluoropolymeric electrical substrate material exhibiting low thermal coefficient of dielectric constant |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2708780A1 FR2708780A1 (fr) | 1995-02-10 |
FR2708780B1 true FR2708780B1 (fr) | 1996-06-07 |
Family
ID=22273870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9409354A Expired - Fee Related FR2708780B1 (fr) | 1993-07-29 | 1994-07-28 | Matériau de polymère fluoré à faible coefficient thermique de constante diélectrique, pour substrat électrique. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5358775A (fr) |
JP (1) | JP3696269B2 (fr) |
DE (1) | DE4426843B4 (fr) |
FR (1) | FR2708780B1 (fr) |
GB (1) | GB2280443B (fr) |
Families Citing this family (74)
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US5312576B1 (en) * | 1991-05-24 | 2000-04-18 | World Properties Inc | Method for making particulate filled composite film |
DE69532491T2 (de) * | 1994-07-29 | 2004-12-02 | World Properties, Inc., Lincolnwood | Fluorpolymer-Verbundmaterialien mit zwei oder mehreren keramischen Füllern zur unabhängigen Kontrolle über Dimensionsstabilität und Dielektrizitätskonstante |
US6291374B1 (en) | 1994-10-13 | 2001-09-18 | World Properties, Inc. | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
US6071836A (en) * | 1994-10-13 | 2000-06-06 | World Properties, Inc. | Polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof |
US5552210A (en) * | 1994-11-07 | 1996-09-03 | Rogers Corporation | Ceramic filled composite polymeric electrical substrate material exhibiting high dielectric constant and low thermal coefficient of dielectric constant |
US5683928A (en) * | 1994-12-05 | 1997-11-04 | General Electric Company | Method for fabricating a thin film resistor |
US5849396A (en) * | 1995-09-13 | 1998-12-15 | Hughes Electronics Corporation | Multilayer electronic structure and its preparation |
US5889104A (en) * | 1996-01-11 | 1999-03-30 | W. L. Gore & Associates, Inc. | Low dielectric constant material for use as an insulation element in an electronic device |
US5962122A (en) * | 1995-11-28 | 1999-10-05 | Hoechst Celanese Corporation | Liquid crystalline polymer composites having high dielectric constant |
TW341022B (en) * | 1995-11-29 | 1998-09-21 | Nippon Electric Co | Interconnection structures and method of making same |
US5739193A (en) * | 1996-05-07 | 1998-04-14 | Hoechst Celanese Corp. | Polymeric compositions having a temperature-stable dielectric constant |
US5679444A (en) * | 1996-07-15 | 1997-10-21 | International Business Machines Corporation | Method for producing multi-layer circuit board and resulting article of manufacture |
US5774340A (en) * | 1996-08-28 | 1998-06-30 | International Business Machines Corporation | Planar redistribution structure and printed wiring device |
US5783308A (en) * | 1996-10-25 | 1998-07-21 | Quaker State Corporation | Ceramic reinforced fluoropolymer |
WO1998021272A2 (fr) * | 1996-10-29 | 1998-05-22 | Holl Richard A | Fabrication de composite a base de poudre non organique et de polymeres |
US5965273A (en) * | 1997-01-31 | 1999-10-12 | Hoechst Celanese Corporation | Polymeric compositions having a temperature-stable dielectric constant |
