FR2686475B1 - - Google Patents
Info
- Publication number
- FR2686475B1 FR2686475B1 FR9300609A FR9300609A FR2686475B1 FR 2686475 B1 FR2686475 B1 FR 2686475B1 FR 9300609 A FR9300609 A FR 9300609A FR 9300609 A FR9300609 A FR 9300609A FR 2686475 B1 FR2686475 B1 FR 2686475B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Laser Beam Processing (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82312692A | 1992-01-21 | 1992-01-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2686475A1 FR2686475A1 (fr) | 1993-07-23 |
FR2686475B1 true FR2686475B1 (de) | 1995-01-20 |
Family
ID=25237866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9300609A Granted FR2686475A1 (fr) | 1992-01-21 | 1993-01-21 | Composant electrique forme par laser et procede de fabrication. |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH07118419B2 (de) |
CA (1) | CA2086138C (de) |
DE (1) | DE4301570B4 (de) |
FR (1) | FR2686475A1 (de) |
GB (1) | GB2263582B (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5302932A (en) * | 1992-05-12 | 1994-04-12 | Dale Electronics, Inc. | Monolythic multilayer chip inductor and method for making same |
DE4401612A1 (de) * | 1994-01-20 | 1995-07-27 | Resma Gmbh | Verfahren und Vorrichtung zur Erzeugung elektrisch leitender Bereiche auf Metallverbindungen enthaltenden isolierenden Keramikwerkstücken |
GB2290171B (en) * | 1994-06-03 | 1998-01-21 | Plessey Semiconductors Ltd | Inductor chip device |
DE19603971A1 (de) * | 1996-01-26 | 1997-07-31 | Emi Tec Elektronische Material | Verfahren zur Herstellung einer Dateneingabevorrichtung |
DE19731969A1 (de) * | 1997-07-24 | 1998-08-27 | Siemens Ag | Verfahren zum Herstellen eines elektrischen Bauteils |
US5922514A (en) | 1997-09-17 | 1999-07-13 | Dale Electronics, Inc. | Thick film low value high frequency inductor, and method of making the same |
DE19817852B4 (de) * | 1998-04-22 | 2009-04-16 | Theodor Dr. Doll | Nutzenfertigung von Induktivitäten mit Mikrotechniken |
GB2348321A (en) * | 1999-03-23 | 2000-09-27 | Mitel Semiconductor Ltd | A laminated transformer and a method of its manufacture |
JP2003534657A (ja) | 2000-05-19 | 2003-11-18 | フィリップ エイ. ハーディング | スロット付きコア変圧器およびインダクタ |
TWI258154B (en) * | 2000-09-22 | 2006-07-11 | Flex Multi Fineline Electronix | Electronic transformer/inductor devices and methods for making same |
US7135952B2 (en) | 2002-09-16 | 2006-11-14 | Multi-Fineline Electronix, Inc. | Electronic transformer/inductor devices and methods for making same |
CA2589485A1 (en) | 2004-12-07 | 2006-06-15 | Ronald W. Whittaker | Miniature circuitry and inductive components and methods for manufacturing same |
US7436282B2 (en) | 2004-12-07 | 2008-10-14 | Multi-Fineline Electronix, Inc. | Miniature circuitry and inductive components and methods for manufacturing same |
US7645941B2 (en) | 2006-05-02 | 2010-01-12 | Multi-Fineline Electronix, Inc. | Shielded flexible circuits and methods for manufacturing same |
DE102010052401A1 (de) | 2010-11-24 | 2012-05-24 | Giesecke & Devrient Gmbh | Leiterbahnanordnung für tragbare Datenträger |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB993265A (en) * | 1962-04-10 | 1965-05-26 | Tokyo Denshi Seiki Kabushiki K | Electrical coils |
US3588439A (en) * | 1967-05-12 | 1971-06-28 | Rca Corp | High resolution laser engraving apparatus |
GB1239777A (en) * | 1968-10-03 | 1971-07-21 | Nat Res Dev | Improvements in shaping workpieces |
US3848210A (en) * | 1972-12-11 | 1974-11-12 | Vanguard Electronics | Miniature inductor |
DE2518279A1 (de) * | 1975-04-24 | 1976-11-04 | Siemens Ag | Verfahren zur herstellung eines induktiven bauelements |
JPS5853805A (ja) * | 1981-09-25 | 1983-03-30 | Matsushita Electric Ind Co Ltd | インダクタンス調整方法およびインダクタ |
DE3245272A1 (de) * | 1982-12-07 | 1984-06-07 | Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut | Verfahren zur herstellung miniaturisierter dick- und duennschichtschaltungen |
JPS6373606A (ja) * | 1986-09-17 | 1988-04-04 | Fujitsu Ltd | 厚膜インダクタの製造方法 |
DE3843230C1 (en) * | 1988-12-22 | 1989-09-21 | W.C. Heraeus Gmbh, 6450 Hanau, De | Process for making a metallic pattern on a base, in particular for the laser structuring of conductor tracks |
US4909895A (en) * | 1989-04-11 | 1990-03-20 | Pacific Bell | System and method for providing a conductive circuit pattern utilizing thermal oxidation |
US5018164A (en) * | 1989-09-12 | 1991-05-21 | Hughes Aircraft Company | Excimer laser ablation method and apparatus for microcircuit fabrication |
JPH03142091A (ja) * | 1989-10-26 | 1991-06-17 | Mitsubishi Electric Corp | 銅張りポリイミドフイルムなどのレーザ加工方法 |
-
1992
- 1992-12-15 GB GB9226085A patent/GB2263582B/en not_active Expired - Fee Related
- 1992-12-23 CA CA002086138A patent/CA2086138C/en not_active Expired - Fee Related
-
1993
- 1993-01-06 JP JP5016754A patent/JPH07118419B2/ja not_active Expired - Fee Related
- 1993-01-21 FR FR9300609A patent/FR2686475A1/fr active Granted
- 1993-01-21 DE DE4301570A patent/DE4301570B4/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2263582B (en) | 1995-11-01 |
FR2686475A1 (fr) | 1993-07-23 |
DE4301570B4 (de) | 2004-03-25 |
GB9226085D0 (en) | 1993-02-10 |
JPH0620842A (ja) | 1994-01-28 |
DE4301570A1 (de) | 1993-07-22 |
JPH07118419B2 (ja) | 1995-12-18 |
CA2086138A1 (en) | 1993-07-22 |
GB2263582A (en) | 1993-07-28 |
CA2086138C (en) | 1999-09-14 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20091030 |