US5922453A (en) * | 1997-02-06 | 1999-07-13 | Rogers Corporation | Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates |
WO1998044544A1 (fr) * | 1997-04-03 | 1998-10-08 | W.L. Gore & Associates, Inc. | Matiere a faible constante dielectrique avec rigidite dielectrique amelioree |
US6040226A (en) * | 1997-05-27 | 2000-03-21 | General Electric Company | Method for fabricating a thin film inductor |
EP0922942A1 (fr) | 1997-12-10 | 1999-06-16 | Endress + Hauser GmbH + Co. | Appareil de mesure à micro-ondes de niveau de remplissage avec un diélectrique inséré et processus pour la fabrication du diélectrique |
US6254972B1 (en) | 1999-06-29 | 2001-07-03 | International Business Machines Corporation | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same |
US7538237B2 (en) * | 1999-07-02 | 2009-05-26 | Kreido Laboratories | Process for high shear gas-liquid reactions |
US6471392B1 (en) | 2001-03-07 | 2002-10-29 | Holl Technologies Company | Methods and apparatus for materials processing |
US6742774B2 (en) * | 1999-07-02 | 2004-06-01 | Holl Technologies Company | Process for high shear gas-liquid reactions |
US6652805B2 (en) * | 1999-07-02 | 2003-11-25 | Holl Technologies Company | Highly filled composites of powdered fillers and polymer matrix |
US6391082B1 (en) | 1999-07-02 | 2002-05-21 | Holl Technologies Company | Composites of powdered fillers and polymer matrix |
DE19939483A1 (de) * | 1999-08-20 | 2001-03-08 | Philips Corp Intellectual Pty | Passives Bauelement mit Verbundwerkstoff |
US6803402B2 (en) * | 1999-11-04 | 2004-10-12 | Daikin Industries, Ltd. | Elastomer molded article and crosslinkable fluorine-containing elastomer composition for semi-conductor production apparatuses |
DE10024469C2 (de) * | 2000-05-18 | 2002-06-20 | Schott Auer Gmbh | Reflektor für einen Hochdruck-Gasentladungs-Leuchtkörper |
AU2001274857A1 (en) | 2000-05-18 | 2001-12-03 | Georgia Tech Research Corporation | High dielectric constant nano-structure polymer-ceramic composite |
SG103294A1 (en) * | 2000-06-29 | 2004-04-29 | Ibm | Polymer and ceramic composite electronic substrate |
US6528145B1 (en) | 2000-06-29 | 2003-03-04 | International Business Machines Corporation | Polymer and ceramic composite electronic substrates |
JP3664094B2 (ja) * | 2000-10-18 | 2005-06-22 | 株式会社村田製作所 | 複合誘電体成形物、その製造方法、およびそれを用いたレンズアンテナ |
US6830806B2 (en) * | 2001-04-12 | 2004-12-14 | Kreido Laboratories | Methods of manufacture of electric circuit substrates and components having multiple electric characteristics and substrates and components so manufactured |
JP2002344100A (ja) * | 2001-05-21 | 2002-11-29 | Sumitomo Electric Ind Ltd | 基板用誘電体材料及びその製造方法 |
WO2003022415A2 (fr) * | 2001-09-13 | 2003-03-20 | Holl Technologies Company | Procedes et appareils d'echange d'energie thermique entre la surface d'un corps et un fluide d'echange thermique |
US6787246B2 (en) | 2001-10-05 | 2004-09-07 | Kreido Laboratories | Manufacture of flat surfaced composites comprising powdered fillers in a polymer matrix |
DE10150755C1 (de) | 2001-10-13 | 2003-02-27 | Schott Glas | Reflektor ohne Belüftungsöffnungen, Verfahren zur Herstellung desselben und Verwendung des Reflektors |
US6416625B1 (en) | 2001-11-16 | 2002-07-09 | Industrial Technology Research Institute | Manufacturing method of fluoro based composite boards |
US7109818B2 (en) * | 2001-12-14 | 2006-09-19 | Midwest Research Institute | Tunable circuit for tunable capacitor devices |
US7098360B2 (en) * | 2002-07-16 | 2006-08-29 | Kreido Laboratories | Processes employing multiple successive chemical reaction process steps and apparatus therefore |
US6617690B1 (en) * | 2002-08-14 | 2003-09-09 | Ibm Corporation | Interconnect structures containing stress adjustment cap layer |
AU2003268487A1 (en) * | 2002-09-05 | 2004-03-29 | Nanosys, Inc. | Nanocomposites |
CN100402412C (zh) * | 2002-09-11 | 2008-07-16 | 克雷多实验室 | 材料的高剪切混合和反应方法及装置 |
AU2003288916A1 (en) * | 2002-10-03 | 2004-04-23 | Kredo Laboratories | Apparatus for transfer of heat energy between a body surface and heat transfer fluid |
US7279777B2 (en) * | 2003-05-08 | 2007-10-09 | 3M Innovative Properties Company | Organic polymers, laminates, and capacitors |
US7098525B2 (en) * | 2003-05-08 | 2006-08-29 | 3M Innovative Properties Company | Organic polymers, electronic devices, and methods |
US6986947B2 (en) * | 2003-10-09 | 2006-01-17 | 3M Innovative Properties Company | Method of modifying a fluoropolymer and articles thereby |
ATE410472T1 (de) * | 2004-12-23 | 2008-10-15 | Solvay Solexis Inc | Thermoplastische halogenierte polymerzusammensetzung |
US7421892B2 (en) * | 2005-03-29 | 2008-09-09 | Baker Hughes Incorporated | Method and apparatus for estimating a property of a downhole fluid using a coated resonator |
US20060246294A1 (en) * | 2005-04-27 | 2006-11-02 | Landi Vincent R | Circuit materials, circuits, and methods of manufacture thereof |
WO2009108874A2 (fr) * | 2008-02-27 | 2009-09-03 | Solar Roofing Systems, Inc. | Procédé de fabrication de tuiles photovoltaïques et tuiles photovoltaïques |
US7892633B2 (en) * | 2005-08-17 | 2011-02-22 | Innegrity, Llc | Low dielectric composite materials including high modulus polyolefin fibers |
US8057887B2 (en) * | 2005-08-17 | 2011-11-15 | Rampart Fibers, LLC | Composite materials including high modulus polyolefin fibers |
US7648607B2 (en) * | 2005-08-17 | 2010-01-19 | Innegrity, Llc | Methods of forming composite materials including high modulus polyolefin fibers |
US7407415B2 (en) * | 2006-06-07 | 2008-08-05 | International Business Machines Corporation | Crosstalk reduction in dual inline memory module (DIMM) connectors |
JP4907281B2 (ja) * | 2006-09-26 | 2012-03-28 | 日東電工株式会社 | フレキシブル配線回路基板 |
US20090054553A1 (en) * | 2007-08-20 | 2009-02-26 | General Electric Company | High dielectric constant thermoplastic composition, methods of manufacture thereof and articles comprising the same |
CN102100130B (zh) | 2008-07-18 | 2014-02-26 | 环球产权公司 | 电路材料、电路层合体及其制造方法 |
CN102804439B (zh) | 2009-05-25 | 2015-05-27 | 巴斯夫欧洲公司 | 可交联的电介质及其制备方法和用途 |
US9455064B2 (en) * | 2012-12-12 | 2016-09-27 | Centre for Materials for Electronics Technology (C-MET) | Ceramic filled fluoropolymer compositions, methods and applications thereof |
WO2015013129A1 (fr) | 2013-07-23 | 2015-01-29 | Rogers Corporation | Matériaux de circuit, stratifiés de circuit et procédés de fabrication de ces derniers |
US9505902B2 (en) * | 2014-03-28 | 2016-11-29 | Secretary, Department Of Electronics And Information Technology, Govt Of India | Ceramic filler, method of preparing the ceramic filler and applications as resonator and laminate thereof |
TW201538532A (zh) | 2014-04-10 | 2015-10-16 | Rogers Corp | 交聯的氟聚合物電路材料、電路層板及其製造方法 |
CN107835830B (zh) * | 2015-07-17 | 2021-09-28 | 大金工业株式会社 | 膜 |
KR102653211B1 (ko) * | 2016-07-13 | 2024-04-01 | 삼성전기주식회사 | 필름 커패시터 |
JP6997104B2 (ja) | 2017-08-08 | 2022-01-17 | 住友電気工業株式会社 | 高周波プリント配線板用基材 |
CN107746272B (zh) * | 2017-08-16 | 2020-12-04 | 电子科技大学 | 微波介质陶瓷、聚四氟乙烯-陶瓷复合基板及制备方法 |
TWI701685B (zh) | 2018-08-10 | 2020-08-11 | 台燿科技股份有限公司 | 介電複合物及其應用 |
CN109456051A (zh) * | 2018-11-28 | 2019-03-12 | 电子科技大学 | 一种聚四氟乙烯基陶瓷复合材料的制备方法 |
CN110591255B (zh) * | 2019-08-13 | 2021-06-15 | 瑞声科技(南京)有限公司 | 基板材料、基板材料制备方法及相关基板 |
CN115703913B (zh) * | 2021-08-17 | 2023-09-12 | 广东生益科技股份有限公司 | 一种含氟树脂组合物及其用途 |
KR20230068722A (ko) * | 2021-11-11 | 2023-05-18 | 삼성전기주식회사 | 복합 전자부품 |
CN116239851B (zh) * | 2023-05-11 | 2023-09-15 | 山东华夏神舟新材料有限公司 | 氟树脂组合物、氟树脂组合物膜制品及其制备方法与应用 |
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US4335180A (en) * | 1978-12-26 | 1982-06-15 | Rogers Corporation | Microwave circuit boards |
JPS56153606A (en) * | 1980-04-28 | 1981-11-27 | Kureha Chemical Ind Co Ltd | High molecular dielectric material |
US4855266A (en) * | 1987-01-13 | 1989-08-08 | E. I. Du Pont De Nemours And Company | High K dielectric composition for use in multilayer ceramic capacitors having copper internal electrodes |
US5061548A (en) * | 1987-02-17 | 1991-10-29 | Rogers Corporation | Ceramic filled fluoropolymeric composite material |
US5194326A (en) * | 1987-02-17 | 1993-03-16 | Rogers Corporation | Ceramic filled fluoropolymeric composite material |
US4849284A (en) * | 1987-02-17 | 1989-07-18 | Rogers Corporation | Electrical substrate material |
US5198295A (en) * | 1987-02-17 | 1993-03-30 | Rogers Corporation | Ceramic filled fluoropolymeric composite material |
US5149590A (en) * | 1987-02-17 | 1992-09-22 | Rogers Corporation | Electrical substrate material |
US4870377A (en) * | 1987-11-27 | 1989-09-26 | General Electric Company | Electronic circuit substrate construction |
JPH02210710A (ja) * | 1989-02-10 | 1990-08-22 | Junkosha Co Ltd | 耐湿性誘電体材料 |
US4985296A (en) * | 1989-03-16 | 1991-01-15 | W. L. Gore & Associates, Inc. | Polytetrafluoroethylene film |
US4996097A (en) * | 1989-03-16 | 1991-02-26 | W. L. Gore & Associates, Inc. | High capacitance laminates |
-
1993
- 1993-07-29 US US08/099,245 patent/US5358775A/en not_active Expired - Lifetime
-
1994
- 1994-07-18 GB GB9414492A patent/GB2280443B/en not_active Expired - Lifetime
- 1994-07-28 FR FR9409354A patent/FR2708780B1/fr not_active Expired - Fee Related
- 1994-07-28 DE DE4426843A patent/DE4426843B4/de not_active Expired - Lifetime
- 1994-07-29 JP JP17883994A patent/JP3696269B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3696269B2 (ja) | 2005-09-14 |
GB9414492D0 (en) | 1994-09-07 |
FR2708780A1 (fr) | 1995-02-10 |
JPH0779056A (ja) | 1995-03-20 |
DE4426843B4 (de) | 2004-04-15 |
DE4426843A1 (de) | 1995-02-02 |
GB2280443B (en) | 1997-08-20 |
GB2280443A (en) | 1995-02-01 |
US5358775A (en) | 1994-10-25 |
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